A retort for thermally processing sinterable objects including a retort body having an interior cavity configured to receive at least one part for sintering. The retort body includes a retort inlet, a fore volume, an inlet plenum, an outlet plenum and a retort outlet. The retort inlet is configured to be fluidly connected to a process gas inlet tube and receive a flow of process gas. The retort inlet is fluidly connected to the fore volume, the fore volume being configured to receive a cleansing object. The fore volume is fluidly connected to the inlet plenum, which is fluidly connected to the interior cavity, which is in turn fluidly connected to the outlet plenum. The outlet plenum is fluidly connected to the retort outlet which is configured to be fluidly connected to an effluent gas outlet tube via a Peclet sealing element.

A glass body manufacturing apparatus includes: a first heating furnace including a furnace core tube accommodating the soot and a first heater, to supply a dehydration gas into the furnace core tube and heat the soot at a first treatment temperature lower than a softening point of the porous portion by the first heater; a second heating furnace including a structural body accommodating the soot and a second heater, to heat the soot at a second treatment temperature equal to or higher than the softening point by the second heater; and a conveyance container, connectable to each of the first and second heating furnaces while keeping airtightness with respect to the atmosphere, to accommodate and hold the soot, and convey the soot between the first and second heating furnaces.

A glass body manufacturing apparatus includes: a first heating furnace including a furnace core tube accommodating the soot and a first heater, to supply a dehydration gas into the furnace core tube and heat the soot at a first treatment temperature lower than a softening point of the porous portion by the first heater; a second heating furnace including a structural body accommodating the soot and a second heater, to heat the soot at a second treatment temperature equal to or higher than the softening point by the second heater; and a conveyance container, connectable to each of the first and second heating furnaces while keeping airtightness with respect to the atmosphere, to accommodate and hold the soot, and convey the soot between the first and second heating furnaces.

An device for manufacturing an active alloy includes: a melting chamber including: a working pipe surrounded by an induction coil and forming a working area; a chamber base disposed below the working pipe and communicated with the working pipe, and including: a gas inlet hole; a vacuum pump connection port; and a vacuum sensor, for measuring a vacuum degree in the working pipe; a chamber door communicated with the chamber base; a first bracket passing through the chamber base, and moving towards a direction away from or near the working area; a second bracket extending into the working pipe, and moving towards a direction away from or near the working area; and a material recycling seat which can extend into the chamber base in a push and pull way.

An device for manufacturing an active alloy includes: a melting chamber including: a working pipe surrounded by an induction coil and forming a working area; a chamber base disposed below the working pipe and communicated with the working pipe, and including: a gas inlet hole; a vacuum pump connection port; and a vacuum sensor, for measuring a vacuum degree in the working pipe; a chamber door communicated with the chamber base; a first bracket passing through the chamber base, and moving towards a direction away from or near the working area; a second bracket extending into the working pipe, and moving towards a direction away from or near the working area; and a material recycling seat which can extend into the chamber base in a push and pull way.

An inline thermal treatment system for thermally treating a continuous conductive product includes a first electrode configured to contact a continuous conductive product and a second electrode configured to contact the continuous conductive product such that a portion of the continuous conductive product is disposed between the first and second electrodes. The inline thermal treatment system includes a power source coupled to the first electrode and to the second electrode, wherein the power source is configured to apply an electrical bias between the first electrode and the second electrode to resistively heat the portion of the continuous conductive product disposed between the first and second electrodes.

An inline thermal treatment system for thermally treating a continuous conductive product includes a first electrode configured to contact a continuous conductive product and a second electrode configured to contact the continuous conductive product such that a portion of the continuous conductive product is disposed between the first and second electrodes. The inline thermal treatment system includes a power source coupled to the first electrode and to the second electrode, wherein the power source is configured to apply an electrical bias between the first electrode and the second electrode to resistively heat the portion of the continuous conductive product disposed between the first and second electrodes.

A method for forming large titanium parts includes forming bends into a titanium plate for form a bent part. The bent part is then roll-formed to form contours into the bent part. The surfaces of the contoured part are rough-machined, and the part is then secured to a bladed form fixture. The bladed form fixture comprises a plurality of header boards that secure the part to the fixture. The fixture part is placed in a thermal vacuum furnace and a stress-relieving operation is performed. The part is removed from the fixture and final machining takes place.

A method for forming large titanium parts includes forming bends into a titanium plate for form a bent part. The bent part is then roll-formed to form contours into the bent part. The surfaces of the contoured part are rough-machined, and the part is then secured to a bladed form fixture. The bladed form fixture comprises a plurality of header boards that secure the part to the fixture. The fixture part is placed in a thermal vacuum furnace and a stress-relieving operation is performed. The part is removed from the fixture and final machining takes place.

The present disclosure discloses a heating apparatus for a semiconductor device. The heating apparatus includes a carrier including a first abutting part, a heat collecting plate at least including a working surface, and a heat radiation source disposed on a side of the heat collecting plate opposite to the working surface and separated from the heat collecting plate by a predetermined distance. The heat collecting plate is disposed on the carrier, and the first abutting part abuts against an edge of the heat collecting plate on the side opposite to the working surface. The heat radiation source is and configured to emit heat radiation during working and to heat the heat collecting plate in a non-contact manner. The heat collecting plate receives the heat radiation and the emitted heat and heats a heated object disposed on the working surface in a contact manner.