Patent classifications
C25D3/26
Metal deposits, compositions, and methods for making the same
Provided herein is a composition for forming a metal deposit on a substrate. The composition consists essentially of a carboxamide, trialkylamine chloride, and a metal salt. The carboxamide comprises Formula (I). The trialkylamine chloride and the carboxamide are in molar ratio between 1:1 and 1:30 to form an ionic liquid. The trialkylamine chloride is trimethylamine chloride (TMACl), triethylamine chloride (TEACl), triethanolamine chloride, or combinations thereof. The metal salt has the formula MX.sub.y, wherein M is a metal, X is a halide, and y is an oxidation number of M, the metal salt being in a concentration between about 0.2 and about 1.5 moles per liter of the ionic liquid. The metal deposit has an average grain size between about 0.2 μm and about 3 μm and contains less than about 1 mol % of each oxygen, carbon, and chlorine.
Metal deposits, compositions, and methods for making the same
Provided herein is a composition for forming a metal deposit on a substrate. The composition consists essentially of a carboxamide, trialkylamine chloride, and a metal salt. The carboxamide comprises Formula (I). The trialkylamine chloride and the carboxamide are in molar ratio between 1:1 and 1:30 to form an ionic liquid. The trialkylamine chloride is trimethylamine chloride (TMACl), triethylamine chloride (TEACl), triethanolamine chloride, or combinations thereof. The metal salt has the formula MX.sub.y, wherein M is a metal, X is a halide, and y is an oxidation number of M, the metal salt being in a concentration between about 0.2 and about 1.5 moles per liter of the ionic liquid. The metal deposit has an average grain size between about 0.2 μm and about 3 μm and contains less than about 1 mol % of each oxygen, carbon, and chlorine.
Anti-corrosion and/or passivation compositions for metal-containing substrates and methods for making, enhancing, and applying the same
A method of disposing a corrosion resistant system to a substrate may comprise applying a plating material to the substrate; forming a chemical conversion coating solution by combining a solvent, at least one corrosion inhibitive cation comprising at least one of zinc, calcium, strontium, magnesium, or aluminum, at least one corrosion inhibitive anion comprising at least one of phosphate, molybdate, or silicate, and a complexing agent; and applying the chemical conversion coating solution to the plating material on the substrate.
Anti-corrosion and/or passivation compositions for metal-containing substrates and methods for making, enhancing, and applying the same
A method of disposing a corrosion resistant system to a substrate may comprise applying a plating material to the substrate; forming a chemical conversion coating solution by combining a solvent, at least one corrosion inhibitive cation comprising at least one of zinc, calcium, strontium, magnesium, or aluminum, at least one corrosion inhibitive anion comprising at least one of phosphate, molybdate, or silicate, and a complexing agent; and applying the chemical conversion coating solution to the plating material on the substrate.
Method for the production of electroplated components
Disclosed is a method for the production of electroplated components. In the disclosed method, an edge layer of a component to be coated is subjected to a mechanical treatment in which the edge layer is deformed at least in portions, consequently the structure of the edge layer being modified at least in portions and hydrogen traps being produced in the modified portions of the edge layer.
Method for the production of electroplated components
Disclosed is a method for the production of electroplated components. In the disclosed method, an edge layer of a component to be coated is subjected to a mechanical treatment in which the edge layer is deformed at least in portions, consequently the structure of the edge layer being modified at least in portions and hydrogen traps being produced in the modified portions of the edge layer.
METHOD FOR RECOVERING METAL FROM WASTE PRINTED CIRCUIT BOARD AND A CELL THEREOF
A metal recovery device for recovering metal in a waste printed circuit board by way of electrodeposition including: a cathode, an anode, and an electrolyte in electrical communication with the cathode and the anode, wherein the electrolyte includes a glycol-based compound and a metal chloride. A method of preparing an electrolyte for use in the same. A method of metal recovery for recovering metal from waste printed circuit board by making use the same.
METHOD FOR RECOVERING METAL FROM WASTE PRINTED CIRCUIT BOARD AND A CELL THEREOF
A metal recovery device for recovering metal in a waste printed circuit board by way of electrodeposition including: a cathode, an anode, and an electrolyte in electrical communication with the cathode and the anode, wherein the electrolyte includes a glycol-based compound and a metal chloride. A method of preparing an electrolyte for use in the same. A method of metal recovery for recovering metal from waste printed circuit board by making use the same.
METHOD FOR THE PRODUCTION OF ELECTROPLATED COMPONENTS AND ELECTROPLATED COMPONENT
Disclosed is a method for the production of electroplated components. In the disclosed method, an edge layer of a component to be coated is subjected to a mechanical treatment in which the edge layer is deformed at least in portions, consequently the structure of the edge layer being modified at least in portions and hydrogen traps being produced in the modified portions of the edge layer.
METHOD FOR THE PRODUCTION OF ELECTROPLATED COMPONENTS AND ELECTROPLATED COMPONENT
Disclosed is a method for the production of electroplated components. In the disclosed method, an edge layer of a component to be coated is subjected to a mechanical treatment in which the edge layer is deformed at least in portions, consequently the structure of the edge layer being modified at least in portions and hydrogen traps being produced in the modified portions of the edge layer.