F28D2001/0293

HEAT TRANSFER SYSTEMS

A heat transfer system (e.g., a heat pump) can include at least a first fin array and at least a first pump disposed in fluid communication with the first fin array and configured to cause a first fluid to flow through the first fin array. The system can include at least a first heat transfer layer attached to and/or in thermal communication with the first fin array. The first heat transfer layer can define a second fluid flow path therein for a second fluid to flow fluidly isolated from the first fluid. The first heat transfer layer and the first fin array can be configured to cause heat transfer between the first fluid and the second fluid.

HEAT CONDUCTION SHEET AND METHOD OF MANUFACTURING SUCH A SHEET
20230250977 · 2023-08-10 ·

A heat-conducting plate for fixing a pipe section to a holding surface of a heat exchanger, wherein the heat-conducting plate has perforations, in particular for acoustic reasons, wherein the perforations are not distributed uniformly over the entire surface of the heat-conducting plate.

Skin condenser design integrated in the refrigerator back

A refrigerator includes a vacuum insulated cabinet structure having an exterior wrapper with a plurality of exterior walls exposed to ambient conditions. One of the exterior walls includes an outer surface and an inset portion that is inwardly disposed relative to the outer surface of the exterior wall. A skin condenser system is disposed within the inset portion along an outer surface of the inset portion. The skin condenser system includes a coil array defined by a coil disposed in a coil pattern. The skin condenser system further includes a cover assembly covering the coil array and in thermal communication with the coil array to facilitate the dissipation of heat to the ambient surroundings.

SKIN CONDENSER DESIGN INTEGRATED IN THE REFRIGERATOR BACK

A refrigerator includes a vacuum insulated cabinet structure having an exterior wrapper with a plurality of exterior walls exposed to ambient conditions. One of the exterior walls includes an outer surface and an inset portion that is inwardly disposed relative to the outer surface of the exterior wall. A skin condenser system is disposed within the inset portion along an outer surface of the inset portion. The skin condenser system includes a coil array defined by a coil disposed in a coil pattern. The skin condenser system further includes a cover assembly covering the coil array and in thermal communication with the coil array to facilitate the dissipation of heat to the ambient surroundings.