There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

The purpose of the present invention is to provide a zinc-nickel-silica composite plating bath that has been improved in terms of: covering power for articles having a complex shape; and corrosion resistance of a low current density portion where the film thickness is small. The present invention pertains to a zinc-nickel-silica composite plating bath, the plating bath having a pH of 3.5 to 6.9, and containing zinc ions, nickel ions, colloidal silica, and chloride ions. The colloidal silica is a cationic colloidal silica having on the surface thereon at least one species of metal cation selected from the group consisting of trivalent to heptavalent metal cations.

There is provided an apparatus for plating a substrate as an object to be plated. The apparatus comprises an anode and a thief tunnel arranged to be located between the substrate and the anode when the substrate is placed to be opposed to the anode. The thief tunnel comprises a body placed away from the substrate and provided with an opening; a plurality of auxiliary electrodes provided in or to the body; and an ion exchange membrane configured to protect the auxiliary electrodes from a plating solution. The plurality of auxiliary electrodes are arranged along a circumference of the opening. At least one of the auxiliary electrodes is configured such that a voltage to be applied to the at least one of the auxiliary electrodes is controlled independently of a voltage to be applied to one or more auxiliary electrodes other than the at least one of the auxiliary electrodes.

There is provided an apparatus for plating a substrate as an object to be plated. The apparatus comprises an anode and a thief tunnel arranged to be located between the substrate and the anode when the substrate is placed to be opposed to the anode. The thief tunnel comprises a body placed away from the substrate and provided with an opening; a plurality of auxiliary electrodes provided in or to the body; and an ion exchange membrane configured to protect the auxiliary electrodes from a plating solution. The plurality of auxiliary electrodes are arranged along a circumference of the opening. At least one of the auxiliary electrodes is configured such that a voltage to be applied to the at least one of the auxiliary electrodes is controlled independently of a voltage to be applied to one or more auxiliary electrodes other than the at least one of the auxiliary electrodes.

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

The present invention relates to a method for forming a multidimensional structure, comprising: providing an electrode and a substrate in a fluid, wherein the fluid comprises an electrolyte and a precursor agent dispersed therein; applying an electric potential difference between the substrate and the electrode to reduce or oxidise the precursor agent, thereby depositing a solid material; measuring current between the substrate and the electrode; and moving the electrode within the fluid to form a multidimensional structure of the solid material. Also provided is a device for forming a multidimensional structure.

The present invention relates to a method for forming a multidimensional structure, comprising: providing an electrode and a substrate in a fluid, wherein the fluid comprises an electrolyte and a precursor agent dispersed therein; applying an electric potential difference between the substrate and the electrode to reduce or oxidise the precursor agent, thereby depositing a solid material; measuring current between the substrate and the electrode; and moving the electrode within the fluid to form a multidimensional structure of the solid material. Also provided is a device for forming a multidimensional structure.