A method for production of a flat steel product including at least the following steps, completed in a continuous process: providing a flat steel product, wherein a protective metal layer of Zn, a Zn—Al alloy, a Zn—Mg alloy or a Zn—Mg—Al alloy is applied to at least one side by hot dip coating; at least partly removing a native oxide layer present on the surface of the protective metal layer by wetting this surface with an acidic solution of sulfuric acid, sulfurous acid, hydrochloric acid, phosphoric acid, phosphonic acid, nitric acid, formic acid, oxalic acid, acetic acid, citric acid, malic acid, tartaric acid, nitrous acid or hydrofluoric acid; activating the surface of the protective metal layer by applying an aqueous activation solution to the surface of the protective metal layer; and phosphating the activated surface of the protective metal layer by applying an aqueous phosphating solution to the activated surface.

The instant disclosure describes example techniques for bonding multiple metal structures prior or subsequent to application of a protective coating (e.g., an electrocoating or e-coating) to the structures. In certain aspects, the structures may include one or more attachment points for attaching a single structure or multiple structures bonded together to a clamp or other suitable means for applying an electrical current to the structure(s).

The instant disclosure describes example techniques for bonding multiple metal structures prior or subsequent to application of a protective coating (e.g., an electrocoating or e-coating) to the structures. In certain aspects, the structures may include one or more attachment points for attaching a single structure or multiple structures bonded together to a clamp or other suitable means for applying an electrical current to the structure(s).

A method for manufacturing a laminated tinplate for packaging applications, the laminated tinplate including a tinplate sheet and a thermoplastic laminate layer that covers at least one side of the tinplate steel sheet, to a laminated tinplate produced thereby and use thereof in a process to produce containers for packaging purposes.

The present invention relates to a steel sheet with improved yellowing resistance and phosphatability, wherein the steel sheet contains 0.5% by weight or more of Mn, and contains 0.01 to 10 mg/m.sup.2 of Ca+Mg, 0.01 to 10 mg/m.sup.2 of P, 0.01 to 20 mg/m.sup.2 of C, and 0.05 to 30 mg/m.sup.2 of O as components excluding a steel component on the surface of the steel sheet after pickling, water rinsing, and drying. According to the present invention, in a manufacturing process of the steel sheet, the surface of the steel sheet is subjected to a chemical conversion treatment for improving phosphatability and yellowing resistance in a water-cooling section or a water-washing section, thereby having an effect of improving the surface quality of products using same and various subsequently treated products.

The present invention relates to a steel sheet with improved yellowing resistance and phosphatability, wherein the steel sheet contains 0.5% by weight or more of Mn, and contains 0.01 to 10 mg/m.sup.2 of Ca+Mg, 0.01 to 10 mg/m.sup.2 of P, 0.01 to 20 mg/m.sup.2 of C, and 0.05 to 30 mg/m.sup.2 of O as components excluding a steel component on the surface of the steel sheet after pickling, water rinsing, and drying. According to the present invention, in a manufacturing process of the steel sheet, the surface of the steel sheet is subjected to a chemical conversion treatment for improving phosphatability and yellowing resistance in a water-cooling section or a water-washing section, thereby having an effect of improving the surface quality of products using same and various subsequently treated products.

Disclosed are alkaline electrodeposition solutions and apparatus and methods for using such solutions to electroplate metal. During electroplating, the solutions may produce superconformal fill of metal in features such as features having a critical dimension of about 20 nm or less. The metal electroplating process may be used during integrated circuit fabrication. For example, it may be used to fill trenches and vias in partially fabricated integrated circuits. The electroplated metal may be copper. The copper may be electroplated on a substrate material that is less noble than copper.

A method for manufacturing appliques on a dial for a timepiece.

A method for manufacturing appliques on a dial for a timepiece.

A method for passivating a tinplate strip after electrodepositing the tin layer or tin layers, or after an optional flow-melting of the electrodeposited tin layer or tin layers, and an apparatus for producing the passivated tinplate strip.