Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.

A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

An eddy fluid heat exchange device comprises a compound tube assembly mounted with an eddy guiding structure. The compound tube assembly comprises an outer tube mounted with an inner tube. The outer tube and the inner tube have an eddy passage along an axis of the inner tube formed therebetween. The outer tube has a guiding exit at one end of the eddy passage. The eddy guiding structure is mounted at another end of the eddy passage, having a guiding entrance. Entering from the guiding entrance, high pressure fluid forms eddies surrounding the inner tube when flowing through the eddy guiding structure. A flowing path of the high pressure fluid in the eddy passage extends, simplifying structures and lowering costs of production and maintenance. Besides, increasing a heat transfer area between the high pressure fluid and the outer tube or the inner tube improves the heat transfer efficiency.

Embodiments of the present invention disclose a heat exchanger and an air-conditioning system. The heat exchanger comprises heat exchange tubes. The heat exchange tubes comprise first heat exchange tubes configured to form a first circuit, and second heat exchange tubes configured to form a second circuit. With the heat exchanger and the air-conditioning system according to the embodiments of the present invention, for example, a heat exchange capacity of the heat exchanger in a part load condition is improved.

A heat exchanger includes a first manifold, aa second manifold, at least one heat exchange tube segment extending between and fluidly coupling the first manifold and the second manifold, and a fin having a non-linear configuration. A portion of the fin is affixed to an adjacent surface of the at least one heat exchange tube segment via a braze joint. The braze joint has a length, measured parallel to a length of the at least one heat exchange tube segment, less than or equal to 650 micrometers.

The invention relates to a heat exchanger (10) of an adsorption machine, comprising—at least two heat transport pipes (15) and/or heat transport pipe sections, which are arranged at a distance (A) with respect to one another in such a way as to form at least one interspace, which is designed as a steam flow duct (18), —and pipe attachments (20) connected to the heat transport pipes (15) and/or heat transport pipe sections. According to the invention, the pipe attachments (20) are arranged in the interspace and designed as a substrate for a directly applied, binder-free active material coating (25), wherein the heat transfer grid (50) consisting of the coated pipe attachments (20) together with the heat transport pipes (15) and/or heat transport pipe sections has a steam-side outer surface of 500-3600 m.sup.2/m.sup.3.

The invention relates to a heat exchanger (10) of an adsorption machine, comprising—at least two heat transport pipes (15) and/or heat transport pipe sections, which are arranged at a distance (A) with respect to one another in such a way as to form at least one interspace, which is designed as a steam flow duct (18), —and pipe attachments (20) connected to the heat transport pipes (15) and/or heat transport pipe sections. According to the invention, the pipe attachments (20) are arranged in the interspace and designed as a substrate for a directly applied, binder-free active material coating (25), wherein the heat transfer grid (50) consisting of the coated pipe attachments (20) together with the heat transport pipes (15) and/or heat transport pipe sections has a steam-side outer surface of 500-3600 m.sup.2/m.sup.3.

A method and apparatus for manufacturing a brazed heat exchanger. The method includes the steps of: assembling the heat exchanger components to form at least one unbrazed heat exchanger core in a core builder machine; without removing the at least one heat exchanger core from the core builder machine, enclosing the heat exchanger core with a brazing tool arrangement adapted to form a chamber, optionally, evacuating the chamber and/or filling the chamber with a controlled atmosphere; brazing the heat exchanger core in the chamber to form a brazed heat exchanger.

A method and apparatus for manufacturing a brazed heat exchanger. The method includes the steps of: assembling the heat exchanger components to form at least one unbrazed heat exchanger core in a core builder machine; without removing the at least one heat exchanger core from the core builder machine, enclosing the heat exchanger core with a brazing tool arrangement adapted to form a chamber, optionally, evacuating the chamber and/or filling the chamber with a controlled atmosphere; brazing the heat exchanger core in the chamber to form a brazed heat exchanger.