Patent classifications
F21V29/70
Explosion-proof housing and method for producing the same
An explosion-proof housing includes at least one metal housing part having at least one of a housing opening or receiving surface, and a support edge bordering said at least one of a housing opening or receiving surface. A cover part covers said at least one of a housing opening or the receiving surface. The cover part includes a peripheral cover edge which is connected to the support edge in an explosion-proof manner such that in the event of an explosion inside the housing, the explosion is prevented from crossing over to an explosive atmosphere surrounding the housing. A plurality of connection points are formed between the support edge and the cover edge. The connection points include interlocking depressions and protrusions. The protrusions are formed by partial melting of the cover edge. The depressions and the protrusions interlock with play in a longitudinal direction of the housing.
Explosion-proof housing and method for producing the same
An explosion-proof housing includes at least one metal housing part having at least one of a housing opening or receiving surface, and a support edge bordering said at least one of a housing opening or receiving surface. A cover part covers said at least one of a housing opening or the receiving surface. The cover part includes a peripheral cover edge which is connected to the support edge in an explosion-proof manner such that in the event of an explosion inside the housing, the explosion is prevented from crossing over to an explosive atmosphere surrounding the housing. A plurality of connection points are formed between the support edge and the cover edge. The connection points include interlocking depressions and protrusions. The protrusions are formed by partial melting of the cover edge. The depressions and the protrusions interlock with play in a longitudinal direction of the housing.
Light emitting device having improved illumination and manufacturing flexibility
Systems, methods, and apparatuses provide a light emitting device including one or more arrays of light emitting diodes attached to a first outward facing surface of a first substrate. The light emitting device further includes driver circuitry attached to a second outward facing surface of a second substrate. The light emitting device further includes a wire connection electrically coupling the first substrate and the second substrate such that the driver circuitry drives the one or more arrays of light emitting diodes. The light emitting device further includes an enclosure for housing the first substrate, the second substrate, and the wire connection.
Light emitting device having improved illumination and manufacturing flexibility
Systems, methods, and apparatuses provide a light emitting device including one or more arrays of light emitting diodes attached to a first outward facing surface of a first substrate. The light emitting device further includes driver circuitry attached to a second outward facing surface of a second substrate. The light emitting device further includes a wire connection electrically coupling the first substrate and the second substrate such that the driver circuitry drives the one or more arrays of light emitting diodes. The light emitting device further includes an enclosure for housing the first substrate, the second substrate, and the wire connection.
OPTICAL COMPONENT AND ITS METHOD OF MANUFACTURE, AND LIGHT EMITTING DEVICE AND ITS MEHTOD OF MANUFACTURE
An optical component includes a support member having a through-hole, a second light-transmissive member disposed inside the through-hole, and having a light incidence face, a light emission face, and an outer peripheral side surface, and at least one functional film selected from a group consisting of a short pass filter, a long pass filter, and a heat dissipation member and disposed on a surface of the second light-transmissive member.
OPTICAL COMPONENT AND ITS METHOD OF MANUFACTURE, AND LIGHT EMITTING DEVICE AND ITS MEHTOD OF MANUFACTURE
An optical component includes a support member having a through-hole, a second light-transmissive member disposed inside the through-hole, and having a light incidence face, a light emission face, and an outer peripheral side surface, and at least one functional film selected from a group consisting of a short pass filter, a long pass filter, and a heat dissipation member and disposed on a surface of the second light-transmissive member.
LED BULB STRUCTURE
An LED bulb structure includes a heat dissipation base, a power connector, a light-emitting module, an insulation cover, and a light-guiding cover. The power connector is disposed on a bottom side of the heat dissipation base. The light-emitting module includes a circuit substrate disposed on a top side of the heat dissipation base and a plurality of LED chips electrically connected to the circuit substrate. The LED chips are surroundingly disposed on the circuit substrate and adjacent to an outer perimeter surface of the circuit substrate. The insulation cover is disposed on the circuit substrate, and the insulation cover has a surrounding main portion and a convex portion disposed on a top side of the surrounding main portion. The light-guiding cover is disposed on the insulation cover. The light-guiding cover has a through opening formed on a top side thereof for exposing the convex portion.
MASTER/SLAVE ARRANGEMENT FOR LIGHTING FIXTURE MODULES
The present disclosure relates to a lighting fixture that includes a driver module and at least one other module that provides a lighting fixture function, such as a sensor function, lighting network communication function, gateway function, and the like. The driver module communicates with the other modules in a master/slave scheme over a communication bus. The driver module is configured as a slave communication device, and the other modules are configured as master communication devices. As such, the other modules may initiate communications with the driver to send information to or retrieve information from the driver module.
HIGHLY EFFICIENT HEAT-DISSIPATING LIGHT-EMITTING DIODE LIGHTING DEVICE
The present disclosure provides a light-emitting diode (LED) lighting device. The LED lighting device includes a lamp base, a glass shell, a heat-dissipating cup, a driving power source, an LED light source module, and an optical portion. The LED light source module, the heat-dissipating cup, and the driving power source are arranged from top to bottom inside the glass shell. A top portion of the glass shell is connected to the optical portion and a bottom portion of the glass shell is connected to the lamp base. The heat-dissipating cup faces upwardly and an outer sidewall of the heat-dissipating cup forms a close contact with an inner sidewall of the glass shell. The LED light source module is fixed within the heat-dissipating cup. The driving power source is positioned under the heat-dissipating cup and a space is formed between the driving power source and the heat-dissipating cup.
HIGHLY EFFICIENT HEAT-DISSIPATING LIGHT-EMITTING DIODE LIGHTING DEVICE
The present disclosure provides a light-emitting diode (LED) lighting device. The LED lighting device includes a lamp base, a glass shell, a heat-dissipating cup, a driving power source, an LED light source module, and an optical portion. The LED light source module, the heat-dissipating cup, and the driving power source are arranged from top to bottom inside the glass shell. A top portion of the glass shell is connected to the optical portion and a bottom portion of the glass shell is connected to the lamp base. The heat-dissipating cup faces upwardly and an outer sidewall of the heat-dissipating cup forms a close contact with an inner sidewall of the glass shell. The LED light source module is fixed within the heat-dissipating cup. The driving power source is positioned under the heat-dissipating cup and a space is formed between the driving power source and the heat-dissipating cup.