An optical component includes a support member having a through-hole, a second light-transmissive member disposed inside the through-hole, and having a light incidence face, a light emission face, and an outer peripheral side surface, and at least one functional film selected from a group consisting of a short pass filter, a long pass filter, and a heat dissipation member and disposed on a surface of the second light-transmissive member.

The invention provides a light generating device (1000), wherein: (I) the light generating device (1000) comprises: (a) a first light source (110) configured to generate first light source light (111) having a first light source light spectral power distribution, wherein the first light source (110) comprises a first laser light source (10) configured to generate first laser light source light (11); (b) a first luminescent material (210) configured to convert at least part of the first light source light (111) into first luminescent material light (211) having a first luminescent material spectral power distribution having an emission at one or more wavelengths selected from the wavelength range of 590-780 nm, wherein the first luminescent material (210) is configured in an optical resonator (230); (II) the first light source (110) and the first luminescent material (210) are configured to generate first luminescent material laser light (1211) having a first luminescent material laser light spectral power distribution comprising at least part of the first luminescent material light (211); (III) the first light source light spectral power distribution and the first luminescent material laser light spectral power distribution mutually differ; and (IV) the light generating device (1000) is configured to generate in one or more operational modes white device light (1001) comprising the first luminescent material laser light (1211).

A fluorescent plate including a fluorescent phase which emits fluorescence by excitation light, and a plurality of voids, wherein, in a cross section of the fluorescent plate including cross sections of the voids, voids having an equivalent circle diameter of 0.4 micrometers or greater and 50 micrometers or smaller have a standard deviation in equivalent circle diameter of 1.5 or less.

A fluorescent plate including a fluorescent phase which emits fluorescence by excitation light, and a plurality of voids, wherein, in a cross section of the fluorescent plate including cross sections of the voids, voids having an equivalent circle diameter of 0.4 micrometers or greater and 50 micrometers or smaller have a standard deviation in equivalent circle diameter of 1.5 or less.

The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.

A light emitting device includes a substrate, a plurality of light sources, a partitioning member and a diffuser sheet. The light sources are disposed on an upper surface of the substrate. The partitioning member is disposed on the upper surface of the substrate and including top parts. The partitioning member is reflective. The diffuser sheet is in contact with the top parts of the partitioning member.

A light emitting device includes a substrate, a plurality of light sources, a partitioning member and a diffuser sheet. The light sources are disposed on an upper surface of the substrate. The partitioning member is disposed on the upper surface of the substrate and including top parts. The partitioning member is reflective. The diffuser sheet is in contact with the top parts of the partitioning member.

A light emitting device includes a base; a plurality of semiconductor laser elements disposed on the base and configured to emit light laterally from the plurality of semiconductor laser elements; a reflecting member disposed on the base and configured to reflect light from the semiconductor laser elements; a surrounding part disposed on the base and surrounding the semiconductor laser elements and the reflecting member; a wiring part disposed on the base so as to extend to a location outside of the surrounding part; a radiating body disposed on the surrounding part and having an opening; and a wavelength converting member that is located in the opening of the radiating body, the wavelength converting member being configured to convert a wavelength of light that is emitted from the plurality of semiconductor laser elements and reflected upward by the reflecting member.

A light emitting device includes a base; a plurality of semiconductor laser elements disposed on the base and configured to emit light laterally from the plurality of semiconductor laser elements; a reflecting member disposed on the base and configured to reflect light from the semiconductor laser elements; a surrounding part disposed on the base and surrounding the semiconductor laser elements and the reflecting member; a wiring part disposed on the base so as to extend to a location outside of the surrounding part; a radiating body disposed on the surrounding part and having an opening; and a wavelength converting member that is located in the opening of the radiating body, the wavelength converting member being configured to convert a wavelength of light that is emitted from the plurality of semiconductor laser elements and reflected upward by the reflecting member.

Provided is compatibility between adhesion to a substrate (lower layer) and durability improvement. An optical element includes a phosphor layer facing a lower layer, and a bonding layer keeping the phosphor layer in intimate contact with the lower layer. The phosphor layer includes an inorganic binder, and phosphor particle dispersed with the inorganic binder. The bonding layer includes an organic binder. The phosphor layer has a first surface facing the lower layer, a second surface opposite to the first surface, and a side surface connecting the first and second surfaces together. The bonding layer connects together the second surface, the side surface, and a surface of the lower layer to keep the phosphor layer in intimate contact with the lower layer.