A method is provided for manufacturing a panel that includes a substrate and a top layer provided on the substrate. The top layer may include a decor film and a transparent film. The decor film may be a printed synthetic material film chosen from the group consisting of a vinyl-based film, a polyethylene based film, a polyurethane based film, and a polypropylene film. A print may be situated on an upper side of the printed synthetic material film. The transparent film may be a thermoplastic synthetic material film the material of which is chosen from the group consisting of polyvinyl chloride, polyethylene, polyurethane, and polypropylene. The method may involve providing the decor film and the transparent film on the substrate by performing a first press treatment at an increased temperature to form a package of the substrate, the decor film, and the transparent film. The first press treatment may be performed by a calendar device or a continuous press device. A structure may be formed in the thermoplastic synthetic material that forms a surface of the package by performing a second press treatment using a press device with a structured press element at a temperature that is lower than the increased temperature.

The invention relates to a method for laying a modular surface covering system on a surface to the covered and an underlayment element for use in such a method and modular surface covering system. The underlayment element includes a planar base with a raised edge along two interconnected sides of the underlayment element. First coupling elements in the form of recesses are provided along the two sides with the raised edge and second coupling elements in the form of protruding tongues are provided along the other two interconnected sides. The finishing layer elements are clamped between raised edges of coupled underlayment elements. The top surface of a raised edge between finishing layer element provides the grout effect. The underlayment elements enables one to lay a surface covering system with a multitude of pattern, e.g. as grid pattern, brickwork pattern, herringbone pattern, etc.

A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.

A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.

A floor panel includes a substrate and a top layer provided on the substrate. The top layer is composed of a print and a transparent thermoplastic layer having a thickness of 0.5 mm or less and being situated above said print. The floor panel, at least on two opposite edges, is provided with a straight or curved chamfer extending to below the global level of the print.

An interlocking modular mat having four sides has female connectors on two sides and male connectors on the other two sides so that the modular mat can interlock with an adjacent mat and its connectors. The modular mat is configured with a plurality of structures surrounding a periphery of a top portion of the mat. The plurality of structures in combination with an underside of the top portion of the mat form a cavity. A sponge insert is configured to fit in the cavity and have a height such that a portion of the sponge insert extends from a bottom side the mat body. With the sponge insert extending beyond the bottom side of the mat body, the sponge insert bottom face generally become the supporting bottom of the modular mat to provide a more cushioned feel for a mat user.

Floor tiles, systems and methods of interconnecting floor tiles in which the tile(s) have a base substrate and a laminate layer. The substrate can have upstanding edges on a top surface where the edges define a rim at a perimeter of the substrate for aligning the laminate layer on the top surface of the substrate. The substrate can have connecting means for engaging with connecting means of a substrate of another tile to form an interconnected floor system. By engaging the connecting means of a tile with another tile aligns and positions a side edge of the tile with the side edge of the another file in a side by side arrangement to provide a grout effect for the tiles when they are connected.

A first floor panel is provided that is connectable to a second floor panel in an array having a contiguous channel for retainably housing a cable. The array includes repeating units, each including one or more floor panels. The contiguous channel is formed through, between or through and between respective units. The first floor panel includes a body having a generally planar top surface, a bottom surface defining a bottom plane, and a first side. The first side includes an upper cable-retaining lip and a lower interlocking support. The interlocking support includes an interlocking support that is shaped to interlock with a corresponding side of the second floor panel to form a channel segment between the first side and the corresponding side of the second floor panel. The channel segment is adapted to retainably house the cable, spaced apart from the bottom plane. A modular flooring system is also provided involving a plurality of interconnectable floor panels.

An insulating underlay element for arranging between a subfloor and floor coverings laid thereon. The underlay element comprises a push-in connection on at least two sides of the insulating underlay element for connecting the insulating underlay elements to form an extensive insulating underlay in a gap-free and extensive manner, wherein an adhesive strip is arranged on the underside of the insulating underlay element in the region of the push-in connection, such that the adhesive surface is facing upward in the receptacles of the push-in connections and is in contact with the undersides of the pushed-in protrusions. The adhesive strip comprises a backing material coated with a release adhesive, and the insulating underlay elements being coated on their underside with a permanent adhesive in the region of the arrangement of the adhesive strips to establish a permanent adhesive connection between the adhesive strips and the underside of the insulating underlay element.

A floor panel has a rectangular and oblong shape, and includes a substrate and a top layer provided on the substrate and forming a decorative side of the floor panel. The top layer is composed of a print provided on a carrier sheet and a transparent thermoplastic layer situated above the print. The substrate has a thickness from 2 to 10 millimeter and forms at least half of the thickness of the floor panel. The substrate is a polyurethane-based substrate and the transparent thermoplastic layer is polyurethane-based. The floor panel has a length of more than 1.1 meters and has a plurality of reinforcing layers situated outside the center line of the substrate. A reinforcing layer may be provided in combination with the substrate and the top layer.