This invention provides an integrated LED energy-saving lamp, a manufacturing method thereof and a corn lamp. The LED energy-saving lamp comprises at least one tube, at least one baseplate, a plurality of LED lamp beads and a heat conductive adhesive. Each tube comprises two parallel first parts and a second part for connecting the two first parts. Each baseplate comprises two parallel branch parts, located on the same plane, and a connecting part for connecting with the two branches; the two branches are respectively located in the two first parts of the tube. The LED lamp beads are respectively arranged on the two branches. The heat conductive adhesive is pasted between the two branches and the internal wall of the tube.

Disclosed is an ultraviolet ray emitting diode lighting device. The disclosed invention comprises: an ultraviolet ray emitting diode for emitting ultraviolet rays; a substrate on which an ultraviolet ray emitting diode is mounted; a base on which a space for accommodating the substrate is formed and an electrode pin electrically connected to the substrate is installed; and a cover, which is provided to surround the ultraviolet ray emitting diode and the substrate and is coupled to the base, wherein the base includes a support guide fitted in the substrate to support the substrate on the base so as to restrict movement of the substrate.

A light-emitting apparatus includes a supporting element, a light-emitting device, and a connecting pin. The light-emitting device has a pair of conductive pads and is disposed on the supporting element. The connecting pin is inserted from the side surface of the supporting element and electrically connected to one of the conductive pads. The topmost surface of the supporting element is lower than the top surface of the light-emitting device.

A light system includes a first substrate and a second substrate having the first substrate thereon. A light emitting diode (LED) is connected to the first substrate. An encapsulation layer covers the LED and at least a majority of the first substrate.

A method for automatically producing LED lamp cap, including: leading a heat sink base out to an outlet of a first feeding device; leading a reflection bowl to an outlet of a lead-out rail of a second feeding device; feeding, by a third feeding device, a LED lamp bead to a clamping block; feeding a bottom cover into a feeding pipe of a fourth feeding device; feeding a lamb tube to a lamp tube feeding pipe; dispensing a glue in a mounting groove of the heat sink base; pushing the LED lamp wick into the mounting groove; feeding the reflection bowl to a mounting surface of the heat sink base; and allowing the bottom cover to abut against an end of the heat sink base and allowing a lead wire to be clamped in a notch of the heat sink base and an opening of the bottom cover.

A method for automatically producing LED lamp cap, including: leading a heat sink base out to an outlet of a first feeding device; leading a reflection bowl to an outlet of a lead-out rail of a second feeding device; feeding, by a third feeding device, a LED lamp bead to a clamping block; feeding a bottom cover into a feeding pipe of a fourth feeding device; feeding a lamb tube to a lamp tube feeding pipe; dispensing a glue in a mounting groove of the heat sink base; pushing the LED lamp wick into the mounting groove; feeding the reflection bowl to a mounting surface of the heat sink base; and allowing the bottom cover to abut against an end of the heat sink base and allowing a lead wire to be clamped in a notch of the heat sink base and an opening of the bottom cover.

In various embodiments, a light emitting diode (LED) lamp is provided. The LED lamp may include a base; a first housing having a first end and a second end, the first end secured to the base; a second housing having at least in part a partially conical shape, an end of the second housing having a smaller diameter secured to the second end of the first housing; at least one LED secured within the second; driver circuitry secured within the LED flood lamp between the end of the base and the at least one LED; a reflector having a partially conical shape; and a diffuser element secured to at least one of a wider end of the reflector or the end of the second housing having the larger diameter. In some embodiments, the first or second housing may include one or more vents.

In various embodiments, a light emitting diode (LED) lamp is provided. The LED lamp may include a base; a first housing having a first end and a second end, the first end secured to the base; a second housing having at least in part a partially conical shape, an end of the second housing having a smaller diameter secured to the second end of the first housing; at least one LED secured within the second; driver circuitry secured within the LED flood lamp between the end of the base and the at least one LED; a reflector having a partially conical shape; and a diffuser element secured to at least one of a wider end of the reflector or the end of the second housing having the larger diameter. In some embodiments, the first or second housing may include one or more vents.

A light sensing module includes a substrate, a light sensing unit, a first light-transmissive component, and a light shielding layer. The light sensing unit is disposed on the substrate to sense an intensity of a working light beam, and has an upper light receiving surface and a lateral surface perpendicular to the upper light receiving surface. The first light-transmissive component covers the light sensing unit, and has a first refractive index between a refractive index of the light sensing unit and a refractive index of air. The light shielding layer surrounds the lateral surface and is covered by the first light-transmissive component.

A method for manufacturing an LED strip includes arranging conductive lines at intervals to extend along a first linear trace; arranging supporting bases at intervals along the first linear trace on the conductive lines, each supporting base including multiple conductive portions and an avoidance through-hole; each two multiple conductive portions arranged at intervals along the first linear trace, the avoidance through-hole disposed between two of the multiple conductive portions arranged along the first linear trace; soldering the supporting bases and the conductive lines so as to have each conductive line soldered to two of the conductive portions arranged along the first linear trace and one of the conductive lines spanning over the avoidance through-hole to form a spanning portion; stamp-cutting the spanning portion; disposing an LED bead on a surface of each of the supporting bases; and subjecting the LED bead and the conductive portions to a. processing of soldering,