A bolt is provided for fastening a component or a ground connection of electrical or electronic components to a vehicle body. The bolt has a head portion with an external thread, the head portion being formed from a steel material, and a foot portion. The foot portion is formed from an aluminum alloy and is connected integrally to the head portion by a friction-weld connection. The bolt is configured in the form of a welding stud for drawn arc stud welding, for which purpose it has an ignition tip on its end side, which delimits the foot portion.

Bonding clips used to electrically bond metal structures are provided. The bonding clips include an electrically conductive body, an electrically conductive first leg, an electrically conductive second leg and an electrically conductive mounting member. The first leg has one or more piercing members extending from the first leg in a first direction. The second leg has one or more piercing embers extending from the second leg in a first direction. The one or more piercing members are provided to penetrate protective coatings on metal structures so that the one or more piercing members contact the underlying metal.

A bus bar assembly includes a bus bar formed of a first electrically conductive material having a planar contact portion. The bus bar defines a first bore extending through the contact portion. The bus bar assembly further includes a contact insert formed of a second electrically conductive material that has a greater hardness than the first electrically conductive material. The contact insert defines a first surface that is mechanically and electrically connected to the contact portion of the bus bar. The contact insert defines a second surface this is plated with a third electrically conductive material which is different than the second electrically conductive material. The contact insert defines a smooth second bore coaxial with the first bore and extending from the first surface to the second surface.

A connection structure of an inductive element includes a circuit substrate, in inductive element, at least one connection wire, a supporting element, a containing element, a positioning element, a connecting element, and a locking element. The circuit substrate has a through hole. Each connection wire has a first end connected to the inductive element, and a fixed terminal is disposed on a second end of the connection wire. The containing element is formed on the supporting element to provide a containing space. The positioning element is contained in the containing space, and provides a positioning part. The connecting element has a first connecting part and a second connecting part. The first connecting part is connected to the positioning part to clip the fixed terminal. The locking element has a locking part. The locking part is connected to the second connecting part to lock on the circuit substrate.

The invention discloses a pulling rivet for fasten-connecting a conductive material. It consists of a rivet and a lantern ring, wherein the rivet comprises a dead head, a polish rod, a locking groove, a pulling groove and a short tail, the lantern ring comprises a flange, a deformation area and a clamping tooth, and a sharp protrusion is arranged on a contact surface of an inner side of the dead head and a fasten-coupling piece. The sharp protrusions of the present invention can be embedded into the surface of the fastening piece to prevent the sliding between the fasten-coupling piece and the rivet, and because the sharp protrusions are embedded into the surface of the fasten-coupling piece to form a tightly fitted whole, which improves the conductivity of the rivet and the frame.

A system can include a display assembly that includes a display, a display side, a back side and a frame, where the back side includes a serial bus socket; and a camera assembly that includes a camera head unit coupled to an end of an arm, where an opposing end of the arm includes a serial bus connector receivable by the serial bus socket of the back side of the display assembly.

A sheet metal part for use in housing for accommodating devices such as electrical, electronic and optical devices is described. The sheet metal part comprises a penetrable opening through which the shank of a screw may be provided to bring the penetrable opening from an unpenetrated state to a penetrated state. The penetrable opening in the unpenetrated state is covered by an airtight coating layer, has a central area configured to accommodate a threaded shank of the screw and a lug extending radially outward from the central area over some distance, and the lug of the penetrable opening is configured to be bent back with the central area without coming loose from the sheet metal part when the penetrable opening is brought in the penetrated state by the shank of the screw.

Mounting a device to the wall for surveillance or other similar purposes may be performed without permanent screws or other tool-requiring components. One example device may include a mount plate, a number of magnets embedded in the mount plate, and a number of gravity reducing protrusions on the mount plate to provide a resting surface for a device mounted to the mount plate.

Disclosed herein is an integrated bonding mid clamp device for solar panel mounting and grounding, as well as a related system and method. The integrated bonding mid clamp includes a deformable toothed washer for breaking an anodized layer of a solar panel frame. The deformable toothed washer is capable of deforming to avoid obstructing proper contact between the mid clamp and the solar panel frame.

In various representative aspects, an assembly for connecting and electrically bonding electronic equipment to solar panel frames is provided. More specifically, the present invention relates generally to an assembly for securing and installing micro inverter and power optimizer units for use with solar panel arrays that are typically installed on roof structures. The assembly comprises a bracket assembly that couples micro invertors and power optimizers to solar panel frames.