A sliding member includes a bearing alloy layer and an overlay. The overlay includes a diffusion prevention layer on the bearing alloy layer, and a corrosion prevention layer on the diffusion prevention layer. A surface of the corrosion prevention layer is a sliding surface. The corrosion prevention layer constitutes 50% to 90% of an entire volume of the overlay. The corrosion prevention layer and the diffusion prevention layer each include a corrosion inhibitor and the balance of Bi and inevitable impurities. The corrosion inhibitor is defined as one or more elements that have a higher oxygen affinity than Bi and that form an alloy, a solid solution or an intermetallic compound with Bi. An average concentration of the corrosion inhibitor included in the diffusion prevention layer is lower than an average concentration of the corrosion inhibitor included in the corrosion prevention layer.

An object of the present invention is to provide a technique capable of realizing good wear resistance with a simple structure. A sliding member and a sliding bearing each include a base layer and a coating layer formed on the base layer, the coating layer having a sliding surface with a counterpart member. The base layer is formed of a hard material that is harder than the coating layer, and the average concentration of a diffusion component of the hard material diffused from the base layer is 4 wt % or more in an evaluation range, in the coating layer, in which the distance from an interface with the base layer is 1 μm or more and 2 μm or less.

To provide a sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. A sliding member including an overlay formed of an alloy plating film of Bi and Sb, and the overlay is bonded to a lining formed of a copper alloy via an intermediate layer containing Ag as a main component.

A sliding member includes an overlay formed with an alloy plated film of Bi and Sb, the Sb concentration increasing in the overlay with the depth from the surface of the overlay.

A sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. The sliding member includes an overlay formed of an alloy plating film of Bi and Sb. The overlay contains Bi, Sb, and unavoidable impurities. The concentration of Sb on the surface of the overlay is 0.92% by mass or more and 13% by mass or less.

To provide a sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. A sliding member including an overlay formed of an alloy plating film of Bi and Sb, and the overlay is bonded to a lining formed of a copper alloy via an intermediate layer containing Ag as a main component.

A sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. The sliding member includes an overlay formed of an alloy plating film of Bi and Sb. The overlay contains Bi, Sb, and unavoidable impurities. The concentration of Sb on the surface of the overlay is 0.92% by mass or more and 13% by mass or less.

A sliding member includes an overlay formed with an alloy plated film of Bi and Sb, the Sb concentration increasing in the overlay with the depth from the surface of the overlay.

In a method, in which a plain bearing alloy layer is bonded to a surface of a backing steel sheet, and, a Bi-based overlay layer is then deposited on the plain bearing alloy layer by electroplating, replacement of Bi with the backing steel sheet and deposition of Bi on the backing steel sheet are prevented. Prior to the step of electroplating of the Bi-based overlay layer, the following metals and the like are formed on at least the back surface of the backing steel sheet. An electrochemically more noble metal than Bi, an electrochemically more base metal than Bi and capable of forming a passivation state, or resin.

In a method, in which a plain bearing alloy layer is bonded to a surface of a backing steel sheet, and, a Bi-based overlay layer is then deposited on the plain bearing alloy layer by electroplating, replacement of Bi with the backing steel sheet and deposition of Bi on the backing steel sheet are prevented. Prior to the step of electroplating of the Bi-based overlay layer, the following metals and the like are formed on at least the back surface of the backing steel sheet. An electrochemically more noble metal than Bi, an electrochemically more base metal than Bi and capable of forming a passivation state, or resin.