Disclosed embodiments relate to a combination axial fan and LED lighting system configured to fit into the footprint of a standard ceiling tile. Disclosed embodiments further include ceiling tiles with a built-in fan and/or LED lighting. The disclosed systems may include a housing container and an axial fan. The fan has a fan cavity including air diversion mechanism to direct air from the fan cavity toward the lighting and fan components. The inventions include an airflow surface to direct air existing the fan cavity along an LED light fixture. Moreover, disclosed embodiments include one or more UV light sources which irradiate contaminants as air flows through the ceiling tile.

Disclosed embodiments relate to a combination axial fan and LED lighting system configured to fit into the footprint of a standard ceiling tile. Disclosed embodiments further include ceiling tiles with a built-in fan and/or LED lighting. The disclosed systems may include a housing container and an axial fan. The fan has a fan cavity including air diversion mechanism to direct air from the fan cavity toward the lighting and fan components. The inventions include an airflow surface to direct air existing the fan cavity along an LED light fixture. Moreover, disclosed embodiments include one or more UV light sources which irradiate contaminants as air flows through the ceiling tile.

A unique outdoor lantern bulb adaptor includes a module that extends beyond the bulb to maintain light output while reducing vertical light pollution. The adapter is IDA compliant and manufactured with a non-shattering UV resistant thermoplastic unit installed via a standard light bulb screwing mechanism without the need for any additional bracket or mounting system. An adapter consisting of an outer standard light bulb cover with vents to maintain light output while also being easily removed, replaced, and transported.

A unique outdoor lantern bulb adaptor includes a module that extends beyond the bulb to maintain light output while reducing vertical light pollution. The adapter is IDA compliant and manufactured with a non-shattering UV resistant thermoplastic unit installed via a standard light bulb screwing mechanism without the need for any additional bracket or mounting system. An adapter consisting of an outer standard light bulb cover with vents to maintain light output while also being easily removed, replaced, and transported.

An LED bulb structure includes a heat dissipation base, a power connector, a light-emitting module, an insulation cover, and a light-guiding cover. The power connector is disposed on a bottom side of the heat dissipation base. The light-emitting module includes a circuit substrate disposed on a top side of the heat dissipation base and a plurality of LED chips electrically connected to the circuit substrate. The LED chips are surroundingly disposed on the circuit substrate and adjacent to an outer perimeter surface of the circuit substrate. The insulation cover is disposed on the circuit substrate, and the insulation cover has a surrounding main portion and a convex portion disposed on a top side of the surrounding main portion. The light-guiding cover is disposed on the insulation cover. The light-guiding cover has a through opening formed on a top side thereof for exposing the convex portion.

An LED bulb structure includes a heat dissipation base, a power connector, a light-emitting module, an insulation cover, and a light-guiding cover. The power connector is disposed on a bottom side of the heat dissipation base. The light-emitting module includes a circuit substrate disposed on a top side of the heat dissipation base and a plurality of LED chips electrically connected to the circuit substrate. The LED chips are surroundingly disposed on the circuit substrate and adjacent to an outer perimeter surface of the circuit substrate. The insulation cover is disposed on the circuit substrate, and the insulation cover has a surrounding main portion and a convex portion disposed on a top side of the surrounding main portion. The light-guiding cover is disposed on the insulation cover. The light-guiding cover has a through opening formed on a top side thereof for exposing the convex portion.

A luminaire comprising a heat spreader and a heat sink disposed around and thermally communicates with the heat spreader. The heat sink forms a trim plate configured to be disposed completely external of a can light fixture or an electrical junction box. The luminaire also includes an optic securely retained relative to one of the heat spreader and the heat sink on one side of a plane defined by a lower surface of the trim plate and extends to the other side of the plane defined by the lower surface of the trim plate, as well as a light source disposed on the heat spreader and comprising a plurality of light-emitting diodes (LEDs). The plurality of LEDs are positioned entirely on one side of the plane defined by the lower surface of the trim plate. The light source is in thermal communication with the heat spreader.

A method of lamp assembly that etching a glass tube body to increase a texture of the surface of the sidewall of the glass tube body, the sidewall of the glass tube body enclosing a hollow interior; and positioning a circuit board including a plurality of light emitting diodes (LEDs) within the hollow interior of the glass tube, wherein the increase in the texture of the surface increases the light diffusivity of the glass tube body.

A method of lamp assembly that etching a glass tube body to increase a texture of the surface of the sidewall of the glass tube body, the sidewall of the glass tube body enclosing a hollow interior; and positioning a circuit board including a plurality of light emitting diodes (LEDs) within the hollow interior of the glass tube, wherein the increase in the texture of the surface increases the light diffusivity of the glass tube body.

The present disclosure provides a power supply device and a high-power illumination system. The power supply device includes: a housing, where the housing includes a first bottom plate having a first surface on which a first heat sink is provided and a second surface on which a thermal conductive potting layer is provided; and a printed circuit board, where the printed circuit board is located in the housing, the printed circuit board includes a circuit board body and multiple electronic components arranged on the circuit board body, at least part of the multiple electronic components is arranged facing the second surface of the first bottom plate, and the electronic component of the at least part of the multiple electronic components is partially immersed in the thermal conductive potting layer to conduct heat dissipated by the electronic component to the first heat sink for natural heat dissipation of the electronic component.