Electroplating apparatus includes an electroplating tank that stores an electrolyte solution in which at least objects to be electroplated and magnetic media sink, and at least one magnetic rotator rotatably arranged under the electroplating tank so as to generate an alternating magnetic field. The magnetic rotator is arranged to section an internal space of the electroplating tank into a first space occupying a space above the magnetic rotator and a second space occupying a remaining space other than the first space. The magnetic rotator is arranged to be movable in a lateral direction intersecting a rotational axis of the magnetic rotator, allowing the objects to be shifted between a condition of being present in the electrolyte solution and in the first space and a condition of being present in the electrolyte solution and in the second space.

A metal plating apparatus for plating metal with zinc is provided with a rotating device and a plurality of stirring devices. The rotating device has a driving assembly and a rotating assembly. The driving assembly has a driving gear. The rotating assembly is connected with and controlled by the driving assembly. The rotating assembly has a sustaining pillar. A rotating seat is mounted on the sustaining pillar and engaged with the driving gear. The stirring devices is mounted on the rotating seat radially and spaced from each other. The metal plating apparatus improves productivity through an automatic process which shifts locations of the stirring devices by the rotating device and plates metal with a cooperation of peripheral supporting apparatus, and improves working efficiency through decreasing occupied space and the number of operating personnel.

A method includes: agitating base members that has been immersed in an electrolytic solution inside of an electroplating tank so as to flow in a circumference direction along an inner wall of the electroplating tank; and electroplating the base members flowing along the circumference direction in the electrolytic solution inside of the electroplating tank. The flow of the base members along the circumference direction is caused by a flow of magnetic media along the circumference direction in the electrolytic solution inside of the electroplating tank or is caused by rotation of an agitation unit provided at a bottom side of the electroplating tank. At least one of the base members touches a bottom cathode, and a base member positioned upward relative to the base member touching the bottom cathode is electrically connected to the bottom cathode via at least the base member touching the bottom cathode.

Methods for providing laminated coatings on metal articles using electroplating methods such as barrel plating, vibratory plating, rocker plating or other non-rack methods that involve movement of articles to be plated in a containment apparatus, as well as articles made from such processes. Embodiments of such processes involve mass-transfer modulation to provide compositionally modulated coatings.

Methods for providing laminated coatings on metal articles using electroplating methods such as barrel plating, vibratory plating, rocker plating or other non-rack methods that involve movement of articles to be plated in a containment apparatus, as well as articles made from such processes. Embodiments of such processes involve mass-transfer modulation to provide compositionally modulated coatings.

Systems for masking and sealing a component for surface treatment. A system includes a pair of fixture plates disposed on opposite ends of the component from each other. One or more inner sleeves are inserted into the component to mask and seal at least a portion of the component. An outer sleeve extends between the fixture plates to seal outside of the component. A pair of fixture rods extend between the first and second fixture plates and couple the first and second fixture plates together. The system is configured to effect surface treatment of an exposed area of the component, at least a portion of the exposed area defined by and disposed adjacent to the one or more inner sleeves.

Systems for masking and sealing a component for surface treatment. A system includes a pair of fixture plates disposed on opposite ends of the component from each other. One or more inner sleeves are inserted into the component to mask and seal at least a portion of the component. An outer sleeve extends between the fixture plates to seal outside of the component. A pair of fixture rods extend between the first and second fixture plates and couple the first and second fixture plates together. The system is configured to effect surface treatment of an exposed area of the component, at least a portion of the exposed area defined by and disposed adjacent to the one or more inner sleeves.

Systems for masking and sealing a component for surface treatment. A system includes a pair of fixture plates disposed on opposite ends of the component from each other. One or more inner sleeves are inserted into the component to mask and seal at least a portion of the component. An outer sleeve extends between the fixture plates to seal outside of the component. A pair of fixture rods extend between the first and second fixture plates and couple the first and second fixture plates together. The system is configured to effect surface treatment of an exposed area of the component, at least a portion of the exposed area defined by and disposed adjacent to the one or more inner sleeves.

Systems for masking and sealing a component for surface treatment. A system includes a pair of fixture plates disposed on opposite ends of the component from each other. One or more inner sleeves are inserted into the component to mask and seal at least a portion of the component. An outer sleeve extends between the fixture plates to seal outside of the component. A pair of fixture rods extend between the first and second fixture plates and couple the first and second fixture plates together. The system is configured to effect surface treatment of an exposed area of the component, at least a portion of the exposed area defined by and disposed adjacent to the one or more inner sleeves.

An electroplated article includes a base member that includes one or more base member-metallic elements; and an electroplated layer that is formed directly on the base member. The electroplated layer includes at least a first electroplated layer-metallic element and a second electroplated layer-metallic element that is different from the first electroplated layer-metallic element. The second electroplated layer-metallic element is a metallic element that is identical to at least one of the one or more base member-metallic elements. A ratio of the second electroplated layer-metallic element in the electroplated layer is continuously decreased as being away from the base member in the thickness direction of the electroplated layer. Alloy grains including at least the first and second electroplated layer-metallic elements are distributed in the electroplated layer such that a clear interface is not formed between the base member and the electroplated layer.