A low-temperature storage device includes an inner vessel, an outer vessel about the inner vessel, a thermal insulation layer between the inner vessel and the outer vessel, and a single heat exchanger in thermal communication with an interior of the inner vessel and adapted to be connected to at least one of an evaporator in a closed-loop refrigeration circuit and an open-loop evaporator for an externally-supplied cryogen. The inner vessel can be a vacuum-insulated vessel, and the heat exchanger can be an internal heat exchanger including at least two fluid circuits: a first circuit with one external connection and one internal connection into the inner vessel and the second circuit with two external connections.

A device includes: a substrate including a superconductor quantum device, the superconductor quantum device including a superconductor material that exhibits superconducting properties at or below a corresponding critical temperature; a cap layer bonded to the substrate; and a sealed cavity between the cap layer and the substrate.

A device includes: a substrate including a superconductor quantum device, the superconductor quantum device including a superconductor material that exhibits superconducting properties at or below a corresponding critical temperature; a cap layer bonded to the substrate; and a sealed cavity between the cap layer and the substrate.

A cooled system includes an enclosure having an outer surface and an inner surface comprising a cooled enclosed area, multiple cable brackets thermally coupled to the outer surface of the enclosure, each cable bracket including a first surface conforming to the outer surface of the enclosure and an opening therethrough sized to hold a cable and conduct heat from the cable to the outer surface of the enclosure.

Method, system, apparatus, and/or device for predicting the failure of a shipper. The failure prediction system includes a first sensor configured to detect or measure first sensor data. The failure prediction system includes a memory configured to store a dewar failure model that models a failure of various shippers given one or more constraints. The failure prediction system includes a processor coupled to the memory and the first sensor. The processor is configured to estimate or predict a probability or a likelihood that a shipper will fail before or during a subsequent shipment of the shipper based on the first sensor data and the dewar failure model. The processor is configured to provide the estimated probability or likelihood that the shipper will fail before or during the subsequent shipment of the shipper.

A cryostat, such as for a quantum computing system, includes a plurality of temperature-controlled flanges operable to be cooled to respective cryogenic target temperatures, the temperature-controlled flanges being nested one inside another and concentrically arranged about a central axis. The temperature-controlled flanges are radially spaced apart and define closed polygonal perimeters. The temperature-controlled flanges including an outermost flange defining a vacuum chamber, an innermost flange enclosing a central core of the cryostat, and intermediate flanges radially located between the innermost flange and the outermost flange. Each of the intermediate flanges surrounds one or more of the other temperature-controlled flanges. The outermost flange is maintained at a highest temperature, the innermost flange is maintained at a lowest temperature, and the intermediate flanges are maintained at respective intermediate temperatures less than the highest temperature and greater than the lowest temperature.

A cryogenic cooling system is provided having a vessel, the vessel comprising extending along a longitudinal axis and configured to receive a sample probe movable along the longitudinal axis. One or more cooling members are thermally coupled to the vessel so as to produce a thermal gradient along the longitudinal axis of the vessel. A vent extends along the outside of the vessel and is configured to provide a pathway for a flow of gas from an inlet of the vent to an outlet of the vent. The inlet is in gaseous communication with the inside of the vessel and the outlet is in gaseous communication an environment external to the vessel. The inlet is arranged at a position along the vessel configured to obtain a temperature below 63 kelvin during operation of the one or more cooling members, and the outlet is arranged at a position configured to maintain a temperature above 273 kelvin when the outlet has a temperature below 63 kelvin. The vent further comprises a pressure relief element configured to open and close said pathway in dependence on the pressure within the vessel such that, when the pressure of a gas inside the vessel exceeds a safety threshold, the pressure relief element is opened so as to enable a flow of said gas from the inside of the vessel to the environment external to the vessel.

Aspects of the present disclosure relate generally to systems and methods for use in the implementation and/or operation of quantum information processing (QIP) systems, and more particularly, to the implementation and operation of a non-contact displacement measurement technique for cryogenic stabilization in QIP systems.

A bung assembly for closing an opening in a turret of a cryostat has a camera housing and bung body that is mechanically dimensioned to fit the opening, and is provided with a sealing arrangement for forming a gas-tight seal between the bung body and the turret.

A device intended for cooling an object being moved within a cryostat comprises a heat transfer section forming a contact surface for said object and means for fastening the heat transfer section to a cooling structure in such a way that said contact surface remains free. The device comprises a spring section which is separate from said heat transfer section and which is arranged to exert on the heat transfer section a spring force pushing said contact surface in a direction in which it is intended to contact said object.