Patent classifications
F28D2021/0029
POROUS SPREADER ASSISTED JET AND SPRAY IMPINGEMENT COOLING SYSTEMS
An impingement cooling system includes a porous heat spreader and a nozzle configured to direct a fluid as a jet and/or as a spray impinging upon the porous heat spreader. The porous heat spreader is made of a thermally-conductive material such as a metal, metal alloy, carbon/graphite, or ceramic, and is in thermal contact with a heat source. The nozzle may be configured to direct the fluid as a jet comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The nozzle may be configured to direct the fluid as a spray comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The cooling system may include one or more nozzles, which may direct the cooling fluid orthogonally or at an oblique angle to an impingement plate.
THERMAL CONDUCTIVE DEVICE AND MANUFACTURING METHOD THEREOF, ELECTRICAL CONNECTOR AND ELECTRONIC DEVICE
A thermal conductive device and thermal conductive device manufacturing method, an electrical connector, and an electronic device. The thermal conductive device comprises first housing, a second housing, a capillary mesh component, and a coolant. The second housing is disposed on the first housing. An airtight and vacuumed accommodating space is provided between the first housing and the second housing. The capillary mesh component is disposed in the accommodating space. The capillary mesh component comprises a plurality of capillary pores. The plurality of capillary pores and the accommodating space form a plurality of interconnected circulation channels. The coolant is filled in the accommodating space. Inside the thermal conductive device, the conventional copper powder sintered configuration is replaced with capillary mesh component, so that the thermal conductive device could be thinned and could present a better thermal conductivity.
Evaporator stacks and electronic assemblies
Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.
ELECTROCALORIC COOLING
A cooling system for electrical and optical devices includes an electrocaloric cooler (EEC). A fluid circuit is in thermal communication with the EEC to dump heat from a working fluid of the fluid circuit into the EEC. The system can include a second EEC, a second fluid circuit in thermal communication with the second EEC to dump heat from a working fluid of the second fluid circuit into the EEC, and a second heat sink in thermal communication with the second fluid circuit to dump heat into the working fluid of the second fluid circuit. The second EEC, second fluid circuit, and second heat sink can be cascaded with the first EEC, first heat sink, and first fluid circuit wherein the second heat sink is in thermal communication with the first EEC to accept heat therefrom.
Method for manufacturing liquid-cooled jacket
A liquid cooling jacket is produced by forming a first butted portion where a step side face of a peripheral wall portion and an outer peripheral side face of a sealing body butt each other and a third butted portion where a step side face of a support pillar portion and a hole wall of the hole portion of the sealing body portion butt each other with a gap, and friction-stirring by inserting a tip side pin and a base side pin of a primary joining rotary tool that is rotating into the sealing body and moving the primary joining rotary tool along the third butted portion with an outer circumferential face of the tip side pin being kept off the step side face while having a second aluminum alloy of the sealing body flow into the gap.
THERMAL MANAGEMENT SYSTEM FOR AN ELECTRIC COMPONENT
A thermal management system for an electric component has a housing for the electric component and a heat exchange plate extending over the surface of the lateral face of the housing. The plate has a fluid channel between a fluid inlet and a fluid outlet, a supply duct to supply the plate with fluid and a discharge duct, a casing defining the housing(s) and receiving the heat exchange plate and the supply and discharge ducts. The system includes a fluid collecting box arranged to collect fluid from a possible fluid leakage at the junction between the fluid inlet and the fluid outlet of the plate and the associated supply and discharge ducts, so as to prevent said leaked fluid from dripping into a bottom of the casing.
Battery Housing For A Vehicle Driven By An Electric Motor
The invention relates to a battery housing (1) for a vehicle driven by an electric motor, which is to be installed in the floor region of a vehicle, having a frame (2), which encloses at least one battery module, and a floor (3), which is connected to the frame (2), The floor (3) takes the form of a sandwich construction and forms hollow chambers (18, 18′), which can be used as temperature-control channels for guiding through a fluid by virtue of end-side openings in adjacent hollow chambers (18, 18′) being connected to one another at their two ends.
HEAT DISSIPATION STRUCTURE ASSEMBLY
A heat dissipation structure assembly includes an elastic limiting member, a paste-type heat dissipation wall, a fitting member, a phase-change metal, and an assembling plate. The elastic limiting member is adapted to be disposed at a periphery of a heat source. The paste-type heat dissipation wall is adapted to be in contact with the periphery of the heat source. The fitting member is in contact with the paste-type heat dissipation wall and engaged with the elastic limiting member. The phase-change metal is adapted to be filled into a region among the fitting member, the paste-type heat dissipation wall, and the heat source. When a temperature of the phase-change metal exceeds a critical temperature, a state of the phase-change metal is changed to a liquid state. The assembling plate is connected to the fitting member, and the assembling plate is in contact with the paste-type heat dissipation wall.
Thermal rotary link
An example apparatus may include a first plate having a first side. A first plurality of fins may be integral with the first side of the first plate and protruding perpendicularly therefrom. The first plurality of fins may be arranged in first concentric circles separated radially by a first distance. The apparatus may also include a second plate having a first side. The second plate may be rotatably coupled to the first plate. A second plurality of fins may be integral with the first side of the second plate and protruding perpendicularly therefrom. The second plurality of fins may be arranged in second concentric circles separated radially by the first distance. Each fin of the second plurality of fins may interpose between adjacent fins of the first plurality of fins to transfer heat between the second plate and the first plate.
Vapor chamber and method of manufacturing vapor chamber
A vapor chamber that includes a housing having a first sheet and a second sheet that oppose each other and that are joined to each other in a peripheral region of the housing; a working liquid enclosed within the housing; and a wick structure on an inside surface of the first sheet or the second sheet. In the vapor chamber, the wick structure includes multiple protruding portions and a grid portion integral with the protruding portions. In addition, surfaces of the protruding portions and a surface of the grid portion opposite the inside surface of the first sheet or the second sheet are positioned on a same flat surface.