A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data and for outputting a signal causing an anode array pattern; and, a controller, in communication with the addressing circuit and the anode array, configured to electrically control each anode in the anode array to cause an electrochemical reaction at the cathode that deposits a unitary layer structure according to the anode array pattern signal.

An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data and for outputting a signal causing an anode array pattern; and, a controller, in communication with the addressing circuit and the anode array, configured to electrically control each anode in the anode array to cause an electrochemical reaction at the cathode that deposits a unitary layer structure according to the anode array pattern signal.

An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit configured to receive a signal containing anode address data and configured to output a signal causing an anode array pattern; and a first controller being a current controller configured to control a flow of current to the anode array; a second controller in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit; and a third controller configured to clear bubbles which have formed on the anode after a length of time of steady state deposition by controlling the flow of the electrolyte solution across the anode array surface..

An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit configured to receive a signal containing anode address data and configured to output a signal causing an anode array pattern; and a first controller being a current controller configured to control a flow of current to the anode array; a second controller in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit; and a third controller configured to clear bubbles which have formed on the anode after a length of time of steady state deposition by controlling the flow of the electrolyte solution across the anode array surface..

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.

A method of fabricating and using a zinc negative electrode and systems thereof are described. A zinc electroplated electrode including a layer of zinc metal bonded to a surface of an electrically conductive current collector is fabricated by an electroplating process using a zinc electroplating system. The zinc electroplating system includes: a zinc metal anode, a cathode including the current collector for plating zinc thereon, and an electrolyte bath comprising zinc ions. The electroplating process bonds the zinc metal to the surface of the current collector to create the electroplated zinc electrode. The electroplated zinc electrode is used as a negative electrode in a zinc metal cell. The zinc metal cell may be a primary cell or a secondary cell.