Techniques are disclosed for systems and methods using microelectromechanical systems MEMS techniques to provide cryogenic and/or general cooling of a device or sensor system. In one embodiment, a system includes a compressor assembly and MEMS expander assembly in fluid communication with the compressor assembly via a gas transfer line configured to physically separate and thermally decouple the MEMS expander assembly from the compressor assembly. The MEMS expander assembly includes a plurality of expander cells each including a MEMS displacer, a cell regenerator, and an expansion volume disposed between the MEMS displacer and the cell regenerator, and the plurality of cell regenerators are configured to combine to form a contiguous shared regenerator for the MEMS expander assembly.

Techniques are disclosed for systems and methods using microelectromechanical systems MEMS techniques to provide cryogenic and/or general cooling of a device or sensor system. In one embodiment, a system includes a compressor assembly and MEMS expander assembly in fluid communication with the compressor assembly via a gas transfer line configured to physically separate and thermally decouple the MEMS expander assembly from the compressor assembly. The MEMS expander assembly includes a plurality of expander cells each including a MEMS displacer, a cell regenerator, and an expansion volume disposed between the MEMS displacer and the cell regenerator, and the plurality of cell regenerators are configured to combine to form a contiguous shared regenerator for the MEMS expander assembly.