A method for manufacturing an LED strip includes arranging conductive lines at intervals to extend along a first linear trace; arranging supporting bases at intervals along the first linear trace on the conductive lines, each supporting base including multiple conductive portions and an avoidance through-hole; each two multiple conductive portions arranged at intervals along the first linear trace, the avoidance through-hole disposed between two of the multiple conductive portions arranged along the first linear trace; soldering the supporting bases and the conductive lines so as to have each conductive line soldered to two of the conductive portions arranged along the first linear trace and one of the conductive lines spanning over the avoidance through-hole to form a spanning portion; stamp-cutting the spanning portion; disposing an LED bead on a surface of each of the supporting bases; and subjecting the LED bead and the conductive portions to a. processing of soldering,

A method of lamp assembly that etching a glass tube body to increase a texture of the surface of the sidewall of the glass tube body, the sidewall of the glass tube body enclosing a hollow interior; and positioning a circuit board including a plurality of light emitting diodes (LEDs) within the hollow interior of the glass tube, wherein the increase in the texture of the surface increases the light diffusivity of the glass tube body.

A method of lamp assembly that etching a glass tube body to increase a texture of the surface of the sidewall of the glass tube body, the sidewall of the glass tube body enclosing a hollow interior; and positioning a circuit board including a plurality of light emitting diodes (LEDs) within the hollow interior of the glass tube, wherein the increase in the texture of the surface increases the light diffusivity of the glass tube body.

A light-emitting device includes an ultraviolet light LED sealed in a package. The LED is bonded to a substrate with an alloy bonding material. The LED is covered with an enclosed gas containing oxygen gas and further covered with a lid member that is hermetically bonded to the substrate. The lid member defines a space filled with the enclosed gas and constitutes the package. The lid member transmits the ultraviolet light emitted from the LED.

A light-emitting device includes an ultraviolet light LED sealed in a package. The LED is bonded to a substrate with an alloy bonding material. The LED is covered with an enclosed gas containing oxygen gas and further covered with a lid member that is hermetically bonded to the substrate. The lid member defines a space filled with the enclosed gas and constitutes the package. The lid member transmits the ultraviolet light emitted from the LED.

A device for automatically installing a lamp tube of an intelligent LED lamp cap, including a first feeding device for feeding a heat sink base and a second feeding device for feeding a LED lamp bead out to an outlet of the first feeding device and assembling the LED lamp bead with the heat sink base. A third feeding device is arranged on a side of the first feeding device for feeding a lamp tube. A positioning-mounting mechanism is arranged on a side of the third feeding device and is configured to assemble the heat sink base with a lamp tube. A lead wire threading device is arranged on a side of the positioning-mounting mechanism and is configured to guide a lead wire of the LED lamp bead to pass through a mounting hole on the heat sink base.

Inter-alia, a method for manufacturing a three-dimensional light emitting appliance is disclosed, said method comprising: providing a first data model of a three-dimensional area; arranging a plurality of spots for light emitting devices on the three-dimensional area of the first data model, wherein the plurality of spots is substantially evenly distributed over at least a part of the three-dimensional area; transforming the first data model of the three-dimensional area comprising the spots into a substantially two-dimensional and flat second data model, wherein the position of the spots on the second data model is derived; manufacturing a printed circuit board in accordance with the second data model and arranging pads of the printed circuit board on the spots of the second data model; equipping the pads of the printed circuit board with light emitting devices; and bringing the printed circuit board into the shape of the three-dimensional area. Further, a three-dimensional light emitting appliance is disclosed.

Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.

A light emitting diode (LED) filament light bulb is disclosed. The LED filament light bulb includes a plurality of LED filaments, an RF driver, an antenna, and a cover. The antenna defines a first end portion and a second end portion, where the first end portion of the antenna is electrically connected and in signal communication with the RF driver. The cover defines an external wall and a support structure. The external wall defines an interior volume and the support structure defines an evacuation passageway and a cavity. The evacuation passageway and the antenna are both received within the cavity of the support structure and the evacuation passageway is fluidly connected to the interior volume of the cover.

A light emitting diode (LED) filament light bulb is disclosed. The LED filament light bulb includes a plurality of LED filaments, an RF driver, an antenna, and a cover. The antenna defines a first end portion and a second end portion, where the first end portion of the antenna is electrically connected and in signal communication with the RF driver. The cover defines an external wall and a support structure. The external wall defines an interior volume and the support structure defines an evacuation passageway and a cavity. The evacuation passageway and the antenna are both received within the cavity of the support structure and the evacuation passageway is fluidly connected to the interior volume of the cover.