Patent classifications
C25D5/623
TRIVALENT CHROMIUM PLATING FORMULATIONS AND PROCESSES
An electrolyte solution for chrome plating from trivalent chromium is prepared by dissolving in an aqueous medium a trivalent chromium salt (e.g., chromium (III) chloride or chromium (III) sulfate), dissolving an oxalate compound (e.g., sodium oxalate, potassium oxalate, or oxalic acid), dissolving a metal salt (e.g., aluminum sulfate or aluminum chloride), dissolving an alkali metal sulfate (e.g., sodium sulfate or potassium sulfate), and dissolving an alkali metal halide (e.g., sodium fluoride or potassium fluoride). A substrate is chrome plated from trivalent chromium using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit chromium on the substrate.
Cathode for thin film microbattery
A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.
Aqueous formulation for creating a layer of gold and silver
The invention relates to a cyanide-free formulation for the electrodeposition of a layer of gold and silver on electrically conductive substrates, wherein the formulation respectively contains a complexing agent from the group of sulfites and thiosulfates and is characterized in that at least one transition metal from the 5th or 6th sub-group is added in the form of the soluble oxygen acid thereof in order to increase the bath stability.
Method for producing plated article
There is provided a method for producing a plated article, comprising immersing a substrate made of a conductive metal in a plating solution and forming a plating layer on the substrate by electroplating, wherein the plating solution is a solution containing 0.01 to 1 mol/L of Ni ions with pH of 6 or more; and a porous Ni plating layer is formed by performing the electroplating at a cathode current density of 10 A/dm.sup.2 or more. This method allows for easily producing a plated article wherein a uniform porous Ni plating layer is formed on the surface of a substrate.
Electroplating method
A method includes: agitating base members that has been immersed in an electrolytic solution inside of an electroplating tank so as to flow in a circumference direction along an inner wall of the electroplating tank; and electroplating the base members flowing along the circumference direction in the electrolytic solution inside of the electroplating tank. The flow of the base members along the circumference direction is caused by a flow of magnetic media along the circumference direction in the electrolytic solution inside of the electroplating tank or is caused by rotation of an agitation unit provided at a bottom side of the electroplating tank. At least one of the base members touches a bottom cathode, and a base member positioned upward relative to the base member touching the bottom cathode is electrically connected to the bottom cathode via at least the base member touching the bottom cathode.
Chrome-plated part and manufacturing method of the same
The present invention is to provide a chrome-plated part having a corrosion resistance in normal and specific circumstances and not requiring additional treatments after chrome plating, and to provide a manufacturing method of such a chrome-plated part. The chrome-plated part 1 includes: a substrate 2; a bright nickel plating layer 5b formed over the substrate 2; a noble potential nickel plating layer 5a formed on the bright nickel plating layer 5b. An electric potential difference between the bright nickel plating layer 5b and the noble potential nickel plating layer 5a is within a range from 40 mV to 150 mV. The chrome-plated part 1 further includes: a trivalent chrome plating layer 6 formed on the noble potential nickel plating layer 5a and having at least any one of a microporous structure and a microcrack structure.
Chromium alloy coating with enhanced resistance to corrosion in calcium chloride environments
The invention consists of a chromium electroplating solution comprising a chromium electroplating solution comprising: (1) a water soluble trivalent chromium salt; (2) at least one complexant for trivalent chromium ions; (3) a source of hydrogen ions sufficient to create a pH of from 2.8-4.2; (4) a pH buffering compound; and (5) a sulfur-containing organic compound. The chromium electroplating solution is usable in a method for producing an adherent metallic coating on a decorative article, such coating having enhanced resistance to corrosion in environments containing calcium chloride.
ALUMINUM ELECTROPLATING AND OXIDE FORMATION AS BARRIER LAYER FOR ALUMINUM SEMICONDUCTOR PROCESS EQUIPMENT
The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.
METHOD FOR MANUFACTURING A MINIATURIZED ELECTROCHEMICAL CELL AND A MINIATURIZED ELECTROCHEMICAL CELL
A method for manufacturing a miniaturized electrochemical cell and a miniaturized electrochemical cell is provided. The method includes the following steps: a) forming a colloidal template of colloidal particles made of an electrically insulating material, on a substrate made of an electrically conducting material, b) depositing by electrodeposition in the void spaces of the colloidal template, at least three alternating layers forming a repeating unit, the alternating layers being made of an electron conducting material or a semi -conducting material, the intermediate layer(s) being made of a material M.sub.3 different from materials M.sub.1 and M.sub.2 constituting respectively the upper and lower layers, the material M3 having a standard potential lower than the standard potentials of the materials M.sub.1 and M.sub.2, c) removal of the material M.sub.3 of intermediate layer(s), and d) removal of the colloidal particles of the upper and lower layers to obtain the desired electrodes.
ARTICLES INCLUDING A MULTI-LAYER COATING AND METHODS
Articles including a multi-layer coating and methods for applying coatings are described herein. The article may include a substrate on which the multi-layer coating is formed. In some embodiments, the coating includes multiple metallic layers.