A heat exchanger including a sealed housing and a body positioned inside the housing, the body including a stack of least one first assembly of first and second plates pressed against each other, between which flows a first fluid, and at least one second assembly of third and fourth plates pressed against each other, between which flows a second fluid, the first and second assemblies being arranged so that they transfer heat between the first and second fluids. This configuration limits the risk of leaks and mixing of the two fluids.

Systems and methods described herein can provide a thermal interface for an electronic device including: obtaining an enclosure and a circuit within the enclosure, wherein the circuit is disposed within the enclosure such that there is space between the circuit and an internal surface of the enclosure; and positioning a thermally conductive material in the space between the circuit and an internal surface of the enclosure such that the thermally conductive material is in physical contact with an outer surface of the circuit and the internal surface of the enclosure to provide heat transfer from the circuit to the enclosure.

An impingement cooling system includes a porous heat spreader and a nozzle configured to direct a fluid as a jet and/or as a spray impinging upon the porous heat spreader. The porous heat spreader is made of a thermally-conductive material such as a metal, metal alloy, carbon/graphite, or ceramic, and is in thermal contact with a heat source. The nozzle may be configured to direct the fluid as a jet comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The nozzle may be configured to direct the fluid as a spray comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The cooling system may include one or more nozzles, which may direct the cooling fluid orthogonally or at an oblique angle to an impingement plate.

Heat transfer devices, components thereof, and related methods are provided. Embodiments include heat transfer devices and/or heat transfer components including a spinodal structure having a bi-continuous topology obtained by modeling a spinodal decomposition process, wherein the spinodal structure having the bi-continuous topology is a spinodal shell structure or a spinodal solid structure. Embodiments include methods of making heat transfer devices and/or heat transfer components using additive manufacturing. Other further embodiments are provided in the present disclosure.

A diode lighting module comprising both a diode matrix mounted on a support plate and heat dissipator means for dissipating the heat given off by the diode matrix, includes a metal plate having an outside face in contact with the support plate and an inside face supporting a cellular metal foam including a plurality of calibrated holes passing through each cell in two perpendicular directions, and a vessel-forming box filled with the cellular metal foam and for which the metal plate constitutes a lid. The box has inlet and outlet orifices passing through the box to receive a cooling liquid, and a separator defining two separate cooling fluid flow zones in the cellular metal foam, a cooling fluid feed zone and a cooling fluid discharge zone, with passage from one of the zones to the other taking place through a cutout in the separator.

A cooling system for electrical and optical devices includes an electrocaloric cooler (EEC). A fluid circuit is in thermal communication with the EEC to dump heat from a working fluid of the fluid circuit into the EEC. The system can include a second EEC, a second fluid circuit in thermal communication with the second EEC to dump heat from a working fluid of the second fluid circuit into the EEC, and a second heat sink in thermal communication with the second fluid circuit to dump heat into the working fluid of the second fluid circuit. The second EEC, second fluid circuit, and second heat sink can be cascaded with the first EEC, first heat sink, and first fluid circuit wherein the second heat sink is in thermal communication with the first EEC to accept heat therefrom.

A heat exchanger incorporates a metal hydride heat exchanger and mitigates the fluid mixing process, and thus greatly improves the heat transfer efficiency and heat recovery processes. The metal hydride heat exchanger has a container for the metal hydride that has a large aspect ratio. A plurality of high aspect container for the metal hydride may be coupled with a manifold.

Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

A constant density heat exchanger and system for energy conversion is provided. The constant density heat exchanger includes a housing extending between a first end and a second end and defining a chamber having an inlet and an outlet. A first flow control device is positioned at the inlet of the chamber and movable between an open position in which a working fluid is permitted into the chamber and a closed position in which the working fluid is prevented from entering the chamber. A second flow control device is positioned at the outlet of the chamber and movable between an open position in which the working fluid is permitted to exit the chamber and a closed position in which the working fluid is prevented from exiting the chamber. A heat exchange fluid imparts thermal energy to the volume of working fluid as the first flow control device and the second flow control device hold the volume of working fluid at constant density within the chamber.

The present invention relates to an improved thermal management system for a heat source, such as a high-powered electronic device. Thermal management systems work to maintain the optimal operational temperature of a device to maximise reliability, operational lifespan and/or efficiency, for example by using a fluid coolant to transfer thermal energy from the device to a heat exchanger. The present invention seeks to provide an improved thermal management system by incorporating a phase change material into a heat exchanger.