The invention relates to a method and a device for electrochemically processing a material, which contains a hard phase and a binder phase. The method comprises preparing an aqueous, alkaline, complexing-agent-containing electrolyte and bringing the material to be processed into contact at least in part with the electrolyte and with a current source. In order to electrochemically oxidize the material, a pulsed electrical current is delivered to the material by means of the current source, the pulse sequence of the delivered electrical current being adjusted to the amount of the binder phase in the material to be processed. By means of the method and by means of the device, it is also possible to process materials having a high content of binder phase in such a way that matter can be removed from the material evenly (homogeneously), i.e. both from the hard phase and from the binder phase of the material.

The invention relates to a method and a device for electrochemically processing a material, which contains a hard phase and a binder phase. The method comprises preparing an aqueous, alkaline, complexing-agent-containing electrolyte and bringing the material to be processed into contact at least in part with the electrolyte and with a current source. In order to electrochemically oxidize the material, a pulsed electrical current is delivered to the material by means of the current source, the pulse sequence of the delivered electrical current being adjusted to the amount of the binder phase in the material to be processed. By means of the method and by means of the device, it is also possible to process materials having a high content of binder phase in such a way that matter can be removed from the material evenly (homogeneously), i.e. both from the hard phase and from the binder phase of the material.

An object of the present invention is to provide an aluminum plate which is excellent in terms of both step suitability and working characteristics and a collector for a storage device using the same. The aluminum plate of the present invention is an aluminum plate having a plurality of through-holes formed in a thickness direction, in which a thickness of the aluminum plate is 40 μm or less, an average opening diameter of the through-holes is 0.1 to 100 μm, an average opening ratio by the through-holes is 2% to 30%, a content of Fe is 0.03% by mass or more, and a ratio of the content of Fe to a content of Si is 1.0 or more.

Electrochemical analysis method and system for monitoring and controlling the quality of electrochemical deposition and/or plating processes. The method uses a fingerprinting analysis method of an output signal to indicate whether the chemistry and/or process is operating in the normally expected range and utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes is analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to provide an output signal fingerprint.

Electrochemical analysis method and system for monitoring and controlling the quality of electrochemical deposition and/or plating processes. The method uses a fingerprinting analysis method of an output signal to indicate whether the chemistry and/or process is operating in the normally expected range and utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes is analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to provide an output signal fingerprint.

A method of producing an electrocatalyst, comprising the steps of: a) electrodeposition or electrochemical plating of an alloy comprising nickel and a second metal on a copper, nickel or other metal substrate; and b) electrochemical or chemical dissolution of deposited second metal to obtain a nanoporous structure on the copper, nickel or other metal substrate.

The present invention refers to an electrolytic treatment device having an anodic compartment comprising a non-chromium (VI) etching solution to be treated and immersed therein an anode. The anodic compartment is separated by a membrane from a cathodic compartment comprising a cathodic solution comprising an inorganic acid, wherein the anode and the cathode are used comprising or consisting of a ternary or higher Pb alloy with Sn and at least one further metal selected from the group consisting of Sb, Ag, Co, Bi and combinations thereof. Moreover, a method for etching plastic parts is provided as well.

The present invention refers to an electrolytic treatment device having an anodic compartment comprising a non-chromium (VI) etching solution to be treated and immersed therein an anode. The anodic compartment is separated by a membrane from a cathodic compartment comprising a cathodic solution comprising an inorganic acid, wherein the anode and the cathode are used comprising or consisting of a ternary or higher Pb alloy with Sn and at least one further metal selected from the group consisting of Sb, Ag, Co, Bi and combinations thereof. Moreover, a method for etching plastic parts is provided as well.

A method of processing a polycrystalline diamond body includes positioning an electrode near the polycrystalline diamond body such that a gap is defined between the electrode and the polycrystalline diamond body, the polycrystalline diamond body having a metallic material disposed in interstitial spaces defined within the polycrystalline diamond body. The method includes applying a voltage between the electrode and the polycrystalline diamond body, and passing a processing solution through the gap. The electrode is a cathode and the polycrystalline diamond body is an anode. An assembly for processing a polycrystalline diamond body includes the polycrystalline diamond body, an electrode positioned such that a gap is defined between the electrode and the polycrystalline diamond body, a processing solution passing through the gap such that the processing solution is in electrical communication with each of the polycrystalline diamond body and the electrode, and at least one power source.

A method to treat the copper surface to manufacture the metallic assembly with the polymer and copper to have excellent bonding strength is disclosed. The present method is for treating the surface of copper for the bonded coupling of the mixture of polymer and copper by providing a method to treat the surface of copper, with

(a) an etching step with electric etching of the surface of copper,
(b) the first anodizing stage to anodize the surface of copper, and
(c) the second anodizing stage to anodize the above is firstly anodized, after an ultrasonic treatment of the secondly anodized copper, the copper is oxidized again.