A method of forming a metal coated article, comprises forming a metal halide in a molten salt plating bath at a first temperature, wherein forming the metal halide in the molten salt further comprises forming at least one functional metal halide electrolyte; and forming at least two auxiliary metal halide electrolytes at eutectic conditions; increasing the first temperature to a second temperature; forming a plated metal coating from the at least one functional metal halide electrolyte, onto a thermally conductive substrate; and introducing at least one of deuterium and tritium into the plated metal coating.

The invention relates to an aqueous, alkaline electrolyte for electrochemically depositing a zinc-, iron-, manganese-containing layer onto surfaces of metal piece goods, in particular piece goods made of iron and/or steel, characterized in that the electrolyte contains: zinc ions in an amount of 4-60 g/L; iron ions in an amount of 0.5-30 g/L; manganese ions in an amount of 0.1-15 g/L. The invention also relates to a method for electrochemically depositing a zinc-, iron-, manganese-containing layer onto one or more surfaces of a metal piece good. The invention also relates to a metal piece good comprising a zinc-, iron, manganese-containing layer electrochemically deposited onto a surface of the metal piece good in accordance with the inventive method.

Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/m.sup.2 in terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μm.sup.2 and the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.

Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/m.sup.2 in terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μm.sup.2 and the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.

A process of forming a thin film photoactive layer of an optoelectronic device comprising: providing a substrate having a surface comprising or coated with a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In; and converting the metal surface or metal coating of the substrate to a perovskite layer.

A process of forming a thin film photoactive layer of an optoelectronic device comprising: providing a substrate having a surface comprising or coated with a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In; and converting the metal surface or metal coating of the substrate to a perovskite layer.

A steel sheet for a fuel tank according to the present invention includes: a Zn—Ni alloy plated layer placed on one surface or each of both surfaces of a base metal; and a chromate-free chemical conversion coating film which is placed over the Zn—Ni alloy plated layer. The Zn—Ni alloy plated layer has a crack starting from an interface with the chromate-free chemical conversion coating film and reaching an interface with the steel sheet, the chromate-free chemical conversion coating film consists of an organosilicon compound consisting of a condensation polymer of a silane coupling agent, a phosphoric acid compound and/or a phosphonic acid compound, a vanadium compound, and a titanium compound and/or a zirconium compound, and a concentration of a total of amounts in terms of metal, per surface, of the phosphoric acid compound and/or the phosphonic acid compound+the vanadium compound+the titanium compound and/or the zirconium compound, is 5 mass % to 20 mass %.

A steel sheet for a fuel tank according to the present invention includes: a Zn—Ni alloy plated layer placed on one surface or each of both surfaces of a base metal; and a chromate-free chemical conversion coating film which is placed over the Zn—Ni alloy plated layer. The Zn—Ni alloy plated layer has a crack starting from an interface with the chromate-free chemical conversion coating film and reaching an interface with the steel sheet, the chromate-free chemical conversion coating film consists of an organosilicon compound consisting of a condensation polymer of a silane coupling agent, a phosphoric acid compound and/or a phosphonic acid compound, a vanadium compound, and a titanium compound and/or a zirconium compound, and a concentration of a total of amounts in terms of metal, per surface, of the phosphoric acid compound and/or the phosphonic acid compound+the vanadium compound+the titanium compound and/or the zirconium compound, is 5 mass % to 20 mass %.

There is provided a surface-treated steel sheet (1) comprising: a tin-plated steel sheet (10) obtained by tin-plating a steel sheet (11); a phosphate compound layer (20) containing tin phosphate formed on the tin-plated steel sheet (10); and an aluminum-oxygen compound layer (30) on the phosphate compound layer (20), a main constituent of the aluminum-oxygen compound layer (30) being an aluminum-oxygen compound; wherein, when the 3d.sub.5/2 spectrum of tin in the aluminum-oxygen compound layer (30) is determined using an X-ray photoelectron spectroscopy, the ratio of the integration value of the profile derived from tin oxide to the integration value of the profile derived from tin phosphate (tin oxide/tin phosphate) is 6.9 or more.

There is provided a surface-treated steel sheet (1) comprising: a tin-plated steel sheet (10) obtained by tin-plating a steel sheet (11); a phosphate compound layer (20) containing tin phosphate formed on the tin-plated steel sheet (10); and an aluminum-oxygen compound layer (30) on the phosphate compound layer (20), a main constituent of the aluminum-oxygen compound layer (30) being an aluminum-oxygen compound; wherein, when the 3d.sub.5/2 spectrum of tin in the aluminum-oxygen compound layer (30) is determined using an X-ray photoelectron spectroscopy, the ratio of the integration value of the profile derived from tin oxide to the integration value of the profile derived from tin phosphate (tin oxide/tin phosphate) is 6.9 or more.