A system includes a heat exchanger mounted to the brackets and receiving cryogen, the heat exchanger having a vertical inlet coupled in parallel to a plurality of equal size horizontal tubes each traversing a width of the heat exchanger and further coupled in parallel to a vertical outlet pipe with an outlet diameter at least twice an inlet tube diameter; a temperature sensor; a thermostat that monitors the temperature sensor and maintains a predetermined temperature set point by communicating with a solenoid valve coupled to the heat exchanger; an exhaust line coupled to the outlet pipe that expels exhaust gas outside the enclosed facility; multiple fans attached to the heat exchanger; and a fail-safe oxygen sensor to protect a biological object in the enclosed facility.

A system includes a heat exchanger mounted to the brackets and receiving cryogen, the heat exchanger having a vertical inlet coupled in parallel to a plurality of equal size horizontal tubes each traversing a width of the heat exchanger and further coupled in parallel to a vertical outlet pipe with an outlet diameter at least twice an inlet tube diameter; a temperature sensor; a thermostat that monitors the temperature sensor and maintains a predetermined temperature set point by communicating with a solenoid valve coupled to the heat exchanger; an exhaust line coupled to the outlet pipe that expels exhaust gas outside the enclosed facility; multiple fans attached to the heat exchanger; and a fail-safe oxygen sensor to protect a biological object in the enclosed facility.

There is disclosed a heat transferring device comprising a number of spaces and conduits together with heat transferring elements and a heat exchanger as well as a heat source. A capillary tube feeds a heat transferring medium to a space from which is can be evaporated. The invention is highly suitable for all applications where heat is to be transferred from a small volume to a large area. It is also suitable where the same large area needs to be cooled. The energy consumption is reduced compared to more traditional technologies. The number of moving parts is minimized which gives lower costs for use, manufacture, maintenance etc. The invention is very versatile and can be utilized in many different applications where it is desired to transfer heat from one point to a large area. It can also be used for cooling purposes.

A low-pressure boiling cooling system is provided. The low-pressure boiling cooling system includes a sealed chamber containing a refrigerant and configured to convert the refrigerant into vapor by boiling the refrigerant therein, a high-temperature portion located inside the sealed chamber and configured to boil the refrigerant, and a heating portion located outside the sealed chamber and configured to generate heat, a vacuum pump connected to the sealed chamber and configured to lower pressure inside the sealed chamber by discharging the vapor into an atmosphere, a refrigerant tank containing a supplementary refrigerant, and a refrigerant transfer portion configured to supply the supplementary refrigerant from the refrigerant tank into the sealed chamber, wherein the high-temperature portion is configured to receive heat generated from the heating portion and directly transfer heat to the refrigerant in the sealed chamber.