This application relates to a filtering mechanism and a device for producing a conductive material, where the filtering mechanism includes a filtering body, a cover, and a supporting member. The filtering body includes an accommodating cavity for accommodating an electroplating material and an opening provided on the filtering body; the cover is configured to cover the opening and connect to the filtering body to enclose the electroplating material in the filtering body; and the supporting member is provided on the cover to enhance connection strength between the cover and the filtering body.

A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

Exemplary methods of semiconductor processing may include performing an electroplating operation on a semiconductor substrate in an electroplating bath within a vessel of an electroplating system. The methods may include removing the semiconductor substrate from the electroplating bath. The methods may include closing a valve associated with a first drain from the electroplating system. The methods may include increasing flow to a second drain from the electroplating system. The second drain may be associated with a drain channel from the vessel of the electroplating system.

Exemplary methods of semiconductor processing may include performing an electroplating operation on a semiconductor substrate in an electroplating bath within a vessel of an electroplating system. The methods may include removing the semiconductor substrate from the electroplating bath. The methods may include closing a valve associated with a first drain from the electroplating system. The methods may include increasing flow to a second drain from the electroplating system. The second drain may be associated with a drain channel from the vessel of the electroplating system.

A method of electroplating a target electrode comprises establishing a first electric current through an electrolytic solution, comprising a quantity of an electrically charged material, an initial electrode, and a transitional electrode, so that a quantity of the electrically charged material is converted to a quantity of an electrically neutral material, which is electroplated, as a deposit, onto the transitional electrode; and establishing a second electric current through the electrolytic solution, the transitional electrode, and the target electrode so that a quantity of the electrically neutral material from the deposit is converted to a quantity of the electrically charged material, which is dissolved into the electrolytic solution, and a quantity of the electrically charged material in the electrolytic solution is converted to a quantity of the electrically neutral material, which is electroplated onto the surface of the target electrode.

An electroplating device and an electroplating method, the electroplating device includes an electroplating unit for electroplating a production panel. The electroplating unit includes an electrolyte channel for jetting an electrolyte toward the production panel, and an electroplating assembly disposed on an outer surface of the electrolyte channel. The electroplating assembly includes an anode disposed on the outer surface of the electrolyte channel, and a suction channel in the anode which is used for absorbing the electrolyte in a direction opposite to a jet-plating direction. The electrolyte may be uniformly distributed on the production panel by the combination of the electrolyte channel and the electroplating assembly.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

EL The present invention provides a system for electrodepositing a plurality of electrolytes onto a substrate in a single deposition chamber to form an article, in which the system comprises a removable substrate; a deposition chamber containing the substrate in which the chamber has an inlet and an outlet and in which the chamber comprises at least one anode with connection to a source of electrical current; a plurality of electrolyte reservoirs for an electrolyte solution connected to the deposition chamber through the inlet; and a rinse medium reservoir connected to the deposition chamber through the inlet. Also provided is a system comprising a cradle to form an article, methods using the systems of the invention, and composite materials and devices prepared by the methods of the invention.

EL The present invention provides a system for electrodepositing a plurality of electrolytes onto a substrate in a single deposition chamber to form an article, in which the system comprises a removable substrate; a deposition chamber containing the substrate in which the chamber has an inlet and an outlet and in which the chamber comprises at least one anode with connection to a source of electrical current; a plurality of electrolyte reservoirs for an electrolyte solution connected to the deposition chamber through the inlet; and a rinse medium reservoir connected to the deposition chamber through the inlet. Also provided is a system comprising a cradle to form an article, methods using the systems of the invention, and composite materials and devices prepared by the methods of the invention.