A composite has a solid-state structure, silicate, lithium ions, and at least one paramagnetic or diamagnetic element, which is different from lithium silicon, and oxygen. The solid-state structure has two areas in which the solid-state structure forms an identical crystal orientation. The areas are arranged at a distance of at least one millimeter from each other. A method has a quenching step in which a solid-state structure of a composite is produced, which differs from an ambient temperature solid-state structure. The composite produced by the method has silicate, lithium ions, and an element that is different from lithium, silicon, and oxygen. The method produces at least one gram of the phase pure composite in the quenching step.

A composite has a solid-state structure, silicate, lithium ions, and at least one paramagnetic or diamagnetic element, which is different from lithium silicon, and oxygen. The solid-state structure has two areas in which the solid-state structure forms an identical crystal orientation. The areas are arranged at a distance of at least one millimeter from each other. A method has a quenching step in which a solid-state structure of a composite is produced, which differs from an ambient temperature solid-state structure. The composite produced by the method has silicate, lithium ions, and an element that is different from lithium, silicon, and oxygen. The method produces at least one gram of the phase pure composite in the quenching step.

A method for manufacturing a group III nitride substrate is described. The method involves forming group III nitride films having a group III element face on a surface thereof, on both surfaces of a substrate, so as to produce a group III nitride film carrier. The group III nitride film carrier is subjected to ion implantation and adhered to a base substrate containing polycrystals containing a group III nitride as a major component. The group III nitride film carrier is spaced from the base substrate to transfer the ion-implanted region to the base substrate, so as to form a group III nitride film having an N face on a surface thereof on the base substrate. A group III nitride film is formed on the group III nitride by a THVPE method, so as to produce a thick film of a group III nitride film.

A synthetic single crystal diamond containing 100 ppm or more and 1500 ppm or less of nitrogen atoms, in which the synthetic single crystal diamond contains aggregates each composed of one vacancy and two to four nitrogen atoms present adjacent to the vacancy, a ratio b/a of a length b of a short diagonal line to a length a of a long diagonal line of diagonal lines of a Knoop indentation in a <110> direction in a {001} plane of the synthetic single crystal diamond is 0.08 or less, and the Knoop indentation is formed by measuring Knoop hardness in the <100> direction in the {001} plane of the synthetic single crystal diamond according to JIS Z 2251: 2009 under conditions of a temperature of 23° C.±5° C. and a test load of 4.9 N.

A synthetic single crystal diamond containing 100 ppm or more and 1500 ppm or less of nitrogen atoms, in which the synthetic single crystal diamond contains aggregates each composed of one vacancy and two to four nitrogen atoms present adjacent to the vacancy, a ratio b/a of a length b of a short diagonal line to a length a of a long diagonal line of diagonal lines of a Knoop indentation in a <110> direction in a {001} plane of the synthetic single crystal diamond is 0.08 or less, and the Knoop indentation is formed by measuring Knoop hardness in the <100> direction in the {001} plane of the synthetic single crystal diamond according to JIS Z 2251: 2009 under conditions of a temperature of 23° C.±5° C. and a test load of 4.9 N.

A synthetic single crystal diamond containing nitrogen atoms at a concentration of 100 ppm or more and 1500 ppm or less based on atom numbers, in which the synthetic single crystal diamond contains aggregates each composed of one vacancy and three substitutional nitrogen atoms present adjacent to the vacancy, and a Raman shift λ′ cm.sup.−1 of a peak in a first-order Raman scattering spectrum of the synthetic single crystal diamond and a Raman shift λ cm.sup.−1 of a peak in a first-order Raman scattering spectrum of a synthetic type IIa single crystal diamond containing nitrogen atoms at a concentration of 1 ppm or less based on atom numbers show a relationship of the following formula 1,

λ′−λ≥0  Formula 1.

A synthetic single crystal diamond containing nitrogen atoms at a concentration of 100 ppm or more and 1500 ppm or less based on atom numbers, in which the synthetic single crystal diamond contains aggregates each composed of one vacancy and three substitutional nitrogen atoms present adjacent to the vacancy, and a Raman shift λ′ cm.sup.−1 of a peak in a first-order Raman scattering spectrum of the synthetic single crystal diamond and a Raman shift λ cm.sup.−1 of a peak in a first-order Raman scattering spectrum of a synthetic type IIa single crystal diamond containing nitrogen atoms at a concentration of 1 ppm or less based on atom numbers show a relationship of the following formula 1,

λ′−λ≥0  Formula 1.

The problem to be solved by the present invention is to provide a novel technique that can remove a strained layer introduced into an aluminum nitride substrate. In order to solve this problem, the present aluminum nitride substrate manufacturing method involves a strained layer removal step for removing a strained layer in an aluminum nitride substrate by heat treatment of the aluminum nitride substrate in a nitrogen atmosphere. In this way, the present invention can remove a strained layer that has been introduced into an aluminum nitride substrate.

The problem to be solved by the present invention is to provide a novel technique that can remove a strained layer introduced into an aluminum nitride substrate. In order to solve this problem, the present aluminum nitride substrate manufacturing method involves a strained layer removal step for removing a strained layer in an aluminum nitride substrate by heat treatment of the aluminum nitride substrate in a nitrogen atmosphere. In this way, the present invention can remove a strained layer that has been introduced into an aluminum nitride substrate.

A method for forming at least one freestanding microstructure on a diamond crystal includes the step of removing material from the diamond crystal so as to form a structured surface, wherein the removing of the material includes creating at least two trenches, each trench having a bottom and two side walls and wherein adjacent side walls of the at least two trenches form side walls of the structured surface. The method also includes the steps of depositing at least one masking layer on the structured surface, removing at least a portion of the at least one masking layer from the bottom of each of the at least two trenches, removing additional material from the diamond crystal at least along the side walls so as to deepen the trenches, and undercutting the diamond crystal so as to form the freestanding microstructure.