An LED strip light, including: a first signal line, a second power supply wire and a third power supply wire along a first direction as well as a first LED luminous body and a second LED luminous body along a second direction, and the first LED luminous body being electrically connected to the second LED luminous body; a first type of pins of the first LED luminous body and a first type of pins of the second LED luminous body are in a roughly aligned spatial location relationship along the second direction; and moreover, the strip light has any one of the following characteristics: when the first LED luminous body and the second LED luminous body are connected in series, different types of power supply pins are arranged on a same straight line in a staggered manner.

A lighting device includes a housing, a light emitting module, a press plate and a fixing member. The housing has a bottom plate, a base and multiple stopping portions. The base protrudes from the bottom plate, and has a top surface and an inclined surface. The stopping portions are arranged at the bottom plate and extend to a bottom portion of the inclined surface of the base. The light emitting module includes a light panel and multiple light emitting elements arranged thereon. The light panel leans on the inclined surface and stopped by the stopping portions. The press plate is located at the top surface, and presses against the light panel. The fixing member fixes the press plate at the top surface to cause the press plate to press the light panel downward, so as to fix the light panel on the inclined surface.

Methods and devices are described. A device includes an optical carrier part and a heatsink bulk part. The optical carrier part has an LED mounting area configured to receive an LED and an alignment feature configured for aligning with an optical component. The heatsink bulk part is separate from the optical carrier part and joined to the optical carrier part, such that the optical carrier part and the heatsink bulk part in conjunction are configured to perform a thermal management of an LED module, including the LED, and the heatsink bulk part, in operation.

A device is described that includes a carrier that has a plurality of light-emitting diode (LED) mounting areas. Each of the LED mounting areas includes a pair of contact pads, which are electrically coupled to the LED mounting area in a first subset of the plurality of LED mounting areas or electrically connected in series with a shunting element in the respective LED mounting area in a second subset of the plurality of LED mounting areas. In some embodiments, LEDs may be placed in the first subset of the plurality of LED mounting areas.

The invention provides a light generating system (1000) comprising a LED module (100), a module support (200), and a connector element (300), wherein: the module support (200) comprises a first module support opening (230) for hosting at least part of a first connector element part (310); the LED module (100) comprises a LED support (120) and a plurality of LEDs (10) functionally coupled to the LED support (120), wherein the LED support (120) comprises a LED support opening (130) for hosting at least part of the first connector element part (310); and wherein the plurality of LEDs (10) are configured to generate light source light (11); the connector element (300) comprises the first connector element part (310), and wherein the first connector element part (310) comprises a first spring part (315); at least part of the first connector element part (310) penetrates through the first module support opening 230); and the LED support opening (130), the first connector element part (310), and the module support (200) are chosen such that in a functional coupling of the LED module (100) and the module support (200), at least part of the first connector element part (310) penetrates through the LED support opening (130), and the first spring part (315) exerts a force on the LED module (100) against the module support (200).

An LED panel light includes a flexible base film, a plurality of circuits arranged on the flexible base film and a plurality of LED lamp beads arranged on the flexible base film, each circuit is connected with at least one LED lamp bead and is provided with at least two mutually parallel conductive wires. The conductive wire consists of a plurality of secondary conductive wires, and a plurality of the secondary conductive wires form a mesh. A method of making a LED panel light includes the following specific steps: S1: providing a flexible base film; S2: manufacturing a plurality of mesh-type conductive wires on the flexible base film by using a mould with circuit patterns of LED panel light; conductive wires forming a circuit, and a plurality of the circuits forming an LED panel light circuit; S3: connecting LED lamp beads with the conductive wires in the circuits.

A light-emitting device includes an ultraviolet light LED sealed in a package. The LED is bonded to a substrate with an alloy bonding material. The LED is covered with an enclosed gas containing oxygen gas and further covered with a lid member that is hermetically bonded to the substrate. The lid member defines a space filled with the enclosed gas and constitutes the package. The lid member transmits the ultraviolet light emitted from the LED.

An LED base module includes an LED lighting base and a supporting base. The LED lighting base includes an insulation housing and multiple conductive terminals fixed in the insulation housing. Each of the conductive terminals includes a chip fixing portion electrically connected to the chip assembly and a pin portion exposed outside the insulation housing. The supporting base includes multiple conductive portions and one or more avoidance through-holes. Each of the conductive portions includes a first terminal portion and a second terminal portion which are respectively exposed at two opposite surfaces of the supporting base. The first terminal portion is electrically connected to the pin portion, and the second terminal portion is electrically connected to a conductive line. The avoidance through-hole is provided for avoidance of stamp-cutting of one of the conductive lines.

Apparatus and associated methods relate to a water-resistant capture device for enclosing wired electro-magnetic components, the capture device having a base module and a connecting cap module, wherein when the base module and cap module enclose an electro-magnetic component and the base module is connected to the cap module, one or more electric wires are passed through wire apertures formed by a combined base module and cap module. In some embodiments, the base module may be deformable and deform when affixed to the cap module. In some embodiments a sealing agent may be disposed in an interior of the capture device. The sealing agent may, for example, be assembled in solid form and be at least partially liquified for distribution. In an exemplary embodiment, an LED may be captured within the capture device. The sealing agent may provide a water resistant seal between a base and a housing element.

The present invention discloses a highly waterproof and highly insulative simple plastic lamp bulb without a conventional lamp cap, including a lampshade, a waterproof insulation plastic lamp cap, a conductive connection piece, and a lamp core body, wherein an insertion portion is provided at the bottom of the lampshade, the lamp core body is inserted into the insertion portion, the conductive connection piece is in electrical connection with the lamp core body, the conductive connection piece is disposed on the insertion portion and then integrally injection-molded into the waterproof insulation plastic lamp cap by an injection molding machine. The production process is simplified, those conventional lamp bulbs with lamp caps of various sizes are replaced, the production costs are reduced, and the daily production volume is increased.