A composite VC heat sink containing a copper/diamond composite wick structure and a method for preparing the same are provided. The VC heat sink includes a lower shell plate. The lower shell plate is provided with a recess at a center position of an inner surface and provided with a boss with a same plane size as the recess at a center position of an outer surface, and a surface of the boss or a surface of the recess is provided with a copper/diamond composite plate. The copper/diamond composite wick structure has a three-dimensional porous structure and uses a copper/diamond sintered body as a matrix, a surface of the matrix is provided with a diamond layer, and a surface of the diamond layer is provided with a metal hydrophilic layer. The heat dissipation performance of the composite VC heat sink is maximized under the cooperation of structure and materials.

The present invention provides a phase change cold storage device having vortex coiled tubes, which falls within the technical field of low temperatures and comprises an inlet tube, an outlet tube, a tube plate, a baffle plate, vortex coiled tubes, a cylinder body, a central tube, a support frame, a seal head and a saddle, wherein the tube plate is fixedly connected to the cylinder body, a lower end position and a central position of the tube plate are respectively perforated, the inlet tube and the outlet tube are respectively connected to a lower end position and a central position of the tube plate, the baffle plate and the vortex coiled tubes are mounted on the central tube, one end of the central tube is fixed on the tube plate, and the other end is inserted through the support frame connected to the cylinder body, the head is connected to the cylinder, provided on the opposite side of the inlet and outlet tubes, and the saddle is provided below the cylinder. The present invention has a compact structure, is easy to manufacture, and easily enhances heat transfer with vortex coiled tubes, and at the same time, has a good cold storage effect and a wide application range.

The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm.sup.3 and a median particle diameter (D50) of 30 μm or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.

A heat exchanger includes a conduit of a first aluminum alloy and a plurality of fins in thermally conductive contact with the exterior of the conduit. The fins include a second aluminum alloy comprising from 0.005 wt. % to 0.1 wt. % of at least one alloying element selected from tin, barium, indium, mercury, and gallium.

A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, the sheet-shaped container including a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat pipe.

Disclosed herein is a heat exchanger for the recovery of waste heat. The heat exchanger includes: a bottom plate configured such that an exhaust gas inlet is formed therethrough; a top plate configured such that an exhaust gas outlet is formed therethrough at a location opposite that of the exhaust gas inlet; a first side plate configured such that a plurality first side through holes is formed therethrough; a second side plate configured such that a plurality of second side through holes is formed therethrough at locations opposite those of the first side through holes; a third side plate and a fourth side plate configured to connect the first side plate and the second side plate; and a plurality of heat exchange tubes formed as titanium material tubes, and configured to connect parallel between the first side through holes and the second side through holes.

Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.

Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.

A heat storage device including a metal layer containing a protrusion-and-recess-shaped object, in which the protrusion-and-recess-shaped object has an average height of 100 nm or more and 1,000 nm or less.

An apparatus is provided which comprises: a die comprising an integrated circuit, a first material layer comprising a first metal, the first material layer on a surface of the die, and extending at least between opposite lateral sides of the die, a second material layer comprising a second metal over the first material layer, and a third material layer comprising silver particles and having a porosity greater than that of the second material layer, the third material layer between the first material layer and the second material layer. Other embodiments are also disclosed and claimed.