The present invention relates to processes that may be used singly or in combination to prevent lithium (or alkali metal) plating or dendrite buildup on bare substrate areas or edges of electrode rolls during alkaliation of a battery or electrochemical cell anode composed of a conductive substrate and coatings, in which the electrode rolls may be coated on one or both sides and may have exposed substrate on edges, or on continuous or discontinuous portions of either or both substrate surfaces.

A plating processing apparatus in which a plating object is immersed in a plating solution to form a plating layer on a surface of the plating object, the plating processing apparatus including a plating tank containing the plating solution, a power supply roller rotated while supplying electric power to the plating object, and conveying the plating object to be immersed into the plating solution contained in the plating tank and then moved to the outside of the plating solution, an anode case disposed inside the plating tank and held in electrical contact with the plating solution contained in the plating tank, a control panel controlling electric power supplied to the power supply roller and the anode case, a first busbar electrically connecting the power supply roller and the control panel, and a second busbar electrically connecting the anode case and the control panel, wherein the first busbar and the second busbar are each constituted by a plurality of busbar members each of which includes a copper-made base member and a titanium-made coating layer covering a surface of the base member, the first busbar and the second busbar include a first connection portion in which the busbar members are connected to each other and a second connection portion in which the busbar member is connected to the power supply roller, the anode case, or the control panel, and a portion of the busbar member other than the first connection portion and the second connection portion includes a gap between the base member and the coating layer.

A method for producing a metal porous body includes the steps of: performing electrical conduction treatment on a surface of a skeleton of a sheet-like resin porous body having the skeleton with a three-dimensional network structure, to obtain a conductive resin porous body having a conductive layer; performing electroplating treatment on a surface of a skeleton of the conductive resin porous body to obtain a plated resin porous body having a metal plating layer; and performing treatment of removing at least the resin porous body from the plated resin porous body to obtain a metal porous body. In the electroplating treatment, power is supplied to a rotation shaft of a rotating electrode roller while a contact surface of a power supply brush composed of a sintered body is brought into sliding contact with the rotation shaft, with a lubricant, not containing conductive metal powder, interposed therebetween.

The present invention relates to processes that may be used singly or in combination to prevent lithium (or alkali metal) plating or dendrite buildup on bare substrate areas or edges of electrode rolls during alkaliation of a battery or electrochemical cell anode composed of a conductive substrate and coatings, in which the electrode rolls may be coated on one or both sides and may have exposed substrate on edges, or on continuous or discontinuous portions of either or both substrate surfaces.

A cathode conduction mechanism and an electroplating system are provided. The cathode conduction mechanism includes a first conductive belt and a first conductive belt assembly, the first conductive belt assembly includes a first belt roll and a second belt roll, and the first conductive belt covering the first belt roll and the second belt roll; and a second conductive belt and a second conductive belt assembly, the second conductive belt assembly includes a third belt roll and a fourth belt roll, and the second conductive belt covering the third belt roll and the fourth belt roll. According to the present disclosure, the lower conductive belt does not pass through the bottom of the electroplating bath to prevent leakage. The upper conductive belt and the lower conductive belt each are only driven by two belt rolls to greatly save a cost.

The present invention discloses a device and method for preventing copper plating of a conductor roll in the technical field of manufacturing of copper electroplating films. A conductor roll and an electroplating anode are respectively connected to the negative output end and the positive output end of a first power source, the conductor roll and the electroplating anode electroplate a plating product flowing through plating pool bath after being electrified, and the conductor roll is connected to the positive output end of a second power source and mated with an auxiliary electrode connected to the negative output end of the second power source to realize the electrolysis of the conductor roll so that the conductor roll avoids copper deposition when electroplating the plating product. The present invention can realize the electrolysis of bath near the conductor roll on the premise of completing electroplating by the conductor roll so that the copper electroplating process and the copper electrolyzing process are balanced on the conductor roll to avoid residual copper on the conductor roll so as to improve the copper plating quality of the plating product, and the present invention does not increase the procedure of the electroplating process or affect the implementation of the electroplating process.

Electrolytic Etching/Deposition System. A system for continuous circuit fabrication comprising means for storing and dispensing the substrate, means for laminating the substrate, means for printing the substrate, means for optical inspection of the substrate, means for photolithography of the substrate, means for drying the substrate, means for developing the substrate, means for washing the substrate and means for electroplating the substrate.

A method for manufacturing an electroplated steel sheet by continuously performing electroplating on a steel sheet, the method including disposing a slit gas nozzle having an ejection port having a width wider than a width of the steel sheet in a width direction of the steel sheet on a side of an exit of an electroplating cell for the steel sheet to pass through, and ejecting a gas through the slit gas nozzle toward the steel sheet.

An electrodeposited copper foil of high toughness having a lightness L* value of the deposit side in the range of 36 to 74, the copper foil having a tensile strength in the range of 40 to 70 kg/mm.sup.2, and a weight deviation of less than 3%. The electrodeposited copper foils are particularly useful as current collectors for anode components of rechargeable secondary batteries and tend not to form wrinkles during charge-discharge cycles of the battery and are resistant to fracture during pressing of the anode active materials onto the copper foil. Secondary batteries and methods of manufacture are also described.

[Problem] To limit adhesion of foreign matter stemming from plating liquid, metal stemming from the plated steel sheet and oxides of the metal to the surface of a conductor roll.

[Solution] A surface treatment method for surface-treating the roll surface of an electroplating conductor roll characterized in that: the surface treatment liquid is a surface treatment solution in which graphite has been dispersed in a mixed solution made of an aqueous aluminum phosphate solution and colloidal silica; and that the surface treatment liquid, in which concentrations have been adjusted such that when the surface treatment liquid is 100 mass %, the aluminum phosphate content is 3 mass % to 14 mass %, the silica content is 7 mass % to 37 mass %, and the graphite content is at least 4 mass %, is supplied to the roll surface and baked.