The present invention is directed to a finned heat exchanger comprising an inner annulus, an outer annulus, a plurality of fins, and an outer chamber. The plurality of fins extends radially outward from the outer surface of the inner annulus toward the inner surface of the outer annulus. The outer chamber is located between the inner annulus and the outer annulus. The plurality of fins is located within the outer chamber. A method of heating or cooling a fluid using the finned heat exchanger and a method of forming the finned heat exchanger are also disclosed.

An electronic module includes a semiconductor package including a semiconductor chip and an electrically insulating encapsulation body encapsulating the semiconductor chip, the encapsulation body completely covering a second main face and four side faces of the semiconductor chip, wherein a first main face of the semiconductor chip that is opposite the first main face is exposed from the encapsulation body, a heat spreader attached to the semiconductor package, the heat spreader completely covering the first main face of the semiconductor chip, and an electrically insulating layer disposed on the heat spreader remote from the semiconductor package. The electrically insulating layer is completely separated from the semiconductor chip.

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

A clad material for a cooler is provided by executing production of a tensile strain of 3 to 10% or rolling at a finish rolling ratio of 10 to 25%, and optionally performing a heat treatment for 1 to 8 hours at a temperature within a range from 150 to 400° C., on a clad raw material having a three layer structure of a core material, a first brazing filler metal layer that covers one side (the surface on the side of a cooling water passage) of this core material, and a second brazing filler metal layer that covers the other side (the surface on the opposite side from the cooling water passage). Specific ranges are prescribed for certain properties before and after brazing.

A curable thermal interface material and a cooling device, and a cooling device manufacturing method thereof are provided. The curable thermal interface material includes thermal conductive material and polymeric material, which is formed from the mixture of thermal conductive material and polymeric material. The curable thermal interface material is disposed on the heat sink, so as to properly conduct heat from the heat source to the heat sink to achieve heat dissipation.

Adhesive tapes including a thin metal foil layer are described. The tapes also include a layer or one or more regions of a pressure sensitive adhesive. The tapes exhibit a high thermal conductivity and find application as heat transfer components. Also described are heat spreader assemblies using the adhesive tapes.

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

A Co-based alloy heat exchanger comprises: in mass %, 0.08-0.25% C; 0.1% or less B; 10-30% Cr; 5% or less Fe and 30% or less Ni, the total amount of Fe and Ni being 30% or less; W and/or Mo, the total amount of W and Mo being 5-12%; Ti, Zr, Nb and Ta, the total amount of Ti, Zr, Nb and Ta being 0.5-2%; 0.5% or less Si; 0.5% or less Mn; 0.003-0.04% N; and the balance being Co and impurities. The impurities include 0.5% or less Al, and 0.04% or less O. The heat exchanger is a polycrystalline body of matrix crystal grains with an average size of 5-100 μm. In the matrix crystal grains, segregation cells with an average size of 0.13-2 μm are formed, wherein components constituting an MC type carbide comprising Ti, Zr, Nb and/or Ta are segregated in boundary regions of the segregation cells.

A method for forming a hybrid heat exchanger is provided. The method includes laser-texturing a metal surface to create a plurality of microstructures and subsequently melt-bonding a plastic component to the plurality of microstructures. During melt-bonding, plastic material penetrates the plurality of microstructures and conforms to the plastic component to the metal surface. After hardening inside the microstructures, the plastic component adheres to the metal surface as a hybrid component. As a result, a fastener or snap connection is not required, and the plastic-metal joint provides a barrier to water, glycol-based fluids, air, and other fluids.

A heat storage system has a heat source that generates heat and radiates the heat to a first heat medium and a heat storage body that stores heat. The heat storage body changes to a first phase in a solid state when a temperature of the heat storage body is lower than or equal to a phase transition temperature, and changes to a second phase in a solid state when a temperature of the heat storage body exceeds the phase transition temperature. The heat storage body stores or radiates heat due to a phase transition between the first phase and the second phase. A heat storage mode in which the heat storage body stores heat of the first heat medium and a heat radiation mode in which the heat storage body radiates the heat stored in the heat storage body to a heat transfer target are switchable.