Briefly, a sensor for a continuous biological monitor is provided for measuring the level of a target analyte for a patient. The sensor has a working wire and a reference wire, where the working wire has an analyte limiting layer that passes more than 1 in 1000 analyte molecules from the patient to the an enzyme layer. The enzyme layer has an enzyme entrapped in a polyurethane cross-linked with acrylic polyol. As free electrons are generated, a conductor transfers the electrons to the biological monitor. In some cases, the sensor may be constructed without the use of any expensive platinum.

Briefly, a sensor for a continuous biological monitor is provided for measuring the level of a target analyte for a patient. The sensor has a working wire and a reference wire, where the working wire has an analyte limiting layer that passes more than 1 in 1000 analyte molecules from the patient to the an enzyme layer. The enzyme layer has an enzyme entrapped in a polyurethane cross-linked with acrylic polyol. As free electrons are generated, a conductor transfers the electrons to the biological monitor. In some cases, the sensor may be constructed without the use of any expensive platinum.

Provided are a dissimilar metal welded body and a method of manufacturing the same, capable of preventing galvanic corrosion in a connection portion between dissimilar metals in the dissimilar metal welded body and of sufficient insulation coating being applied even when the insulation coating is applied to the dissimilar metal welded body. The dissimilar metal welded body includes a first member made of a metal containing aluminum as a main component, a second member made of a metal containing copper as a main component, a welded portion formed by pressure-welding an end face of the first member and an end face of the second member to each other, and a metal film that continuously covers a substantially entire part of the first member and at least a part of the second member. The metal film is a film made of a metal containing copper as a main component.

Provided are a dissimilar metal welded body and a method of manufacturing the same, capable of preventing galvanic corrosion in a connection portion between dissimilar metals in the dissimilar metal welded body and of sufficient insulation coating being applied even when the insulation coating is applied to the dissimilar metal welded body. The dissimilar metal welded body includes a first member made of a metal containing aluminum as a main component, a second member made of a metal containing copper as a main component, a welded portion formed by pressure-welding an end face of the first member and an end face of the second member to each other, and a metal film that continuously covers a substantially entire part of the first member and at least a part of the second member. The metal film is a film made of a metal containing copper as a main component.

A method of preparing a modified-metal surface. The method includes preparing a solution of a phosphorous-based acid in a solvent; immersing a strip of the metal work piece into the solution of the phosphorous-based acid; immersing a strip of a reference metal into the solution of the phosphorous-based acid; supplying a voltage for a duration of time to prepare a phosphorous acid-modified metal work piece; removing the phosphorous acid-modified metal work piece; cleaning and drying the phosphorous acid-modified metal work piece; applying a chitosan solution to the surface in order to attach chitosan/modified chitosan to the phosphorous acid based modified surface; prepare the modified-metal surface; and cleaning and drying the modified-metal surface.

Provided is a method for preparing copper azide and cuprous azide encapsulated by conductive metal-organic framework. The method uses a conductive copper-containing metal-organic framework material as a precursor, and completes the azidation of the precursor by means of a liquid-solid electrochemical azidation reaction. Copper azide and cuprous azide nanocrystals are highly uniformly embedded within a conductive framework, which may effectively avoid the agglomeration of copper azide and cuprous azide, and reduce static charge generated by friction, displacement, and the like. Meanwhile, the conductive framework may promote the effective transfer of charge, avoid the accumulation of static charge, and improve the electrostatic safety. In addition, the liquid-solid electrochemical azidation reaction has advantages such as being safe and efficient, having a short reaction time and having strong operability, and the preparation process is compatible with a MEMS process, which is beneficial for the application of copper azide and cuprous azide materials in micro devices.

Provided is a method for preparing copper azide and cuprous azide encapsulated by conductive metal-organic framework. The method uses a conductive copper-containing metal-organic framework material as a precursor, and completes the azidation of the precursor by means of a liquid-solid electrochemical azidation reaction. Copper azide and cuprous azide nanocrystals are highly uniformly embedded within a conductive framework, which may effectively avoid the agglomeration of copper azide and cuprous azide, and reduce static charge generated by friction, displacement, and the like. Meanwhile, the conductive framework may promote the effective transfer of charge, avoid the accumulation of static charge, and improve the electrostatic safety. In addition, the liquid-solid electrochemical azidation reaction has advantages such as being safe and efficient, having a short reaction time and having strong operability, and the preparation process is compatible with a MEMS process, which is beneficial for the application of copper azide and cuprous azide materials in micro devices.

A bathless plating for a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic membrane is applied to the composite mixture. An anode, with oxidizing properties, is applied to the membrane. A current is applied to the bathless setup. Upon removing the current and composite mixture from the cathode, a metal-based composite coating remains on the cathode.

A bathless plating for a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic membrane is applied to the composite mixture. An anode, with oxidizing properties, is applied to the membrane. A current is applied to the bathless setup. Upon removing the current and composite mixture from the cathode, a metal-based composite coating remains on the cathode.

The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.