Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

A heat exchanger comprises a stack of sets of fins and tubes attached to or encompassed by embossed plates comprising a void. In some embodiments, the fins overlap the void having a peripheral margin of the fin attached to the peripheral margin around the void. In some embodiments, the fins comprise through fluid apertures allowing lateral fluid flow. In some embodiments, the plates comprise lateral peripheral protrusions enabling selective sealing of gaps between adjacent stacked plates by unselective application of heat or adhesive to a face of the heat exchanger. In some embodiments, the plates comprise uniformizing protrusions in a fluid inlet and/or outlet zone that reduce the amount of non-uniform fluid mass flow between different channel protrusions of heat exchanging zones of the set. Also disclosed are methods for assembly and selective sealing of the heat exchanger and an apparatus comprising the same.

A device for heat recovery from service water, including at least one, in particular integrally materially bonded, heat-exchanger tube and a body having a substantially surface-like/laminar, in particular plate-like, region, wherein the at least one heat-exchanger tube, in particular made of copper or stainless steel, is oriented along a plane that is not orthogonal to, in particular is parallel to, the main plane of extension of the region.

Planar element adapted to form, when stacked with a plurality of other such elements, a heat exchanger, comprising an inlet region, a first zone adapted to direct flow from the inlet region towards a second zone, a second zone comprising at least one cutout in the plane of the planar element, adapted to accommodate a cooling core, a third zone, adapted to direct flow from the second zone towards an outlet region and an outlet region, the planar element comprising a first blockage protrusion disposed along a first group of said side edges, the first group comprising at least a side edge adjacent to said outlet region, and a second blockage protrusion disposed along a second group of said side edges, the second group comprising at least a side edge adjacent to said inlet region.

Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

A vehicular heat management system includes a heat pump cycle capable of heating a heat-exchanging-object fluid by using exhaust heat of an in-vehicle device as a heat source that radiates heat during operation, and an exhaust-heat refrigerant circuit that releases the exhaust heat to outside air through an exhaust-heat refrigerant. The heat pump cycle includes a recovery heat exchange portion that performs heat exchange between a heated air heated by the exhaust heat and a cycle refrigerant circulating in the heat pump cycle. The exhaust-heat refrigerant circuit includes an exhaust-heat exchange portion that performs heat exchange between the heated air and the exhaust-heat refrigerant. The recovery heat exchange portion and the exhaust-heat exchange portion are integrally formed as a combined heat exchanger capable of transferring heat between the cycle refrigerant and the exhaust-heat refrigerant.

A device for energy transfer and for energy storage in a liquid reservoir has a water heat exchanger arranged on a bottom and has an air heat exchanger arranged above the water heat exchanger, wherein the water heat exchanger is arranged in a liquid reservoir that is surrounded by an inner shell which delimits the device with respect to an outer shell covering the inner shell from the bottom, wherein the outer shell is at least partially inserted into an earth layer, and the device is closed upwardly by a lid in such a way as to make it possible to generate a flow of air from an air inlet to an air outlet of the air heat exchanger.

An air conditioning system includes a first system and a second system. The first system includes a compressor, a first heat exchanger, a second heat exchanger, an electronic control assembly, and a first throttle. The second system includes a first heat exchange assembly and a heat exchange member. The first heat exchange assembly includes a first channel and a second channel isolated from each other. A second communication port of the first channel is in communication with a second opening of the compressor or a second opening of the second heat exchanger. A first communication port of the heat exchange member is in communication with a first communication port of the second channel A second communication port of the heat exchange member is in communication with a second communication port of the second channel. The heat exchange member includes a heat dissipation surface in contact with the electronic control assembly.

Apparatus, systems, and methods for a modular heating unit that may be adapted to be inline with a pipeline. The unit includes a base member having a main inlet pipe, a header, and pipes connecting the main inlet pipe with the header. A combustion chamber is positioned within the pipes. One or more heat exchangers are connected to the header. The heat exchangers each having a top surface, bottom surface, plurality of fins, inlet ring, inlet port, outlet ring, and outlet port. The modular heating unit includes external inlet and outlet pipes. A first flow path enables fluid to flow from the header into the one or more heat exchangers. An exit flow path connected to the external outlet pipe connects the one or more heat exchangers to an exit port with a portion of the exit flow path being positioned above the one or more heat exchangers.

Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.