An apparatus for thermal interface material detection includes a heat dissipating device stack up that includes a heat dissipating device, a thermal interface material, a heat generating component, and a printed circuit board. The heat dissipating device is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heat dissipating device includes an embedded conductive probe, where a first end of the embedded conductive probe leads to a lower surface of the body of the heat dissipating device and a second end of the embedded conductive probe leads to an upper surface of the body of the heat dissipating device.

A temperature control body housing includes a monolithic housing middle portion penetrated by one or more than one fluid canal, each fluid canal being completely bounded on four sides by respective walls monolithically connected to outer walls of the housing middle portion; a first housing end cap and a second housing end cap between which the housing middle portion is disposed; wherein the first housing end cap has a first fluid port and either the first housing end cap or the second housing end cap has a second fluid port, and wherein the first fluid port and the second fluid port are fluidly connected to each other by means of the one or more fluid channels.

An electronic device includes a heat-generating electronic component, a heat spreader and a heat sink. The heat spreader has an area at least about 4 times greater than the heat-generating component. A first surface of the heat spreader is in thermal contact with the first surface of the heat-generating component along a first, non-dielectric interface. The heat sink has greater mass than the heat spreader and comprises one or more layers of thermally conductive material. A first surface of the heat sink is in thermal contact with the second surface of the heat spreader along a second interface having greater area than the first interface. Dielectric thermal interface material is provided at the second interface in direct contact with the heat spreader and the heat sink, such that the second interface is dielectric.

Disclosed herein are thermal interface materials (TIMs) including memory foam cores. In an exemplary embodiment, a thermal interface material generally includes a memory foam core including a plurality of sides defining a perimeter. A heat spreader is disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core.

An immersion heat dissipation structure is provided. The immersion heat dissipation structure includes a porous metal heat dissipation material, an integrated heat spreader, and a thermal interface material. The porous metal heat dissipation material has a porosity greater than 8%. The porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween. A connection surface of the porous metal heat dissipation material and a connection surface of the thermal interface material have a sealing layer or a sealing material arranged therebetween.

A refrigeration unit having an evaporator tube, a heater tube in a spaced relationship with the evaporator tube, a wire that couples the evaporator tube to the heater tube, and a bracket having a first panel configured to contact the heater tube and a second panel that defines a recess configured to receive the heater tube therein.

A heat sink according to one embodiment of the present invention includes: a base portion having a first surface and a second surface which oppose each other; at least one heat dissipating fin extending vertically from the first surface, each of the at least one heat dissipating fin having an insertion groove extending from an end portion thereof toward the base portion, and a first fin portion and a second fin portion which are separated by the insertion move; and a connector included in the base portion, the connector being above the insertion groove in plan view, and the connector being configured to electrically connect a first heat generating component to be inserted into the insertion groove from a side of the first surface and a second heat generating component to be disposed on a side of the second surface.

Examples of thermal contact devices and methods are shown. Compliant thermal contact devices are shown that include interleaved conducting structures to provide a high thermal conduction contact area. Selected examples include a thermal interface material located at the interleaved interface between the conducting structures. Selected examples also include designs for alternate chip orientations.

The present invention relates to a U-type piping capable of thermal energy transmission with each other in a radiate arrangement, wherein the piping segments of the U-type fluid piping inlet end and/or outlet end of the U-type piping capable of thermal energy transmission with each other in the radiate arrangement are directly made of thermal insulating materials, or a thermal insulating structure is installed between the inlet end and the outlet end, and a thermal conductive body made of thermal conductive material is further installed thereof, so as to prevent thermal energy loss because of thermal conduction by temperature difference between adjacent piping segments with temperature difference of the inlet end and the outlet end installed on the same side when fluid with temperature difference passing through.

The invention relates to gas analyzers, especially mobile ion mobility spectrometers or mass spectrometers which are operated at atmospheric pressure to detect dangerous substances. The invention uses a fuel cell to generate the electric operating power of the gas analyzer, and the waste heat from the fuel cell is used to regulate the temperature of modules of the gas analyzer.