An apparatus for thermal interface material detection includes a heat dissipating device stack up that includes a heat dissipating device, a thermal interface material, a heat generating component, and a printed circuit board. The heat dissipating device is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heat dissipating device includes an embedded conductive probe, where a first end of the embedded conductive probe leads to a lower surface of the body of the heat dissipating device and a second end of the embedded conductive probe leads to an upper surface of the body of the heat dissipating device.

Cooling device (15) for cooling semiconductor switching elements (10, 11), comprising a first wall (17) having a first side (18) for carrying the semiconductor switching elements (10, 11) and having a second side (19) being opposite the first side (18), a second wall (20) having a first side (21) that forms a main cooling channel (22) together with the second side (19) of the first wall (17) and having a second side (25) being opposite to the first side (21) of the second wall (20), and a third wall (23) that forms an auxiliary cooling channel (24) together with the second side (25) of the second wall (20), wherein the second wall (20) comprises a connection means (26) that connects the auxiliary cooling channel (24) with the main cooling channel (22) in a fluid-conductive manner.

A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.

A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

A thermal management system for a test-and-measurement probe that includes a thermally insulated shroud and a fluid inlet conduit. The shroud is configured to enclose a first portion of a probe head of the probe within an interior cavity of the shroud, while permitting a second portion of the probe head to extend out of the shroud. The shroud further includes a fluid outlet passageway configured to permit a heat-transfer fluid to pass from a probe-head end of the interior cavity, through the interior cavity of the shroud, and out of the shroud through an access portion of the shroud. The fluid inlet conduit enters the shroud through the access portion of the shroud, extends through the interior cavity of the shroud, and is configured to introduce the heat-transfer fluid to the probe-head end of the interior cavity.

A heatsink is used with a fluid flow generator that rotates about a central axis extending vertically. The heatsink includes a main body section having a top surface facing the fluid flow generator in a vertical direction, and fins that extend upward from the top surface so as to define a plurality of flow passages. The plurality of flow passages form a plurality of fluid paths, each of which has an inlet for the fluid discharged from the fluid flow generator to flow in, and an outlet for discharging to outside the fluid that has entered through the inlet. At least one of the plurality of fluid paths has a first branch section for branching from a first fluid path on downstream of the inlet, and a first joining section for joining a second fluid path having another inlet, on downstream of the first branch section.

A two-phase immersion cooling device includes an upper box body, a lower box body, a plurality of heating elements, and a condenser. The walls of the upper box body form a first cavity. The lower box body defines a second cavity containing coolant. The heating elements are disposed in the second cavity and immersing in the coolant. The condenser in the upper box body includes multiple rows and columns of condensing tubes, is arranged across or along the upper box body to fill the first cavity. The lower box body is detachably and hermetically connected to the bottom of the upper box body, connecting the second cavity with the first cavity to form an accommodating cavity.

A thermosiphon device includes an evaporator section, a condenser section and a liquid path configured to deliver liquid that exits the evaporator section directly back to the evaporator inlet. The condenser section has a significantly reduced mass flow rate and lower pressure drop as compared to the evaporator section, which has an increase liquid fraction of working fluid.

Devices and methods are provided herein useful to thermal management. In some embodiments, a thermal management device includes a housing with a fixed amount of working fluid disposed therein. The substrate is in thermal communication with the thermal management device such that evaporation of the working fluid controls the temperature of the substrate. Evaporated working fluid exits the housing through one or more vents. The housing further includes a plurality of supports that increase the surface area to volume ratio of the housing. The high surface area to volume ratio of the housing increases the rate of heat transfer and also minimizes or otherwise reduces the size and weight of the thermal management device. The supports may further serve to mechanically support the substrate, enabling the housing to act as a combined thermal and mechanical device.

A liquid cooling jacket includes a refrigerant flow path which is a flow path having a width in a second direction and in which a heat dissipation assembly is located on a first side in a third direction, where a direction in which a refrigerant flows is defined as a first direction. The refrigerant flow path includes a narrow flow path portion. A width in the third direction of the narrow flow path portion is smaller than a width in the third direction of a flow path on a first side in the first direction with respect to the narrow flow path portion and a width in the third direction of a flow path on a second side in the first direction with respect to the narrow flow path portion.