Providing a copper alloy plate, in which center Mg concentration at a center part in a plate thickness direction 0.1 mass % or more and less than 0.3 mass %, center P concentration is 0.001 mass % or more and 0.2 mass % or less, and the balance is composed of Cu and inevitable impurities; in which surface Mg concentration at a surface is 70% or less of the center Mg concentration; in which a surface layer part defined by a prescribed thickness from the surface has a concentration gradient of Mg of 0.05 mass %/m or more and 5 mass %/m or less increasing from surface toward center part of the plate thickness direction; and in which restraint of color change of the surface and increase of electrical contact resistance, and adhesiveness of a plating film are excellent due to maximum Mg concentration in the surface layer part is 90% of the center Mg concentration.

An igniter of a passenger protection device has at least one metal pin for contacting the tripping unit of the passenger protection device. The metal pin has a contact end that can be coupled to the tripping unit. The metal pin has a gold coating with a layer thickness. A maximum layer thickness is present at a distance of at least 1 mm from the contact end.

An igniter of a passenger protection device has at least one metal pin for contacting the tripping unit of the passenger protection device. The metal pin has a contact end that can be coupled to the tripping unit. The metal pin has a gold coating with a layer thickness. A maximum layer thickness is present at a distance of at least 1 mm from the contact end.

A method of forming a metal coated article, comprises forming a metal halide in a molten salt plating bath at a first temperature, wherein forming the metal halide in the molten salt further comprises forming at least one functional metal halide electrolyte; and forming at least two auxiliary metal halide electrolytes at eutectic conditions; increasing the first temperature to a second temperature; forming a plated metal coating from the at least one functional metal halide electrolyte, onto a thermally conductive substrate; and introducing at least one of deuterium and tritium into the plated metal coating.

The present invention relates to a method of manufacturing a coated structural component (10) for a vehicle, comprising the steps of: providing a base component (11), hot forming the base component (11) into a molded component (12), electrochemically deburring the molded component (12), and electrolytically applying a corrosion protection layer (13) to the deburred molded component (12) to produce the structural component (10). The invention further relates to an apparatus for carrying out a method according to the invention for producing a deburred and coated structural component.

The present invention relates to a method of manufacturing a coated structural component (10) for a vehicle, comprising the steps of: providing a base component (11), hot forming the base component (11) into a molded component (12), electrochemically deburring the molded component (12), and electrolytically applying a corrosion protection layer (13) to the deburred molded component (12) to produce the structural component (10). The invention further relates to an apparatus for carrying out a method according to the invention for producing a deburred and coated structural component.

An aqueous acidic copper electroplating bath that produces a satin deposit includes a source of copper ions, an acid, a satin additive, and optionally one or more acidic copper electroplating bath additive(s), wherein the satin additive includes a block copolymer with the structure of RO(EO)m(PO)nH.

Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.

Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.

Disclosed are alkaline electrodeposition solutions and apparatus and methods for using such solutions to electroplate metal. During electroplating, the solutions may produce superconformal fill of metal in features such as features having a critical dimension of about 20 nm or less. The metal electroplating process may be used during integrated circuit fabrication. For example, it may be used to fill trenches and vias in partially fabricated integrated circuits. The electroplated metal may be copper. The copper may be electroplated on a substrate material that is less noble than copper.