A backlight module and a manufacturing method of same are provided by this disclosure. The backlight module includes a frame, a thermoelectric device group, a first heat conductive layer and a lamp plate. The thermoelectric device group is disposed on a bottom surface inside the frame. The first heat conductive layer is disposed on a surface at a side of the thermoelectric device group away from the frame. The lamp plate is disposed on a surface at a side of the first heat conductive layer away from the frame.

The solar-powered light for motorists on roadways is an electrical device. The solar-powered light for motorists on roadways is configured for use on a path of a multipath structure. This disclosure assumes that the path is a road. The solar-powered light for motorists on roadways mounts in the road. The solar-powered light for motorists on roadways generates electromagnetic radiation that illuminates the road when the road is in a period of darkness. The solar-powered light for motorists on roadways comprises a housing and a lamp circuit. The housing contains the lamp circuit. The lamp circuit is independently powered. By independently powered is meant that the lamp circuit can operate without an electrical connection to an external power source.

The solar-powered light for motorists on roadways is an electrical device. The solar-powered light for motorists on roadways is configured for use on a path of a multipath structure. This disclosure assumes that the path is a road. The solar-powered light for motorists on roadways mounts in the road. The solar-powered light for motorists on roadways generates electromagnetic radiation that illuminates the road when the road is in a period of darkness. The solar-powered light for motorists on roadways comprises a housing and a lamp circuit. The housing contains the lamp circuit. The lamp circuit is independently powered. By independently powered is meant that the lamp circuit can operate without an electrical connection to an external power source.

A light-emitting device with an electric power generation function includes a thermal conductive LED board that includes a thermal conductive base having a mounting surface and an open surface, and a board wiring provided on the mounting surface. An LED element is connected with the board wiring. A thermoelectric element is electrically insulated from the thermal conductive base, and thermally coupled with the thermal conductive base. The thermoelectric element includes a casing unit having a housing unit, and includes, in the housing unit, a first electrode unit, a second electrode unit having a work function different from a work function of the first electrode unit, and a middle unit including nanoparticles having a work function between the work function of the first electrode unit and the work function of the second electrode unit. The casing unit is provided on the open surface of the thermal conductive base.

The invention refers to a lighting device, it concerns an electronic circuit, equipped with different technical devices, assembling in the same lighting device: and “e-storage” micro battery, an IOT wireless system, a mini thermoelectric generator and a photovoltaic film. This product makes it possible to replace the deteriorated and/or worn component characterized by each part is removable.

A backlight module and a manufacturing method of same are provided by this disclosure. The backlight module includes a frame, a thermoelectric device group, a first heat conductive layer and a lamp plate. The thermoelectric device group is disposed on a bottom surface inside the frame. The first heat conductive layer is disposed on a surface at a side of the thermoelectric device group away from the frame. The lamp plate is disposed on a surface at a side of the first heat conductive layer away from the frame.

A backlight module and a manufacturing method of same are provided by this disclosure. The backlight module includes a frame, a thermoelectric device group, a first heat conductive layer and a lamp plate. The thermoelectric device group is disposed on a bottom surface inside the frame. The first heat conductive layer is disposed on a surface at a side of the thermoelectric device group away from the frame. The lamp plate is disposed on a surface at a side of the first heat conductive layer away from the frame.

An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.

An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.

An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.