Nanocomposite magnetic materials, methods of manufacturing nanocomposite magnetic materials, and magnetic devices and systems using these nanocomposite magnetic materials are described. A nanocomposite magnetic material can be formed using an electro-infiltration process where nanomaterials (synthesized with tailored size, shape, magnetic properties, and surface chemistries) are infiltrated by electroplated magnetic metals after consolidating the nanomaterials into porous microstructures on planar substrates. The nanomaterials may be considered the inclusion phase, and the magnetic metals may be considered the matrix phase of the multi-phase nanocomposite.

A dual phase magnetic component, along with methods of its formation, is provided. The dual phase magnetic component may include an intermixed first region and second region formed from a single material, with the first region having a magnetic area and a diffused metal therein, and with the second region having a non-magnetic area. The second region generally has greater than 0.1 weight % of nitrogen.

A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.

A method for preparing a metallic magnetic powder core integrated chip inductor, includes steps of: winding a spiral coil, compression molding, chamfering, curing, insulation coating, grinding, electrode copper plating. The integrated chip inductor of the present invention iterates the current industry's technology of paste-terminated electroplating integrated inductors, copper chip terminal electrode integrated inductors, and built-in T-shaped magnetic core pendulum winding electrode products, thereby reducing the installation size of the product on the circuit board increases the installation space of the integrated circuit PCB board. The present invention can realize intelligent manufacturing, achieve resource saving and environmental friendliness, and can create unique value for the development of the world's electronic industry.

Nanocomposite magnetic materials, methods of manufacturing nanocomposite magnetic materials, and magnetic devices and systems using these nanocomposite magnetic materials are described. A nanocomposite magnetic material can be formed using an electro-infiltration process where nanomaterials (synthesized with tailored size, shape, magnetic properties, and surface chemistries) are infiltrated by electroplated magnetic metals after consolidating the nanomaterials into porous microstructures on planar substrates. The nanomaterials may be considered the inclusion phase, and the magnetic metals may be considered the matrix phase of the multi-phase nanocomposite.

Embodiments herein describe techniques for a magnetic conductive device including a substrate, an under layer above the substrate, and a magnetic conductive layer including NiFe alloy formed on the under layer. A method for forming a magnetic conductive device includes forming a support stack including an under layer above a substrate, cleaning the support stack, and performing electrodeposition on the under layer by placing the support stack into a plating bath to form NiFe alloy on the under layer. The NiFe alloy includes Ni in a range of about 74% to about 84%, and Fe in a range of about 26% to about 16%. Other embodiments may be described and/or claimed.

In one example, a method to manufacture a magnetic sensor, comprises providing an electrolyte solution, submersing a substrate in the electrolyte solution, submersing a plurality of ingots in the electrolyte solution, wherein the ingots comprises a metal that is magnetic, and depositing the metal on the substrate by applying a voltage between the metal ingot and the substrate to result in magnetic alloy layer on the substrate. Other examples and related methods are also disclosed herein.

The disclosure discloses a method for preparing a permanent magnet material. In this method, an ionic liquid electroplating process is used to electroplate a heavy rare earth metal onto a surface of a sintered magnet to form a magnet with a coating, wherein the sintered magnet has a thickness of 10 mm or less in at least one direction; in the ionic liquid electroplating process, an electroplating solution comprises an ionic liquid, a heavy rare earth salt, a group VIII metal salt, an alkali metal salt and an additive, an anode is a heavy rare earth metal or a heavy rare earth alloy, a cathode is the sintered magnet, an electroplating temperature is 20-50° C., an electroplating time is 15-80 min. The preparation method of the disclosure can improve an intrinsic coercive force of the magnet with low cost and high production efficiency. A utilization rate of heavy rare earth is high.

A micro fabricated electromagnetic device and method for fabricating its component structures, the device having a layered magnetic core of a potentially unlimited number of alternating insulating and magnetic layers depending upon application, physical property and performance characteristic requirements for the device. Methods for fabricating the high performing device permit cost effective, high production rates of the device and its component structures without any degradation in device performance resulting from component layering.

A method for preparing a metallic magnetic powder core integrated chip inductor is provided, comprising steps of: winding a hollow spiral coil, compression molding, primary chamfering, hot pressing curing, secondary chamfering, primary nano-insulation coating, primary grinding, electrode copper plating, secondary nano-insulation coating, secondary grinding, electroplating metalized electrode, and testing packaging. The metallic magnetic powder core integrated chip inductor of the present invention adopts nano-insulating material to cover the product body and only retains the bottom electrode for connection, which eliminates tin stacking side area comparing to the paste terminated electroplating type and the material spot welding electrode type integrated chip inductor product, and thus reduce the installation volume of the product on the circuit board, increase the installation density of electronic components on the PCB board.