A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.

A liquid-cooling heat dissipation device and a liquid-cooling heat dissipation system for improving heat transfer efficiency are disclosed. The liquid-cooling heat dissipation device includes a vapor chamber, a liquid-separating cover, and a housing. The housing has a cold liquid inlet and a hot liquid outlet. An accommodating cavity is formed between the vapor chamber and the housing. By providing the vapor chamber, the heat transfer efficiency of the liquid-cooling heat dissipation device is improved greatly to realize rapid heat dissipation.

A fuselage heat exchanger having channels for dissipating waste heat generated by fuel cells that power unmanned aerial vehicles (UAVs) or drones. A heat exchanger built into the fuselage can dissipate such waste heat. Coolant flowing through channels embedded within an aircraft fuselage panel dissipates heat to airflow around the outer surface of the fuselage.

A heat exchange system for heat dissipation of an electronic control assembly includes: a first heat exchange portion including a first end having a first communication port and a second end having a second communication port; a second heat exchange portion including a first end having a third communication port and a second end having a fourth communication port, and at least a part of the second heat exchange portion being configured to be in contact with the electronic control assembly; a first connection tube communicating the first communication port with the third communication port; and a second connection tube communicating the second communication port with the fourth communication port. The first and second heat exchange portions and the first and second connection tubes constitute a loop, the loop has an opening, and the opening is closed when the heat exchange system is in an operative state.

Cooling arrangement and method for cooling of a heat source. The cooling arrangement comprises a closed loop, a semi-open loop and at least one fan. The closed loop comprises a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream said primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop comprises a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.

A heat dissipating device includes a thermosyphon, a first liquid cooling tube and a first heat dissipating fin set. The thermosyphon has an evaporation portion and a condensation portion. The first liquid cooling tube is sleeved on the condensation portion. The first heat dissipating fin set is sleeved on the first liquid cooling tube.

A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.

The present invention is related to cooling systems for electronic devices used in downhole operations. In this scenario, the present invention provides a downhole electronic device cooling system comprising a first heat exchanger element (1) internal to a heat exchanger vessel (3), and a second heat exchanger element (2) associated with the electronic device (4), wherein the first (1) and second (2) heat exchanger elements are in fluid communication by a cooling fluid, wherein the heat exchanger vessel (3) allows the circulation of a secondary cooling fluid,

Proposed is a heat dissipating device using turbulent flow. In the heat dissipating device, a plurality of block flow paths (12) are formed in parallel inside a block body (10), a first cap (16) and a second cap (28) are mounted on side surfaces (15) of the respective ends of the block body (10) so as to connect the block flow paths (12), a working fluid flows into the block flow paths (12), and the working fluid which has passed through the block flow paths (12) is transferred to the outside. Turbulence generators (38) are mounted inside the block flow paths (12), and finishing end portions (40) on the respective ends of the turbulence generators (38) are supported by the first cap (16) and the second cap (28) and are positioned inside the block flow paths (12).

Heat transfer devices are based on using one or more ionic pumps to circulate a dielectric working fluid around a closed circulation path, which may be contained in a conduit. The working fluid may be a liquid or a gas. The ionic pumps are disposed along the closed circulation path. The pumps include an emitter and collector. When a voltage is applied to the emitter, the working fluid is ionized at the emitter. The ionized fluid is drawn electrostatically to the lower-voltage collector, which, through collision with molecules that in turn impart their momentum, creates a flow of the working fluid. This approach may be used with either positive or negative corona devices.