Systems and methods described herein can provide a thermal interface for an electronic device including: obtaining an enclosure and a circuit within the enclosure, wherein the circuit is disposed within the enclosure such that there is space between the circuit and an internal surface of the enclosure; and positioning a thermally conductive material in the space between the circuit and an internal surface of the enclosure such that the thermally conductive material is in physical contact with an outer surface of the circuit and the internal surface of the enclosure to provide heat transfer from the circuit to the enclosure.

An apparatus is provided which comprises: a die comprising an integrated circuit, a first material layer comprising a first metal, the first material layer on a surface of the die, and extending at least between opposite lateral sides of the die, a second material layer comprising a second metal over the first material layer, and a third material layer comprising silver particles and having a porosity greater than that of the second material layer, the third material layer between the first material layer and the second material layer. Other embodiments are also disclosed and claimed.

Systems and methods for passive radiative cooling via structures attached to vertical (e.g. walls of buildings) or horizontal surfaces (e.g. roofs) with limited view of the sky by specifically radiating heat in the long-wavelength infrared window of the atmosphere, and designs for doing so are provided.

Thermal control systems that include variable conductivity metamaterial units are provided. The metamaterial unit a plurality of thermally conductive plates, a plurality of first bonds, each of which connects two adjoining thermally conductive plates, and a plurality of second bonds, each of which connects two adjoining thermally conductive plates. Also included is a load inducer constructed to cause the plurality of thermally conductive plates to move between a non-contact state, in which opposing surfaces of the plurality of thermally conductive plates are not in direct contact, to a contact state, in which the opposing surfaces of the plurality of thermally conductive are in at least partial direct contact, so as to change a thermal conductivity of the metamaterial unit from a first value to a second value. Through the ability to design the effective thermal conductivity as a function of temperature a passive thermal control capability is achieved by the introduction of thermal stability regions that will passively ensure thermal stability.

A heat conduction device includes a heat source portion, a temperature control surface, and heat transfer portions. The heat source portion is configured to generate at least hot heat or cold heat. The temperature control surface is sectioned into a plurality of temperature control sections, and at least some of the plurality of temperature control sections are disposed away from the heat source portion. The plurality of heat transfer portions connect the heat source portion and the plurality of the temperature control sections to transfer heat between the heat source portion and the plurality of temperature control sections. The plurality of temperature control sections are separated from each other based on a distance from the heat source portion.

Wire coils are distributed over the bottom surface of an inner chamber of a vapor chamber. The working fluid of the vapor chamber comprises ferromagnetic particles that are attracted to a wire coil as current passes through the wire coil. The resulting increase in the volumetric concentration of ferromagnetic particles in the vicinity of the activated wire coil increases the capacity of the working fluid to remove heat from an integrated circuit component attached to the vapor chamber in the region of the activated wire coil. The vapor chamber wire coils can be activated based on performance metrics associated with the processor units of an integrated circuit component, thereby allowing for the thermal resistance of the working fluid to be dynamically adjusted based on the workload executing on the integrated circuit component and power consumption transients.

The present technology provides a non-cylindrical structure for transporting media, including gases, liquids, solids, or energy comprising a layer of thermal pyrolytic graphite (TPG) surrounded by an outer layer and an inner layer comprising a metal, a ceramic, a glass, or a plastic. In particular, the present technology relates to a non-cylindrical tube or a pipe having an inner layer, an outer layer, and a layer of TPG between the inner layer and the outer layer wherein the TPG layer is configured to manage the direction of heat conduction.

A radiator which rejects heat to its surrounding environment through radiation, comprising layers of thermally conductive material in a tapered geometry. As well, a radiator which incorporates structural support to maintain rigidity in the out-of-plane directions for its thermally conductive layers. The radiator is used by incorporating a source of heat to the layers, having a lower temperature in the surrounding environment, and structurally attaching to an assigned location.

A heat dissipation substrate for increasing solderability is provided. The heat dissipation substrate for increasing solderability includes a heat dissipation layer serving as a base layer, a plating layer formed on the heat dissipation layer, and a protective layer formed on the plating layer. The protective layer is made of one of tin and tin alloy, and the protective layer is capable of being melted in a subsequent process, such that the protective layer is a meltable protective layer.

Method and apparatus for thermally protecting a product, when storing and/or shipping a product, to control temperatures products are exposed to. Embodiments increase the amount of time portions of the product experience a desired temperature range and/or reduce the amount of time portions of the product experience temperatures outside a desired temperature range and/or experience an undesirable temperature range. Embodiments incorporate thermally conductive materials, referred to as conductive equalizers, positioned around and/or near the product positioned inside a packaging container, where the conductive materials conduct heat from locations in the package interior to other locations in the package interior. The conductive equalizers conductively transfer heat from hotter portions of the interior of the container to cooler portions of the interior of the container and/or from portions of the interior desired to be cooled to the cold bank, resulting in a more uniform temperature distribution around the product.