Embodiments of the present invention are related to a lamp assembly that may have a base unit that includes a base, a power supply housing, a power supply, and a power supply cover. The base unit may be operable to detachably engage a lamp unit to form a functional lighting device. Furthermore, the base unit may be operable to be interchanged with a plurality of lamp units.

An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.

An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.

A lighting device for use with one or more other networked devices is disclosed. In embodiments, the lighting device may comprise an outer globe, a diffuser, an outer cowling, a power input connector, a power control printed circuit board, a communication and control printed circuit board, an indicator printed circuit board, one or more microprocessors, a real-time clock, a supercapacitor, and an LED lighting printed circuit board. In embodiments, the real-time clock may be powered by the supercapacitor to track time without power from an input power source for the lighting device, enabling the lighting device to implement time-dependent settings, such as pre-programmed color temperatures and/or light intensities. The lighting device may communicate with one or more other networked devices, such as second lighting devices, mobile phones, servers, remote controls, and/or home or office automation equipment. The lighting device may be powered through a light socket.

The invention provides a lighting device comprising a light source and a heat sink (200). The heat sink (200) is configured to dissipate thermal energy from the light source when in operation. The heat sink comprises a plurality of pin-shaped fins (210) and a support (220), wherein each fin (210) has a fin height (h) relative to the support (220), a bottom part (213) associated with the support (220) and a top part (214), a cross-section having a first width (d1) and a second width (d2) having a ratio d1/d2 selected from the range of 1.2-10, and a first width axis, wherein the first width axes of the pin-shaped fins (210) are arranged parallel, and wherein the pin-shaped fins (210) are hollow over at least part of their fin height (h).

The invention provides a lighting device comprising a light source and a heat sink (200). The heat sink (200) is configured to dissipate thermal energy from the light source when in operation. The heat sink comprises a plurality of pin-shaped fins (210) and a support (220), wherein each fin (210) has a fin height (h) relative to the support (220), a bottom part (213) associated with the support (220) and a top part (214), a cross-section having a first width (d1) and a second width (d2) having a ratio d1/d2 selected from the range of 1.2-10, and a first width axis, wherein the first width axes of the pin-shaped fins (210) are arranged parallel, and wherein the pin-shaped fins (210) are hollow over at least part of their fin height (h).

Provided are a substrate used for an LED encapsulation, a three-dimensional LED encapsulation comprising the substrate, a bulb comprising the three-dimensional LED encapsulation and a manufacturing method therefor. The substrate is spiral lines in shape, at least one of the ends of the substrate is provided with an electrode lead wire, the electrode lead wire is connected with the substrate by a connective component and/or connective materials, the spiral lines of the substrate comprise gaps between each other, and a smooth curve and/or a plurality of polylines end to end is formed at least partly at the edge of the substrate. The three-dimensional LED encapsulation and the bulb comprising the three-dimensional LED encapsulation comprise the substrate, multiple LED chips in series and/or parallel are arranged on the substrate, the multiple LED chips are let out by the electrode lead wire of one end of the substrate and the other end of the substrate as the other electrode lead wire. All-dimensional and three-dimensional and multilayer light-emitting of the bulb may be realized, moreover, the heat is easy to dissipate, the structure is simple to manufacture, and the cost is low.

Provided are a substrate used for an LED encapsulation, a three-dimensional LED encapsulation comprising the substrate, a bulb comprising the three-dimensional LED encapsulation and a manufacturing method therefor. The substrate is spiral lines in shape, at least one of the ends of the substrate is provided with an electrode lead wire, the electrode lead wire is connected with the substrate by a connective component and/or connective materials, the spiral lines of the substrate comprise gaps between each other, and a smooth curve and/or a plurality of polylines end to end is formed at least partly at the edge of the substrate. The three-dimensional LED encapsulation and the bulb comprising the three-dimensional LED encapsulation comprise the substrate, multiple LED chips in series and/or parallel are arranged on the substrate, the multiple LED chips are let out by the electrode lead wire of one end of the substrate and the other end of the substrate as the other electrode lead wire. All-dimensional and three-dimensional and multilayer light-emitting of the bulb may be realized, moreover, the heat is easy to dissipate, the structure is simple to manufacture, and the cost is low.