An LED light bulb comprising a lamp housing, a bulb base, connected to the lamp housing, a stem connected to the bulb base and located in the lamp housing; an LED filament, disposed in the lamp housing, where points of the LED filament in an xyz coordinates are defined as x, y, and z, an x-y plane of the xyz coordinates is perpendicular to the height direction of the LED light bulb, an z-axis of xyz coordinates is parallel with the stem, and the projection of the LED filament on the x-y plane, y-z plane and x-z plane respectively has a length L1, L2 and L3, and the length L1, the length L2, and the length L3 are substantially in a ratio of 1:(0.5 to 1):(0.6 to 0.9).

A wireless vehicle charging system is provided herein. The charging system includes a charging station having a power source and a charging station interface operably coupled to a primary coil assembly. The primary coil assembly includes a primary coil therein for generating a magnetic field. An illumination system is disposed within the primary coil assembly and includes a passive illumination system and an active illumination system. A first photoluminescent structure is disposed within the passive illumination system and is configured to luminesce in response to excitation by an incident light. A vehicle has a secondary coil assembly thereon operably coupled with a rectifier and configured to transmit electrical current from the secondary coil assembly to a battery. A second photoluminescent structure is disposed on a vehicle component and is configured to luminesce in response to excitation by a light source on the primary coil assembly.

An LED illumination apparatus according to an exemplary embodiment of the present invention includes a substrate, a light source disposed on the substrate, a cover unit, wherein the cover unit is configured to cover the light source, which is disposed on the substrate, and a reflector which is configured to extend from the cover unit inside to the upper substrate, whereby a light generated by the light source illuminates an area below a bottom side of the substrate.

A system and method for a light panel assembly which is particularly useful for commercial horticultural applications. An extruded heat sink frame provides for a layered light panel assembly with superior heat dissipation characteristics and low power requirements while providing highly efficient returns and output radiant flux.

One or more excitation energy sources emit light in an excitation spectrum and direct the emitted light as an excitation beam to the emitting surface of a wavelength conversion element directly or via reflection. Distinct areas of the emitting surface are coated with one or more distinct fluorescent phosphors. The phosphor-coated areas receive the excitation beam and generate a sequence of fluoresced light beams at a light output, each fluoresced beam of a narrow spectrum determined by the type of phosphor and the excitation spectrum. The fluoresced beams travel parallel to an emitting axis at a non-zero angle to axes associated with the excitation beams.

Disclosed is a light emitting module including a light emitting device package having a circuit board having a cavity, an insulation substrate arranged in the cavity, with a conductive pattern formed thereon, and at least one light emitting device disposed on the insulation substrate, with being electrically connected with the conductive pattern; and a glass cover located on the light emitting device package, with lateral surfaces, a top surface and an open bottom surface, wherein the light emitting device package and the circuit board are electrically connected with each other.

The present invention provides a light-emitting diode (LED) device and a method for manufacturing the same. The LED device comprises: a substrate (1); a chip (2) disposed on the substrate (1); and a first lens (3) disposed on the substrate (1) and spaced from the chip (2); wherein the first lens (3) comprises luminescent powder (7) and at least one of light-diffusing particles (8) and light-reflecting particles (10). The LED device provided by the present invention has a high luminous efficiency, and solves the problem in the prior art that the LED device has a small angle of emergence and the emergent light emergence lacks of uniformity.

An high-efficiency light bulb, comprising: a lamp housing with inner surface and outer surface opposite to the inner surface of the lamp housing, the lamp housing includes a layer of luminescent material, which is formed on the inner surface or the outer surface of the lamp housing or integrated in the material of the lamp housing; a bulb base connected to the lamp housing; a stem connected to the bulb base and located in the lamp housing; and a single filament, disposed in the light housing, further comprising a plurality of supporting arms, connected with and supporting the LED filament, wherein the stem comprises a stand extending to the center of the lamp housing, the stand supports the supporting arms.

An high-efficiency light bulb, comprising: a lamp housing with inner surface and outer surface opposite to the inner surface of the lamp housing, the lamp housing includes a layer of luminescent material, which is formed on the inner surface or the outer surface of the lamp housing or integrated in the material of the lamp housing; a bulb base connected to the lamp housing; a stem connected to the bulb base and located in the lamp housing; and a single filament, disposed in the light housing, further comprising a plurality of supporting arms, connected with and supporting the LED filament, wherein the stem comprises a stand extending to the center of the lamp housing, the stand supports the supporting arms.

An LED filament comprising a plurality of LED filament units, each of the plurality of LED filament units includes a LED chip with an upper surface and a lower surface opposite to the upper surface of the LED chip, and a light conversion layer comprising a top layer and a base layer, and the base layer comprises an upper surface and a lower surface opposite to the upper surface of the base layer, where the top layer with an upper surface and a lower surface opposite to the upper surface of the top layer is disposed on at least two sides of each of the LED chips, the lower surface of each of the LED chips is close to the upper surface of the base layer, and the upper surface of the top layer is away from each of the LED chips.