C25D3/12

COPPER ALLOY SHEET, COPPER ALLOY SHEET WITH PLATING FILM, AND METHOD FOR PRODUCING SAME

Providing a copper alloy plate, in which center Mg concentration at a center part in a plate thickness direction 0.1 mass % or more and less than 0.3 mass %, center P concentration is 0.001 mass % or more and 0.2 mass % or less, and the balance is composed of Cu and inevitable impurities; in which surface Mg concentration at a surface is 70% or less of the center Mg concentration; in which a surface layer part defined by a prescribed thickness from the surface has a concentration gradient of Mg of 0.05 mass %/m or more and 5 mass %/m or less increasing from surface toward center part of the plate thickness direction; and in which restraint of color change of the surface and increase of electrical contact resistance, and adhesiveness of a plating film are excellent due to maximum Mg concentration in the surface layer part is 90% of the center Mg concentration.

Method and apparatus for mass production of AR diffractive waveguides

A method and apparatus for mass production of AR diffractive waveguides. Low-cost mass production of large-area AR diffractive waveguides (slanted surface-relief gratings) of any shape. Uses two-photon polymerization micro-nano 3D printing to realize manufacturing of slanted grating large-area masters of any shape (thereby solving the problem about manufacturing of slanted grating masters of any shape on the one hand, realizing direct manufacturing of large-size wafer-level masters on the other hand, and also having the advantages of low manufacturing cost and high production efficiency). Composite nanoimprint lithography technology is employed (in combination with the peculiar imprint technique and the composite soft mold suitable for slanted gratings) to solve the problem that a large-slanting-angle large-slot-depth slanted grating cannot be demolded and thus cannot be manufactured, and realize the manufacturing of the slanted grating without constraints (geometric shape and size).

SURFACE-TREATED COPPER FOIL AND METHOD FOR MANUFACTURING SAME
20230043755 · 2023-02-09 ·

Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/m.sup.2 in terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μm.sup.2 and the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.

Electroplating method

The present disclosure provides an electroplating method, comprising providing an electroplating solution, wherein the electroplating solution includes an effective microorganisms aqueous solution and metal chloride; disposing a workpiece, wherein at least a part of the workpiece is in contact with the electroplating solution; and performing an electroplating process to electroplate metal of the metal chloride onto the workpiece.

Electroplating method

The present disclosure provides an electroplating method, comprising providing an electroplating solution, wherein the electroplating solution includes an effective microorganisms aqueous solution and metal chloride; disposing a workpiece, wherein at least a part of the workpiece is in contact with the electroplating solution; and performing an electroplating process to electroplate metal of the metal chloride onto the workpiece.

LOW-FRICTION MEMBER IMITATING SHARK SKIN AND MANUFACTURING METHOD THEREFOR

The present invention relates to a low-friction member imitating shark skin and a manufacturing method therefor, the low-friction member implementing a structure similar to shark skin and having riblets by stacking, in layers, composite particles formed by attaching spherical particles on the surfaces of plate-shaped particles, and thus the low-friction member has excellent low-friction characteristics. The present invention comprises: a base plate; plate-shaped particles stacked in layers on the surface of the base plate in the form of scales; and a plurality of spherical metal lubricating particles having a size smaller than that of the plate-shaped particles, and coated on the surfaces of the plate-shaped particles, wherein the metal lubricating particles are arranged in the form of a bridge connecting the base plate and the plate-shaped particles, and the plate-shaped particles to each other.

LOW-FRICTION MEMBER IMITATING SHARK SKIN AND MANUFACTURING METHOD THEREFOR

The present invention relates to a low-friction member imitating shark skin and a manufacturing method therefor, the low-friction member implementing a structure similar to shark skin and having riblets by stacking, in layers, composite particles formed by attaching spherical particles on the surfaces of plate-shaped particles, and thus the low-friction member has excellent low-friction characteristics. The present invention comprises: a base plate; plate-shaped particles stacked in layers on the surface of the base plate in the form of scales; and a plurality of spherical metal lubricating particles having a size smaller than that of the plate-shaped particles, and coated on the surfaces of the plate-shaped particles, wherein the metal lubricating particles are arranged in the form of a bridge connecting the base plate and the plate-shaped particles, and the plate-shaped particles to each other.

ALUMINIZED METALLIC SCAFFOLD FOR HIGH TEMPERATURE APPLICATIONS AND METHOD OF MAKING AN ALUMINIZED METALLIC SCAFFOLD

An aluminized metallic scaffold for high temperature applications comprises a porous non-refractory alloy structure including a network of interconnected pores extending therethrough. The porous non-refractory alloy structure comprises a transition metal phase and an aluminide phase, and portions of the porous non-refractory alloy structure between interconnected pores have a thickness no greater than about 500 nm. A method of making an aluminized metallic scaffold for high-temperature applications comprises introducing aluminum into a surface of a porous metallic structure at an elevated temperature. The porous metallic structure comprises a transition metal and has a network of interconnected pores extending therethrough, where portions of the porous metallic structure between interconnected pores have a thickness no greater than about 500 nm. As the aluminum is introduced into the surface and diffusion occurs, an aluminide phase is formed, resulting in a porous non-refractory alloy structure comprising the aluminide phase and a transition metal phase.

ALUMINIZED METALLIC SCAFFOLD FOR HIGH TEMPERATURE APPLICATIONS AND METHOD OF MAKING AN ALUMINIZED METALLIC SCAFFOLD

An aluminized metallic scaffold for high temperature applications comprises a porous non-refractory alloy structure including a network of interconnected pores extending therethrough. The porous non-refractory alloy structure comprises a transition metal phase and an aluminide phase, and portions of the porous non-refractory alloy structure between interconnected pores have a thickness no greater than about 500 nm. A method of making an aluminized metallic scaffold for high-temperature applications comprises introducing aluminum into a surface of a porous metallic structure at an elevated temperature. The porous metallic structure comprises a transition metal and has a network of interconnected pores extending therethrough, where portions of the porous metallic structure between interconnected pores have a thickness no greater than about 500 nm. As the aluminum is introduced into the surface and diffusion occurs, an aluminide phase is formed, resulting in a porous non-refractory alloy structure comprising the aluminide phase and a transition metal phase.

METALLIC COATED SUBSTRATES

The invention relates to metallic substrates surface coated with a coating layer comprising a metal and an additive.