A heat conduction device with an inner loop includes a vapor chamber having at least one hole edge and a heat pipe having an outer pipe and an inner pipe. The outer pipe has a closed end and an open end communicating with the hole edge. Two ends of the inner pipe are open. The inner pipe has one end communicating with the vapor chamber through the hole edge and the other end extended along the axial direction of the outer pipe to form at least one port for communicating the closed end of the outer pipe with the inner pipe. The inner pipe is located inside the outer pipe to form a gap annularly. The port communicates with the gap, so that the inner loop is formed between the vapor chamber and the heat pipe.

A heat conduction device with an inner loop includes a vapor chamber having at least one hole edge and a heat pipe having an outer pipe and an inner pipe. The outer pipe has a closed end and an open end communicating with the hole edge. Two ends of the inner pipe are open. The inner pipe has one end communicating with the vapor chamber through the hole edge and the other end extended along the axial direction of the outer pipe to form at least one port for communicating the closed end of the outer pipe with the inner pipe. The inner pipe is located inside the outer pipe to form a gap annularly. The port communicates with the gap, so that the inner loop is formed between the vapor chamber and the heat pipe.

An apparatus includes an integrated heat exchanger and reactor module. The integrated heat exchanger and reactor module includes a heat exchanger channel, and a reactor channel which is thermally coupled to the heat exchanger channel. The reactor channel includes a layer of catalyst material that is configured to produce hydrogen by endothermic catalytic decomposition of ammonia, which flows through the reactor channel, using thermal energy that is absorbed by the reactor channel from the heat exchanger channel.

An apparatus includes an integrated heat exchanger and reactor module. The integrated heat exchanger and reactor module includes a heat exchanger channel, and a reactor channel which is thermally coupled to the heat exchanger channel. The reactor channel includes a layer of catalyst material that is configured to produce hydrogen by endothermic catalytic decomposition of ammonia, which flows through the reactor channel, using thermal energy that is absorbed by the reactor channel from the heat exchanger channel.

The invention relates to a heat exchanger (1) comprising a bundle of tubes (2) arranged parallel to one another and inside of which a first heat transfer fluid is intended to circulate, wherein a second fluid is intended to pass through the bundle of tubes (2) between said tubes (2), said bundle of tubes (2) comprising spacers (6) which are arranged between said tubes (2), said spacers (6) having corrugations (60) extending in the longitudinal direction of the tubes (2), said corrugations (60) having ridges (61) in contact with said tubes (2) and sidewalls (62) connecting said ridges (61), the spacers (6) comprising a first portion (6A) and a second portion (6B), the first portion (6A) being disposed upstream of the second portion (6B) in the direction of passage of the second heat transfer fluid, the first (6A) and second (6B) portions being made from two distinct parts of different shapes.

A heat exchanger includes a conduit of a first aluminum alloy and a plurality of fins in thermally conductive contact with the exterior of the conduit. The fins include a second aluminum alloy comprising from 0.005 wt. % to 0.1 wt. % of at least one alloying element selected from tin, barium, indium, mercury, and gallium.

A heat exchanger includes tubes arranged in one direction, and a corrugated fin provided between the tubes. The corrugated fin includes joints joined to the tubes, and fin bodies that connect the joints which are located next to each other along the wave shape. The fin body includes a cut-raised portion that has a shape in which a part of the fin body is cut and raised for promotion of heat transfer. The cut-raised portion includes a cut-raised end on at least one end of the cut-raised portion in the one direction. The cut-raised end has recesses and projections on its surface that increase hydrophilicity of the surface of the cut-raised end.

An air conditioner including a heat exchanger according to an aspect of the present disclosure, the heat exchanger includes a refrigerant pipe, and a plurality of fins including a first fin and a second fin spaced apart from each other in an extending direction of the refrigerant pipe, wherein the first fin includes a flat portion and a cut-up member protruding in an arrangement direction of the second fin in the flat portion, and the height of the cut-up member in the extension direction is between 0.5 and 0.7 times the distance between the first fin and the second fin.

An eddy fluid heat exchange device comprises a compound tube assembly mounted with an eddy guiding structure. The compound tube assembly comprises an outer tube mounted with an inner tube. The outer tube and the inner tube have an eddy passage along an axis of the inner tube formed therebetween. The outer tube has a guiding exit at one end of the eddy passage. The eddy guiding structure is mounted at another end of the eddy passage, having a guiding entrance. Entering from the guiding entrance, high pressure fluid forms eddies surrounding the inner tube when flowing through the eddy guiding structure. A flowing path of the high pressure fluid in the eddy passage extends, simplifying structures and lowering costs of production and maintenance. Besides, increasing a heat transfer area between the high pressure fluid and the outer tube or the inner tube improves the heat transfer efficiency.

Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.