A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.

A cooling system for electrical and optical devices includes an electrocaloric cooler (EEC). A fluid circuit is in thermal communication with the EEC to dump heat from a working fluid of the fluid circuit into the EEC. The system can include a second EEC, a second fluid circuit in thermal communication with the second EEC to dump heat from a working fluid of the second fluid circuit into the EEC, and a second heat sink in thermal communication with the second fluid circuit to dump heat into the working fluid of the second fluid circuit. The second EEC, second fluid circuit, and second heat sink can be cascaded with the first EEC, first heat sink, and first fluid circuit wherein the second heat sink is in thermal communication with the first EEC to accept heat therefrom.

Cooling sub-assemblies with thermoelectric element(s), coupling clamps, hot side and cold side heat exchanger having a direct insertion or removal of cooling modules onto a fixed mounting frame arranged in rows and columns to produce desired and required cooling levels.

A special-shaped tube cooling and heat dissipation system includes a cooling module including a cooling chip, a liquid cooling tube, a cooling fin block and a first fan for generating cold air, a heat dissipation module including a radiator with heat pipes and a second fan, and a piping system. Through the piping system, the heat of the cooling module is transported to the radiator through the liquid, and then the heat in the liquid is discharged, and the liquid is recirculated back to the cooling module. The liquid cooling pipe and the heat pipes are flat tubes extruded from aluminum alloy to increase the heat dissipation area, each defining therein a plurality of flow channels. The liquid cooling tube and the heat pipes are respectively combined with flow guide devices that connect the heat pipes in series to form a circulating heat dissipation flow channel.

Methods and apparatus for an autonomous stage-switching multi-stage cooling device are disclosed are disclosed. A disclosed example coolant distribution unit (CDU) includes an enclosure, an inlet and an outlet of the CDU to be fluidly coupled to a cooling block associated with a heat generating source, at least one sensor to measure a first temperature corresponding to the inlet and a second temperature corresponding to the outlet, and a plurality of valves to be controlled by a controller to control a flow of fluid from the inlet to at least one of an ambient cooler or a sub-ambient cooler based on: (i) a comparison of the first temperature to an ambient temperature and (ii) a comparison of the second temperature to a target temperature.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A cooling system includes an ingress port to receive refrigerant in a vapor form from an evaporator, an egress port to return refrigerant in a liquid form back to the evaporator, a condenser coupled to the ingress port and the egress port, and a compressor coupled to the ingress port and the condenser. When the cooling system operates in a first mode, the condenser is configured to receive and condense the refrigerant from the vapor form into the liquid form and to return the refrigerant in the liquid form to the regress port. When the cooling system operates in a second mode, the compressor is configured to compress the refrigerant in the vapor form and to supply the compressed refrigerant to the condenser to be condensed therein.

According to various aspects, exemplary embodiments are disclosed of chiller systems including thermoelectric modules, and corresponding control methods. In an exemplary embodiment, a compressor chiller system generally includes a refrigerant loop having a refrigerant fluid, a compressor connected in the refrigerant loop to compress the refrigerant fluid, and a condenser connected in the refrigerant loop to receive the compressed refrigerant fluid from the compressor and to condense the compressed refrigerant fluid. The system also includes a heat transfer component connected in the refrigerant loop to receive the condensed refrigerant fluid from the condenser, and a coolant loop having a coolant fluid. The heat transfer component is connected in the coolant loop to transfer heat from the coolant fluid to the condensed refrigerant fluid. The system further includes a thermoelectric module connected in the coolant loop. The thermoelectric module is adapted to transfer heat into and/or out of the coolant fluid.

The invention relates to a portable cooling vented apparatus, comprising: an array made of one or more thermoelectric cooler(s), each thermoelectric cooler having a cold side and a hot side, the cumulative cold sides and the cumulative hot sides of all the thermoelectric coolers define cold and hot sides of the array, respectively; one or more heatsinks at the hot side of the array; and at least one reservoir configured to supply liquid to the heatsink(s), by being adjoined to the heatsink(s) and/or with the aid of one or more liquid channels connected to said reservoir and installed in the interior of the cooling apparatus in proximity to, or within, said heatsink(s); wherein the apparatus is open to the surroundings.

A method of cooling using a thermoelectric cooler is also provided.

A thermostatic massage pad includes: a thermostatic pad, wherein a thermostatic water pipe is arranged inside the thermostatic pad; a cooling pad, wherein a cooling water pipe is arranged inside the cooling pad; a casing, wherein a thermostatic water pump and a cooling water pump are respectively arranged inside the casing, a thermostatic water tank is arranged at a top of the thermostatic water pump, a cooling water tank is arranged at a top of the cooling water pump, a water inlet end of the thermostatic water pump is connected to a water outlet of the thermostatic water tank, and a water inlet end of the cooling water pump is connected to a water outlet of the cooling water tank; a thermoelectric cooler, wherein an end surface of the thermoelectric cooler is fixedly connected to a wall surface of the thermostatic water tank.