C25D9/12

SURFACE-TREATED STEEL SHEET, METAL CONTAINER, AND METHOD FOR PRODUCING SURFACE-TREATED STEEL SHEET

There is provided a surface-treated steel sheet (1) comprising: a tin-plated steel sheet (10) obtained by tin-plating a steel sheet (11); a phosphate compound layer (20) containing tin phosphate formed on the tin-plated steel sheet (10); and an aluminum-oxygen compound layer (30) on the phosphate compound layer (20), a main constituent of the aluminum-oxygen compound layer (30) being an aluminum-oxygen compound; wherein, when the 3d.sub.5/2 spectrum of tin in the aluminum-oxygen compound layer (30) is determined using an X-ray photoelectron spectroscopy, the ratio of the integration value of the profile derived from tin oxide to the integration value of the profile derived from tin phosphate (tin oxide/tin phosphate) is 6.9 or more.

SURFACE-TREATED STEEL SHEET, METAL CONTAINER, AND METHOD FOR PRODUCING SURFACE-TREATED STEEL SHEET

There is provided a surface-treated steel sheet (1) comprising: a tin-plated steel sheet (10) obtained by tin-plating a steel sheet (11); a phosphate compound layer (20) containing tin phosphate formed on the tin-plated steel sheet (10); and an aluminum-oxygen compound layer (30) on the phosphate compound layer (20), a main constituent of the aluminum-oxygen compound layer (30) being an aluminum-oxygen compound; wherein, when the 3d.sub.5/2 spectrum of tin in the aluminum-oxygen compound layer (30) is determined using an X-ray photoelectron spectroscopy, the ratio of the integration value of the profile derived from tin oxide to the integration value of the profile derived from tin phosphate (tin oxide/tin phosphate) is 6.9 or more.

ALUMINUM PLATE AND COLLECTOR FOR STORAGE DEVICE

An object of the present invention is to provide an aluminum plate which is excellent in terms of both step suitability and working characteristics and a collector for a storage device using the same. The aluminum plate of the present invention is an aluminum plate having a plurality of through-holes formed in a thickness direction, in which a thickness of the aluminum plate is 40 μm or less, an average opening diameter of the through-holes is 0.1 to 100 μm, an average opening ratio by the through-holes is 2% to 30%, a content of Fe is 0.03% by mass or more, and a ratio of the content of Fe to a content of Si is 1.0 or more.

METHODS FOR ELECTROLYTICALLY DEPOSITING PRETREATMENT COMPOSITIONS

Methods for treating a substrate are disclosed. A method includes contacting a substrate with a pretreatment composition comprising a Group IVB metal and an electropositive metal and passing an electric current between an anode and the substrate serving as a cathode to deposit a coating from the pretreatment composition on the substrate. A method for treating an electrically conductive substrate also includes contacting the electrically conductive substrate with a pretreatment composition comprising a Group IVB metal and an electropositive metal and electrodepositing a coating on the electrically conductive substrate from the pretreatment composition. A method further includes contacting an electrically conductive substrate with a pretreatment composition comprising a Group IVB metal and an electropositive metal; and electrodepositing a coating on the electrically conductive substrate from the pretreatment composition, wherein the coating comprises each of the Group IVB metal and the electropositive metal.

Aluminum foil and aluminum member for electrodes
11527758 · 2022-12-13 · ·

An object of the present invention is to provide an aluminum foil and an aluminum member for electrodes having good adhesiveness to an electrode material and high conductivity with the electrode material. Provided is an aluminum foil having through holes including an aluminum oxide film having a thickness of 25 nm or less on a surface of the aluminum foil, and further a hydrophilic layer on a part of a surface of the aluminum oxide film.

Methods for electrolytically depositing pretreatment compositions

Methods for treating a substrate are disclosed. The substrate is deoxidized and then immersed in an electrodepositable pretreatment composition comprising a lanthanide series element and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate. Optionally, the electrodepositable pretreatment composition may comprise a surfactant. A coating from a spontaneously depositable pretreatment composition comprising a Group IIIB and/or Group IVB metal may be deposited on the substrate surface prior to electrodepositing a coating from the electrodepositable pretreatment composition. Following electrodeposition of the electrodepositable pretreatment composition, the substrate optionally may be contacted with a sealing composition comprising phosphate and a Group IIIB and/or IVB metal. Substrates treated according to the methods also are disclosed.

Methods for electrolytically depositing pretreatment compositions

Methods for treating a substrate are disclosed. The substrate is deoxidized and then immersed in an electrodepositable pretreatment composition comprising a lanthanide series element and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate. Optionally, the electrodepositable pretreatment composition may comprise a surfactant. A coating from a spontaneously depositable pretreatment composition comprising a Group IIIB and/or Group IVB metal may be deposited on the substrate surface prior to electrodepositing a coating from the electrodepositable pretreatment composition. Following electrodeposition of the electrodepositable pretreatment composition, the substrate optionally may be contacted with a sealing composition comprising phosphate and a Group IIIB and/or IVB metal. Substrates treated according to the methods also are disclosed.

Solution composition and method for single-bath post treatment of substrate

Disclosed is a solution composition which may be used for a single-bath electrochemical passivation and a method using the same. The solution composition includes a metal cation, a metal-oxide anion; and an organic ligand, and optionally includes a non-metallic oxide anion or a polymer. The solution composition may prevent undesired precipitation of metal oxides before performing passivation. In addition, the method of passivation using the solution composition in a single-bath use is also provided.

Solution composition and method for single-bath post treatment of substrate

Disclosed is a solution composition which may be used for a single-bath electrochemical passivation and a method using the same. The solution composition includes a metal cation, a metal-oxide anion; and an organic ligand, and optionally includes a non-metallic oxide anion or a polymer. The solution composition may prevent undesired precipitation of metal oxides before performing passivation. In addition, the method of passivation using the solution composition in a single-bath use is also provided.

TREATED SUBSTRATES

Methods for treating a substrate are disclosed. The substrate is deoxidized and then immersed in an electrodepositable pretreatment composition comprising a lanthanide series element and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate. Optionally, the electrodepositable pretreatment composition may comprise a surfactant. A coating from a spontaneously depositable pretreatment composition comprising a Group IIIB and/or Group IVB metal may be deposited on the substrate surface prior to electrodepositing a coating from the electrodepositable pretreatment composition. Following electrodeposition of the electrodepositable pretreatment composition, the substrate optionally may be contacted with a sealing composition comprising phosphate and a Group IIIB and/or IVB metal. Substrates treated according to the methods also are disclosed.