Cooling device (15) for cooling semiconductor switching elements (10, 11), comprising a first wall (17) having a first side (18) for carrying the semiconductor switching elements (10, 11) and having a second side (19) being opposite the first side (18), a second wall (20) having a first side (21) that forms a main cooling channel (22) together with the second side (19) of the first wall (17) and having a second side (25) being opposite to the first side (21) of the second wall (20), and a third wall (23) that forms an auxiliary cooling channel (24) together with the second side (25) of the second wall (20), wherein the second wall (20) comprises a connection means (26) that connects the auxiliary cooling channel (24) with the main cooling channel (22) in a fluid-conductive manner.

A heat exchanger for providing thermal energy transfer between a first flow along a first flowpath and a second flow along a second flowpath has a plate bank having a plurality of plates, each plate having: a first face and a second face opposite the first face; a leading edge along the second flowpath and a trailing edge along the second flowpath; a proximal edge having at least one inlet port along the first flowpath and at least one outlet port along the first flowpath; and at least one passageway along the first flowpath. An inlet manifold has at least one inlet port and at least one outlet port. An outlet manifold has at least one outlet port and at least one inlet port. The first flowpath passes from the at least one inlet port of the inlet manifold, through the at least one passageway of each of the plurality of plates, and through the at least one outlet port of the outlet manifold.

A heat exchanger for providing thermal energy transfer between a first flow along a first flowpath and a second flow along a second flowpath has a plate bank having a plurality of plates, each plate having: a first face and a second face opposite the first face; a leading edge along the second flowpath and a trailing edge along the second flowpath; a proximal edge having at least one inlet port along the first flowpath and at least one outlet port along the first flowpath; and at least one passageway along the first flowpath. An inlet manifold has at least one inlet port and at least one outlet port. An outlet manifold has at least one outlet port and at least one inlet port. The first flowpath passes from the at least one inlet port of the inlet manifold, through the at least one passageway of each of the plurality of plates, and through the at least one outlet port of the outlet manifold.

An annular duct including a modular annular heat exchanger for a gas turbine engine is provided, where the modular annular heat exchanger includes a plurality of radial modules in circumferentially adjacent arrangement. Each radial module includes a cooled fluid inlet plenum segment, a plurality of blades, and a cooled fluid outlet plenum segment. The plurality of blades is configured in circumferentially adjacent arrangement and defines an angular space that is conformal between each circumferentially adjacent blade. The cooled fluid inlet plenum segment, the plurality of blades, and the cooled fluid outlet plenum segment are in serial axial flow arrangement and define an internal cooled fluid flowpath and an external cooling fluid flowpath parallel to the internal cooled fluid flowpath. Each radial module further includes an inner annular ring segment and an outer annular ring segment. The inner annular ring segment and the outer annular ring segment define a plurality of blade retainers. The blade retainers define an axial, radial, and circumferential position of the blades, the cooled fluid inlet plenum segment, and the cooled fluid outlet plenum segment.

A thermal management system for an electric component has a housing for the electric component and a heat exchange plate extending over the surface of the lateral face of the housing. The plate has a fluid channel between a fluid inlet and a fluid outlet, a supply duct to supply the plate with fluid and a discharge duct, a casing defining the housing(s) and receiving the heat exchange plate and the supply and discharge ducts. The system includes a fluid collecting box arranged to collect fluid from a possible fluid leakage at the junction between the fluid inlet and the fluid outlet of the plate and the associated supply and discharge ducts, so as to prevent said leaked fluid from dripping into a bottom of the casing.

A heat exchange conduit includes a body having a first portion including a first flow channel and a second portion including a second flow channel. A cross-section of the heat exchange conduit varies over a length of the heat exchange conduit.

A radiator core includes a head tube and a tube module mounted on the head tube. The head tube is provided with multiple tube slots having multiple first sides and multiple second sides. The tube module includes multiple first tubes and multiple second tubes mounted in the tube slots. Each of the first tubes is provided with a first connecting portion having an increased thickness and resting on one of the first sides of the tube slots. Each of the second tubes is provided with a second connecting portion having an increased thickness and resting on one of the second sides of the tube slots.

A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.

A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.

A layer for a heat exchanger includes: an inlet; an outlet; an upper sheet; a lower sheet; a fluid flowpath defined between the upper sheet and lower sheet and from the inlet to the outlet; and at least one pin disposed in the flowpath and connecting the upper sheet to the lower sheet; wherein the lower sheet has a first undulating profile. The upper sheet has a second undulating profile different from the first undulating profile. Also disclosed is a heat exchanger including the layer, and a method of making a layer for a heat exchanger.