Batch furnace assembly for processing wafers, comprising a process chamber housing defining a process chamber and having a process chamber opening, a wafer boat housing defining a water boat chamber, a door assembly, a differential pressure sensor, and a controller. The door assembly has a closed position in which it closes off the process chamber opening. The door assembly defines in a closed position a door assembly chamber having a purge gas inlet for supplying purge gas to the door assembly chamber for gas sealingly separating the process chamber from the wafer boat chamber. The differential pressure sensor assembly fluidly connects to the door assembly chamber and is configured to determine a pressure difference between a pressure in the door assembly chamber and a reference pressure in a reference pressure chamber. The controller is configured to establish whether the pressure difference is in a desired pressure range.

Batch furnace assembly for processing wafers, comprising a process chamber housing defining a process chamber and having a process chamber opening, a wafer boat housing defining a water boat chamber, a door assembly, a differential pressure sensor, and a controller. The door assembly has a closed position in which it closes off the process chamber opening. The door assembly defines in a closed position a door assembly chamber having a purge gas inlet for supplying purge gas to the door assembly chamber for gas sealingly separating the process chamber from the wafer boat chamber. The differential pressure sensor assembly fluidly connects to the door assembly chamber and is configured to determine a pressure difference between a pressure in the door assembly chamber and a reference pressure in a reference pressure chamber. The controller is configured to establish whether the pressure difference is in a desired pressure range.

Disclosed are a continuous heat treatment device and method for a sintered Nd—Fe—B magnet workpiece. The device comprises a first heat treatment chamber, a first cooling chamber, a second heat treatment chamber, and a second cooling chamber continuously disposed in sequence, as well as a transfer system disposed among the chambers to transfer the alloy workpiece or the metal workpiece; both the first cooling chamber and the second cooling chamber adopt a air cooling system, wherein a cooling air temperature of the first cooling chamber is 25° C. or above and differs from a heat treatment temperature of the first heat treatment chamber by at least 450° C.; a cooling air temperature of the second cooling chamber is 25° C. or above and differs from a heat treatment temperature of the second heat treatment chamber by at least 300° C. The continuous heat treatment device and method can improve the cooling rate and production efficiency and improve the properties and consistency of the products.

Disclosed are a continuous heat treatment device and method for a sintered Nd—Fe—B magnet workpiece. The device comprises a first heat treatment chamber, a first cooling chamber, a second heat treatment chamber, and a second cooling chamber continuously disposed in sequence, as well as a transfer system disposed among the chambers to transfer the alloy workpiece or the metal workpiece; both the first cooling chamber and the second cooling chamber adopt a air cooling system, wherein a cooling air temperature of the first cooling chamber is 25° C. or above and differs from a heat treatment temperature of the first heat treatment chamber by at least 450° C.; a cooling air temperature of the second cooling chamber is 25° C. or above and differs from a heat treatment temperature of the second heat treatment chamber by at least 300° C. The continuous heat treatment device and method can improve the cooling rate and production efficiency and improve the properties and consistency of the products.

A sintering furnace can include an outer shell defining an internal volume a reactive agent inlet configured to introduce a reactive agent into the internal volume; an insulation chamber within the outer shell; and a retort configured to retain an object. A method of operating a sintering furnace can include sintering a part precursor within a retort arranged within a chamber, wherein the chamber defines an intermediate volume between the retort and the chamber, wherein a sintering byproduct is oxidized within the intermediate volume.

A sintering furnace can include an outer shell defining an internal volume a reactive agent inlet configured to introduce a reactive agent into the internal volume; an insulation chamber within the outer shell; and a retort configured to retain an object. A method of operating a sintering furnace can include sintering a part precursor within a retort arranged within a chamber, wherein the chamber defines an intermediate volume between the retort and the chamber, wherein a sintering byproduct is oxidized within the intermediate volume.

In an example implementation, a method of operating a sintering furnace includes receiving information about a green object load to be sintered in a sintering furnace, determining a sintering profile based on the information, and performing a sintering process according to the sintering profile. During the sintering process, a sensor reading that indicates a degree of densification of a green object in the load is accessed from a densification sensor. The method includes initiating a cool down phase of the sintering process if the sensor reading has reached a target sensor reading.

An apparatus for processing a substrate includes a reaction tube, a side cover, a heater, a first gas supplier, a second gas supplier and a controller. The reaction tube is configured to receive a substrate boat in which a plurality of the substrate is received to process the substrate. The side cover is configured to receive the reaction tube. The heater lines the interior of the side cover. The first gas supplier is provided to an upper portion of the side cover to supply a cooling gas at a first supplying rate to a space between the side cover and the reaction tube. The second gas supplier is provided to a lower portion of the side cover to supply the cooling gas at a second supplying rate different from the first supplying rate to the space between the side cover and the reaction tube. The controller controls the reaction tube.

An apparatus for processing a substrate includes a reaction tube, a side cover, a heater, a first gas supplier, a second gas supplier and a controller. The reaction tube is configured to receive a substrate boat in which a plurality of the substrate is received to process the substrate. The side cover is configured to receive the reaction tube. The heater lines the interior of the side cover. The first gas supplier is provided to an upper portion of the side cover to supply a cooling gas at a first supplying rate to a space between the side cover and the reaction tube. The second gas supplier is provided to a lower portion of the side cover to supply the cooling gas at a second supplying rate different from the first supplying rate to the space between the side cover and the reaction tube. The controller controls the reaction tube.

Disclosed are a device and method for continuously performing grain boundary diffusion and heat treatment, characterized in that the alloy workpiece or the metal workpiece are arranged in a relatively independent processing box together with a diffusion source; the device comprises, in successive arrangement, a grain boundary diffusion chamber, a first cooling chamber, a heat treatment chamber, and a second cooling chamber, and a transfer system provided between various chambers for delivering the processing box; each of the first cooling chamber and the second cooling chamber uses an air cooling system, and the cooling air temperature of the first cooling chamber is above 25° C. and at least differs by 550° C. from the grain boundary diffusion temperature of the grain boundary diffusion chamber; the cooling air temperature of the second cooling chamber is above 25° C. and at least differs by 300° C. from the heat treatment temperature of the heat treatment chamber; and the cooling chamber has a pressure of 50 kPa to 100 kPa. The device provided by the present invention can increase the cooling rate and production efficiency, and improve product consistency.