A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 .Math.m to 2.0 .Math.m. The wiring lines have an average height of 40 .Math.m to 120 .Math.m. The wiring lines have an average spacing of 1 .Math.m to 30 .Math.m.

Providing a copper alloy plate, in which center Mg concentration at a center part in a plate thickness direction 0.1 mass % or more and less than 0.3 mass %, center P concentration is 0.001 mass % or more and 0.2 mass % or less, and the balance is composed of Cu and inevitable impurities; in which surface Mg concentration at a surface is 70% or less of the center Mg concentration; in which a surface layer part defined by a prescribed thickness from the surface has a concentration gradient of Mg of 0.05 mass %/m or more and 5 mass %/m or less increasing from surface toward center part of the plate thickness direction; and in which restraint of color change of the surface and increase of electrical contact resistance, and adhesiveness of a plating film are excellent due to maximum Mg concentration in the surface layer part is 90% of the center Mg concentration.

There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.

The multilayer copper foil includes: a recrystallization active layer disposed on a surface of a substrate; and a recrystallization suppressing layer disposed on a surface of the recrystallization active layer to inhibit recrystallization of the recrystallization active layer, wherein a concentration of impurities within the recrystallization suppressing layer is greater than a concentration of impurities within the recrystallization active layer.

The multilayer copper foil includes: a recrystallization active layer disposed on a surface of a substrate; and a recrystallization suppressing layer disposed on a surface of the recrystallization active layer to inhibit recrystallization of the recrystallization active layer, wherein a concentration of impurities within the recrystallization suppressing layer is greater than a concentration of impurities within the recrystallization active layer.

A method of forming a metal coated article, comprises forming a metal halide in a molten salt plating bath at a first temperature, wherein forming the metal halide in the molten salt further comprises forming at least one functional metal halide electrolyte; and forming at least two auxiliary metal halide electrolytes at eutectic conditions; increasing the first temperature to a second temperature; forming a plated metal coating from the at least one functional metal halide electrolyte, onto a thermally conductive substrate; and introducing at least one of deuterium and tritium into the plated metal coating.

A method of forming a metal coated article, comprises forming a metal halide in a molten salt plating bath at a first temperature, wherein forming the metal halide in the molten salt further comprises forming at least one functional metal halide electrolyte; and forming at least two auxiliary metal halide electrolytes at eutectic conditions; increasing the first temperature to a second temperature; forming a plated metal coating from the at least one functional metal halide electrolyte, onto a thermally conductive substrate; and introducing at least one of deuterium and tritium into the plated metal coating.

A composite metal foil and a preparation method thereof are provided. The composite metal foil includes a carrier layer, a barrier layer, a striping layer, and a metal foil layer. The carrier layer, the barrier layer, the striping layer, and the metal foil layer are sequentially stacked, the barrier layer includes a metal bonding layer and a high-temperature resistant layer stacked, and the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer. The striping layer is disposed between the carrier layer and the metal foil layer so as to facilitate peeling of the carrier layer, and the barrier layer is disposed between the carrier layer and the metal foil layer so as to prevent the carrier layer and the metal foil layer from diffusing mutually to cause bonding at a high temperature, so that the carrier layer and the metal foil layer are easy to peel off. In addition, the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer, so that the barrier layer is not easy to separate from the carrier layer, and peeling between the barrier layer and the carrier layer is prevented.

An aqueous acidic copper electroplating bath that produces a satin deposit includes a source of copper ions, an acid, a satin additive, and optionally one or more acidic copper electroplating bath additive(s), wherein the satin additive includes a block copolymer with the structure of RO(EO)m(PO)nH.

An aqueous acidic copper electroplating bath that produces a satin deposit includes a source of copper ions, an acid, a satin additive, and optionally one or more acidic copper electroplating bath additive(s), wherein the satin additive includes a block copolymer with the structure of RO(EO)m(PO)nH.