There is provided a shoe upper that can be produced with high productivity. A heel cover portion (2) and a body portion (3) of a shoe upper (1) are integrally formed in a seamless manner by a knitting pattern. In the top section, a portion having a knitting width of greater than or equal to a predetermined width from an upper end to a lower end, at a position corresponding to a heel of a wearer, is assumed as the heel cover portion (2), and a portion including a remaining portion of the top section, excluding the heel cover portion (2), and the bottom section is assumed as the body portion (3), where an end in a knitting width direction of the heel cover portion (2) and an end in a wale direction of the body portion (3) are connected at positions of edges (L2, L3) on a side surface of the shoe upper (1) of the edges (L1 to L3) to become the boundary lines of the heel cover portion (2) and the body portion (3). As a result, directions of stitches of the heel cover portion (2) and the body portion (3) are oriented in a height direction and a length direction, respectively, of the shoe upper (1), whereby a three-dimensional shoe upper (1) is obtained.

A seamless knit enclosure for a headphone unit is provided. The seamless knit enclosure may include a pair of earpieces and a headband spanning therebetween. The seamless knit enclosure may include a first region and a second region. The first region may have a stitch construction that has a first elasticity. The second region may have a second stitch construction that has a second elasticity that is different than the first.