Lighting apparatuses include an enclosure around first and second light engines. The enclosure has a diffuser over first, second and third regions. The first and second regions are separated by the third region; a first light spectrum is emitted from the first region; a second light spectrum is emitted from the second region; and a mixture of the spectrums is emitted from the third region. In some embodiments, the first spectrum has a CCT≥7000K; the second spectrum has a CCT≤6500K. In some embodiments, the first spectrum has a first CCT≥3500K; the second spectrum has a second CCT≤6500K; the second CCT<first CCT and the difference between the CCTs is at least 1000K. In some embodiments, the first spectrum has a color bounded by a first set of chromaticity coordinates, and the second spectrum has a color bounded by a second set.

Lighting apparatuses include an enclosure around first and second light engines. The enclosure has a diffuser over first, second and third regions. The first and second regions are separated by the third region; a first light spectrum is emitted from the first region; a second light spectrum is emitted from the second region; and a mixture of the spectrums is emitted from the third region. In some embodiments, the first spectrum has a CCT≥7000K; the second spectrum has a CCT≤6500K. In some embodiments, the first spectrum has a first CCT≥3500K; the second spectrum has a second CCT≤6500K; the second CCT<first CCT and the difference between the CCTs is at least 1000K. In some embodiments, the first spectrum has a color bounded by a first set of chromaticity coordinates, and the second spectrum has a color bounded by a second set.

A light emitting device includes: a base portion comprising: an upward-facing surface, and a frame defining an inner lateral surface; a plurality of semiconductor laser elements arranged on the upward-facing surface and surrounded by the frame; a cover portion supported by the frame and disposed above the plurality of semiconductor laser elements; and a protrusion extending from a lower surface of the cover portion toward the upward-facing surface. Light emitted from each of the plurality of semiconductor laser elements is incident on a lateral surface of the protrusion, passes through the protrusion, is reflected at the boundary surface, and is transmitted through the cover portion.

A light emitting device includes: a base portion comprising: an upward-facing surface, and a frame defining an inner lateral surface; a plurality of semiconductor laser elements arranged on the upward-facing surface and surrounded by the frame; a cover portion supported by the frame and disposed above the plurality of semiconductor laser elements; and a protrusion extending from a lower surface of the cover portion toward the upward-facing surface. Light emitted from each of the plurality of semiconductor laser elements is incident on a lateral surface of the protrusion, passes through the protrusion, is reflected at the boundary surface, and is transmitted through the cover portion.

An LED lamp A includes a plurality of LED modules 2 each including an LED chip 21, and a support member 1 including a support surface 1a on which the LED modules 2 are mounted. The LED modules 2 include a plurality of kinds of LED modules, or a first through a third LED modules 2A, 2B and 2C different from each other in directivity characteristics that represent light intensity distribution with respect to light emission directions. This arrangement ensures that the entire surrounding area can be illuminated with sufficient brightness.

An LED bulb structure includes a heat dissipation base, a power connector, a light-emitting module, an insulation cover, and a light-guiding cover. The power connector is disposed on a bottom side of the heat dissipation base. The light-emitting module includes a circuit substrate disposed on a top side of the heat dissipation base and a plurality of LED chips electrically connected to the circuit substrate. The LED chips are surroundingly disposed on the circuit substrate and adjacent to an outer perimeter surface of the circuit substrate. The insulation cover is disposed on the circuit substrate, and the insulation cover has a surrounding main portion and a convex portion disposed on a top side of the surrounding main portion. The light-guiding cover is disposed on the insulation cover. The light-guiding cover has a through opening formed on a top side thereof for exposing the convex portion.

An LED bulb structure includes a heat dissipation base, a power connector, a light-emitting module, an insulation cover, and a light-guiding cover. The power connector is disposed on a bottom side of the heat dissipation base. The light-emitting module includes a circuit substrate disposed on a top side of the heat dissipation base and a plurality of LED chips electrically connected to the circuit substrate. The LED chips are surroundingly disposed on the circuit substrate and adjacent to an outer perimeter surface of the circuit substrate. The insulation cover is disposed on the circuit substrate, and the insulation cover has a surrounding main portion and a convex portion disposed on a top side of the surrounding main portion. The light-guiding cover is disposed on the insulation cover. The light-guiding cover has a through opening formed on a top side thereof for exposing the convex portion.

The disclosure discloses a light source module of a luminaire including a light source board, a heat dissipating component, a first sleeving component, and a second sleeving component, wherein the heat dissipating component includes a mounting base portion; the second sleeving component is sleeved on the first sleeving component and presses the light source board on the mounting base portion; the light source board includes illuminators; the first sleeving component has an avoidance space, and the illuminators are located in the avoidance space; and at least a region, opposing to the illuminators, of the second sleeving component is a light transmission region.

Solid state light fixtures include a plurality of blue-shifted-yellow/green light emitting diode (“LED”) packages and a plurality of blue-shifted-red LED packages, where the solid state light fixture emits light having a correlated color temperature of between 1800 K and 5500 K, a CRI value of between 80 and 99, a CRI R9 value of between 15 and 75, and a Qg value of between 90 and 110 when the blue-shifted-yellow/green LED packages and the blue-shifted-red LED packages are operating at steady-state operating temperatures of at least 80° C.

An LED luminaire comprising a housing, a chamber with an internal cavity formed by a wall, a plurality of LED lamps mounted around at least a portion of the inner wall surface, and a plurality of heat sink elements mounted around at least a portion of the outer wall surface.